Method for manufacturing a semiconductor device
    6.
    发明授权
    Method for manufacturing a semiconductor device 有权
    半导体器件的制造方法

    公开(公告)号:US08338272B2

    公开(公告)日:2012-12-25

    申请号:US12480077

    申请日:2009-06-08

    IPC分类号: H01L21/326

    CPC分类号: H01L21/6831

    摘要: A wafer is mounted on the top surface of the stage having an electrostatic chuck function, and the wafer at 50° C. or more is cooled to a temperature lower than 50° C. In this step, the voltage to be applied to the internal electrode provided in the stage is raised stepwise to gradually increase the contact area between the back surface of the wafer and the top surface of the stage. Finally, a chuck voltage is applied to the internal electrode, so that the entire back surface of the wafer is uniformly attracted to the top surface of the stage. This reduces damage occurring in the top surface of the stage due to rubbing between the back surface of the wafer and the top surface of the stage.

    摘要翻译: 将晶片安装在具有静电卡盘功能的平台的顶表面上,并且将在50℃或更高的晶片冷却至低于50℃的温度。在该步骤中,施加到内部的电压 设置在台架中的电极逐步升高以逐渐增加晶片的背表面和台的顶表面之间的接触面积。 最后,向内部电极施加卡盘电压,使得晶片的整个背面被均匀地吸引到台的顶面。 这减少了由于在晶片的后表面和台的顶表面之间的摩擦而在台的顶表面中发生的损坏。