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公开(公告)号：US20230317662A1
公开(公告)日：2023-10-05
申请号：US17710348
申请日：2022-03-31
Applicant: Texas Instruments Incorporated
Inventor： Rafael Jose Guevara , Laura May Antionette Dela Paz Clemente , Amin Sijelmassi , Kashyap Mohan
CPC classification number: H01L24/16 , H01L24/11 , H01L24/13 , H01L24/17 , H01L23/3128 , H01L21/565 , H01L23/3135 , H01L23/295 , H01L2924/35 , H01L2924/182 , H01L2224/1601 , H01L2224/16237 , H01L2224/16227 , H01L2224/17135 , H01L2224/11849 , H01L2224/13147 , H01L2224/13553 , H01L2224/1357 , H01L2224/10126 , H01L2224/10145 , H01L2224/11013 , H01L2224/11019 , H01L2924/186
Abstract: An electronic device includes a substrate, a semiconductor die, and a molded package structure that encloses a portion of the semiconductor die and extends to a portion of the substrate. A sensor surface extends along a side of the semiconductor die, and conductive terminals extend outward from the side and have ends soldered to conductive features of the substrate. The side of the semiconductor die is spaced apart from the substrate and the conductive terminals forming a cage structure that laterally surrounds the sensor surface. The molded package structure has a cavity that extends between the sensor surface and the substrate, and the cavity extends in an interior of a cage structure formed by the conductive terminals.
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公开(公告)号：US11864471B2
公开(公告)日：2024-01-02
申请号：US17514820
申请日：2021-10-29
Applicant: Texas Instruments Incorporated
Inventor： Rafael Jose Lizares Guevara , Dok Won Lee , Kashyap Mohan
CPC classification number: H10N52/80 , G01R33/0011 , G01R33/07 , H10N50/85 , H10N52/01 , H10N52/101
Abstract: A described example includes: a semiconductor die including a Hall sensor arranged in a first plane that is parallel to a device side surface of the semiconductor die; a passivated magnetic concentrator including a magnetic alloy layer formed over the device side surface of the semiconductor die, the upper surface of the magnetic alloy layer covered by a layer of polymer material; a backside surface of the semiconductor die opposite the device side surface mounted to a die side surface of a die pad on a package substrate, the semiconductor die having bond pads on the device side surface spaced from the magnetic concentrator; electrical connections coupling the bond pads of the semiconductor die to leads of the package substrate; and mold compound covering the magnetic concentrator, the semiconductor die, the electrical connections, a portion of the leads, and the die side surface of the die pad.
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公开(公告)号：US20230135922A1
公开(公告)日：2023-05-04
申请号：US17514820
申请日：2021-10-29
Applicant: Texas Instruments Incorporated
Inventor： Rafael Jose Lizares Guevara , Dok Won Lee , Kashyap Mohan
Abstract: A described example includes: a semiconductor die including a Hall sensor arranged in a first plane that is parallel to a device side surface of the semiconductor die; a passivated magnetic concentrator including a magnetic alloy layer formed over the device side surface of the semiconductor die, the upper surface of the magnetic alloy layer covered by a layer of polymer material; a backside surface of the semiconductor die opposite the device side surface mounted to a die side surface of a die pad on a package substrate, the semiconductor die having bond pads on the device side surface spaced from the magnetic concentrator; electrical connections coupling the bond pads of the semiconductor die to leads of the package substrate; and mold compound covering the magnetic concentrator, the semiconductor die, the electrical connections, a portion of the leads, and the die side surface of the die pad.
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