公开(公告)号：US20250046734A1

公开(公告)日：2025-02-06

申请号：US18490014

申请日：2023-10-19

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wei-Hung Lin ,  Chi-Chun Hsieh ,  Ming-Hua Lo ,  Chung-Chih Chen ,  Hsin-Hsien Wu

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065

Abstract: A package includes a first package component; a second package component bonded to the first package component by a first plurality of solder connectors; and a first plurality of spacer connectors extending from the first package component to the second package component. A diameter of a spacer connector the first plurality of spacer connectors is larger than a height of a solder connector of the first plurality of solder connectors, and the first plurality of spacer connectors comprises a different material than the first plurality of solder connectors.

公开(公告)号：US10269669B2

公开(公告)日：2019-04-23

申请号：US15616908

申请日：2017-06-07

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Ying-Shin Han ,  Yen-Miao Lin ,  Chung-Chih Chen ,  Hsien-Liang Meng

IPC: H01L23/10 ,  H01L21/48 ,  H01L23/053 ,  H01L23/00 ,  H01L23/14 ,  H01L23/36 ,  H01L23/367 ,  H01L23/42

Abstract: A semiconductor package includes a substrate, an integrated circuit die, a lid and an adhesive. The integrated circuit die is disposed over the substrate. The lid is disposed over the substrate. The lid includes a cap portion and a foot portion extending from a bottom surface of the cap portion. The cap portion and the foot portion define a recess, and the integrated circuit die is accommodated in the recess. The adhesive includes a sidewall portion and a bottom portion. The sidewall portion contacts a sidewall of the foot portion. The bottom portion extends from the sidewall portion to between a bottom surface of the foot portion and the substrate.

公开(公告)号：US11011487B2

公开(公告)日：2021-05-18

申请号：US16908388

申请日：2020-06-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hao Lin ,  Chien-Kuo Chang ,  Tzu-Kai Lan ,  Chung-Chih Chen ,  Jr-Lin Hsu

IPC: H01L23/00 ,  H01L23/31

Abstract: A semiconductor package is provided, including a package component and a number of conductive connectors. The package component has a number of conductive features on a surface of the package component. The conductive connectors are formed on the conductive features of the package component. The conductive features include a first conductive feature and a second conductive feature contacting a first conductive connector and a second conductive connector, respectively. The size of the first conductive feature is smaller than the size of the second conductive feature, and the height of the first conductive connector on the first conductive feature is greater than the height of the second conductive connector on the second conductive feature.

公开(公告)号：US10700030B2

公开(公告)日：2020-06-30

申请号：US16258888

申请日：2019-01-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hao Lin ,  Chien-Kuo Chang ,  Tzu-Kai Lan ,  Chung-Chih Chen ,  Jr-Lin Hsu

IPC: H01L23/00 ,  H01L23/31

Abstract: A semiconductor package is provided, including a package substrate, a package component, and a number of conductive connectors. The package component has a number of conductive features on a first surface of the package component facing the package substrate. The conductive connectors electrically connect the conductive features of the package component to the package substrate. The conductive features include a first conductive feature and a second conductive feature contacting a first conductive connector and a second conductive connector, respectively. The size of the first conductive feature is smaller than the size of the second conductive feature, and the height of the first conductive connector on the first conductive feature is greater than the height of the second conductive connector on the second conductive feature.