摘要:
There is provided an evaluation object pattern determining apparatus capable of determining local patterns to be evaluated. The apparatus is for use in a pattern evaluating system storing patterns of a LSI chip as CAD data, picking out coordinates of local patterns whose process margin is small from the CAD data by way of simulation and assisting observation of the local patterns produced in a fabrication line. The apparatus includes a risk level map creating section for creating risk level maps in which risk areas are disposed. The risk area is assigned with a risk level obtained by digitizing that the risk area is an area whose process margin is smaller than other areas. The apparatus also includes a superimposition processing section for superimposing the coordinates of the local patterns with the risk level map to pick out the coordinates of the local patterns located within the risk area.
摘要:
There is provided an evaluation object pattern determining apparatus capable of determining local patterns to be evaluated. The apparatus is for use in a pattern evaluating system storing patterns of a LSI chip as CAD data, picking out coordinates of local patterns whose process margin is small from the CAD data by way of simulation and assisting observation of the local patterns produced in a fabrication line. The apparatus includes a risk level map creating section for creating risk level maps in which risk areas are disposed. The risk area is assigned with a risk level obtained by digitizing that the risk area is an area whose process margin is smaller than other areas. The apparatus also includes a superimposition processing section for superimposing the coordinates of the local patterns with the risk level map to pick out the coordinates of the local patterns located within the risk area.
摘要:
The present invention comprises: a design layout data read part that acquires design layout data including location information of design circuit patterns used in steps of semiconductor fabrication; a wafer-chip information read part that acquires, from among data concerning a wafer on which a plurality of the design circuit patterns are formed per chip, wafer-chip information including at least design cell location information; a defect data read part that acquires defect data including location information of defects that occurred in the steps; a design layout data tracing processing part that creates a design layout data defect integrated projection display view by performing, based on the design layout data and the wafer-chip information, an integrated projection process on, among the design layout data, design layout data for a step in which a defect occurred and the defect data; and a defect integrated projection display apparatus that displays the design layout data defect integrated projection display view.
摘要:
A defect image processing apparatus uses a normalized cross correlation to image-match a layout image (52) acquired from a design data with an image acquired by removing, from a defect image (53), the defect area portions thereof, and displays, as a result of that matching, a layout image and defect image (54) on the display device. In the displayed layout image & defect image (54), not only the layout image, the layer of which is the same as that of the defect image (53), but also a layout image of another layer is displayed superimposed on the defect image (53). This makes it easier to analyze the factor of a systematic defect having occurred due to a positional relationship with another layer.
摘要:
A defect image processing apparatus uses a normalized cross correlation to image-match a layout image (52) acquired from a design data with an image acquired by removing, from a defect image (53), the defect area portions thereof, and displays, as a result of that matching, a layout image and defect image (54) on the display device. In the displayed layout image & defect image (54), not only the layout image, the layer of which is the same as that of the defect image (53), but also a layout image of another layer is displayed superimposed on the defect image (53). This makes it easier to analyze the factor of a systematic defect having occurred due to a positional relationship with another layer.
摘要:
The present invention relates to a sound source device, and more particularly, it aims at providing a sound source device, in which a sufficient sound emitting quantity can be attained, capable of obtaining a reproduced sound of musically rich expression. And, in order to attain the aforementioned object, it is possible to solve such a problem that energy density is low and sound emitting efficiency is inferior by employing a pseudo-rectangular wave increasing spectral density as waveform data input in a waveform table (TB). For this, it is rendered a spectrum including spectral lines X1, X2, X3 and X4 in a range matching with a frequency domain (HR) having high sound emitting efficiency and including even harmonics.