公开(公告)号：US20240357748A1

公开(公告)日：2024-10-24

申请号：US18317756

申请日：2023-05-15

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Jeng-Ting LI ,  Chi-Hai KUO ,  Cheng-Ta KO ,  Pu-Ju LIN

IPC: H05K3/00 ,  H05K1/03

CPC classification number: H05K3/002 ,  H05K1/0306 ,  H05K2203/107

Abstract: A substrate structure and a cutting method thereof are provided. The cutting method includes the following steps. A first substrate structure is provided, wherein the first substrate structure includes a glass substrate and a redistribution layer disposed on the glass substrate. A laser process is performed on the glass substrate to form a modified region on the glass substrate. A wet etching process is performed on the modified region of the glass substrate to remove the modified region and form a plurality of second substrate structures.

公开(公告)号：US20220068742A1

公开(公告)日：2022-03-03

申请号：US17453489

申请日：2021-11-04

Applicant: Unimicron Technology Corp.

Inventor： Cheng-Hui WU ,  Jeng-Ting LI ,  Ping-Tsung LIN ,  Kai-Ming YANG ,  Pu-Ju LIN ,  Cheng-Ta KO

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L21/56

Abstract: A chip package includes a redistribution layer, a chip, and an encapsulation member. The redistribution layer includes an insulation part, a plurality of first pads and a plurality of second pads, where the insulation part has a first surface, a second surface opposite to the first surface, and a side surface between the first surface and the second surface. The first pads and the second pads are located at the first surface and the second surface respectively. The chip is disposed on the first surface and electrically connected to the first pads. The encapsulation member wraps the chip and the redistribution layer, and covers the first surface and the side surface, where the encapsulation member exposes the second pads, and the encapsulation member is not flush with the first surface and the side surface.

公开(公告)号：US20230402391A1

公开(公告)日：2023-12-14

申请号：US17814527

申请日：2022-07-24

Applicant: Unimicron Technology Corp.

Inventor： Ying-Chu CHEN ,  Jeng-Ting LI ,  Chi-Hai KUO ,  Cheng-Ta KO ,  Pu-Ju LIN

IPC: H01L23/538 ,  H01L23/29 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/5385 ,  H01L23/5383 ,  H01L23/293 ,  H01L21/4857 ,  H01L21/56

Abstract: A manufacturing method of a package structure includes: forming a redistribution layer on a top surface of a glass substrate; forming a protective layer on the top surface of the glass substrate; cutting the glass substrate and the protective layer such that the glass substrate has a cutting edge, in which a crack is formed in the cutting edge of the glass substrate; and heating the protective layer such that a portion of the protective layer flows towards a bottom surface of the glass substrate to cover the cutting edge of the glass substrate and fill the crack in the cutting edge of the glass substrate.

公开(公告)号：US20230231087A1

公开(公告)日：2023-07-20

申请号：US17653659

申请日：2022-03-07

Applicant: Unimicron Technology Corp.

Inventor： Hao-Wei TSENG ,  Chi-Hai KUO ,  Jeng-Ting LI ,  Ying-Chu CHEN ,  Pu-Ju LIN ,  Cheng-Ta KO

IPC: H01L33/54 ,  H01L25/075 ,  H01L23/00

CPC classification number: H01L33/54 ,  H01L25/0753 ,  H01L24/83 ,  H01L2933/005 ,  H01L24/29 ,  H01L2224/29194 ,  H01L2224/83099 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2224/8389 ,  H01L2224/83856 ,  H01L24/32 ,  H01L2224/32227 ,  H01L2924/12041

Abstract: A package structure includes a substrate, a plurality of conductive pads, a light-emitting diode, a photo imageable dielectric material, and a black matrix. The substrate includes a top surface. The conductive pads are located on the top surface of the substrate. The light-emitting diode is located on the conductive pads. The photo imageable dielectric material is located between the light-emitting diode and the top surface of the substrate and between the conductive pads. An orthogonal projection of the light-emitting diode on the substrate is overlapped with an orthogonal projection of the photo imageable dielectric material on the substrate. The black matrix is located on the top surface of the substrate and the conductive pads.