公开(公告)号：US20230154771A1

公开(公告)日：2023-05-18

申请号：US17984607

申请日：2022-11-10

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takayuki YAMAGISHI

IPC: H01L21/67

CPC classification number: H01L21/67161 ,  H01L21/6719

Abstract: There is provided a connected processing container comprising: a first processing container and a second processing container arranged side by side in a horizontal direction with a gap therebetween and respectively accommodating a substrate for vacuum processing; a first block portion fixed to the first processing container; a second block portion fixed to the second processing container and arranged side by side in the horizontal direction with respect to the first block portion; and a rail portion to which the first block portion and the second block portion are slidably connected, the rail portion being provided so as to straddle the first processing container and the second processing container.

公开(公告)号：US20240194507A1

公开(公告)日：2024-06-13

申请号：US18585466

申请日：2024-02-23

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi MORIYA ,  Takayuki YAMAGISHI ,  Haruhiko FURUYA ,  Kiyoshi MORI

IPC: H01L21/67 ,  G06N20/00 ,  H01L21/687

CPC classification number: H01L21/67253 ,  G06N20/00 ,  H01L21/67207 ,  H01L21/67259 ,  H01L21/68764

Abstract: The storage is configured to store model data generated based on data including, in patterns, a processing condition for substrate processing, an attitude of a movable part that affects a processing result of the substrate processing, and the processing result of the substrate processing. The processing controller is configured to use the model data stored in the storage to control the substrate processing, including control of the processing condition for the substrate processing and control of the attitude of the movable part, according to a condition to be satisfied by the processing result of the substrate processing.

公开(公告)号：US20230178395A1

公开(公告)日：2023-06-08

申请号：US18071039

申请日：2022-11-29

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takayuki YAMAGISHI ,  Tomohiro ABE

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67196 ,  H01L21/67201 ,  H01L21/67742

Abstract: A system for processing a substrate using a plurality of vacuum processing chambers is provided. The system comprises: an atmospheric transfer chamber in an atmospheric atmosphere; a vacuum transfer chamber in a vacuum atmosphere; a plurality of processing modules configured by vertically arranging the vacuum processing chamber and a supplementary device; and a load lock chamber configured to switch an atmosphere therein between the atmospheric atmosphere and the vacuum atmosphere. The vacuum transfer chamber and the load lock chamber are arranged at a height position where a worker can enter thereunder, the load lock chamber and the plurality of vacuum processing chambers are connected to side surfaces of the vacuum transfer chamber, and a space below the vacuum transfer chamber is blocked from outside except for the side surface to which the load lock chamber is connected, and a space below the load lock chamber serves as a maintenance passage.

公开(公告)号：US20220148980A1

公开(公告)日：2022-05-12

申请号：US17594224

申请日：2020-03-25

Applicant: Tokyo Electron Limited

Inventor： Atsushi KUBO ,  Takayuki YAMAGISHI ,  Takayuki KAMAISHI ,  Tetsuya SAITO

IPC: H01L23/00 ,  H01L21/56 ,  C23C16/50 ,  C23C16/52 ,  C23C16/458

Abstract: A film forming apparatus includes: a processing container; a stage arranged inside the processing container and configured to place a substrate thereon, the stage including a plurality of film forming portions configured to form a film on a back surface of the substrate opposite to a surface of the substrate on which an element is formed, with a material gas supplied to the back surface via a supply port having a shape forming at least a portion of a film forming pattern for reducing stress applied to the substrate; and a control device configured to independently control film formations on the back surface by the plurality of film forming portions.

公开(公告)号：US20250046645A1

公开(公告)日：2025-02-06

申请号：US17431995

申请日：2020-02-14

Applicant: Tokyo Electron Limited

Inventor： Tamihiro KOBAYASHI ,  Takayuki YAMAGISHI

IPC: H01L21/687 ,  C23C16/505 ,  C23C16/52 ,  H01L21/67 ,  H01L21/677 ,  H01L21/68

Abstract: A substrate processing apparatus includes stages each placing a substrate thereon, support columns supporting the stages, a common base supporting the support columns, and a position adjustment mechanism provided between the base and each support column. The position adjustment mechanism includes: a fixed member on a side of the base; a position adjustment member disposed above the fixed member and adjusting a position of the stage by positioning a base end portion of the support column; and gap height adjustment parts provided at at least three positions surrounding the support column, and mounting the position adjustment member to the fixed member in a state where a gap height between the fixed member and the position adjustment member is adjustable. At least one position adjustment mechanism is provided with a fixedly mounting part mounting the position adjustment member to the fixed member in a state where the gap height is fixed.

公开(公告)号：US20220213594A1

公开(公告)日：2022-07-07

申请号：US17645829

申请日：2021-12-23

Applicant: Tokyo Electron Limited

Inventor： Takayuki YAMAGISHI

IPC: C23C16/458 ,  H01J37/32 ,  H01L21/677 ,  H01L21/687

Abstract: A process module includes four stages arranged in a two-row and two-column layout inside the process module, wherein a row interval and a column interval that constitute the two-row and two-column layout have different dimensions.

公开(公告)号：US20210366736A1

公开(公告)日：2021-11-25

申请号：US17316312

申请日：2021-05-10

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takayuki YAMAGISHI

IPC: H01L21/67

Abstract: Coupled processing containers include a first processing container and a second processing container provided side by side in a horizontal direction to form a gap therebetween, the first processing container and the second processing container being configured to store substrates, respectively, in order to perform vacuum processing, and a connecting part provided across the gap so as to connect the first processing container and the second processing container to each other, the connecting part being configured to be slidable in the horizontal direction with respect to at least one of the first processing container and the second processing container.

公开(公告)号：US20190385873A1

公开(公告)日：2019-12-19

申请号：US16438781

申请日：2019-06-12

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takayuki YAMAGISHI ,  Tamihiro KOBAYASHI

IPC: H01L21/67 ,  H01L21/677 ,  C23C16/44 ,  C23C16/54 ,  C23C16/455

Abstract: There is provided a vacuum processing apparatus for performing a vacuum process by supplying a processing gas onto a substrate arranged in a processing space kept in a vacuum atmosphere, the apparatus comprising: a first transfer space and a second transfer space in each of which the substrate is transferred; and an intermediate wall portion provided between the first transfer space and the second transfer space along the extension direction, wherein one or more processing spaces are arranged in the first transfer space along the extension direction, and two or more processing spaces are arranged in the second transfer space along the extension direction, and wherein a plurality of exhaust paths and a joined exhaust path where the plurality of exhaust paths are joined are formed in the intermediate wall portion.