公开(公告)号：US11644427B2

公开(公告)日：2023-05-09

申请号：US17100982

申请日：2020-11-23

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chia-Feng Hsiao ,  Chung-Hsuan Wu ,  Shuo-Yu Chen ,  Nai-Ying Lo ,  Yi-Hui Tseng ,  Chen-Hui Huang ,  Yung-Yu Yang ,  Tzu-Ping Kao

IPC: G06K9/00 ,  G01N21/95 ,  H01L21/66 ,  G01N21/956 ,  G06T7/00 ,  G06T7/13 ,  G06V10/30 ,  G06V10/28 ,  G06V10/26 ,  G01N21/88 ,  G06T5/50 ,  G06V10/22

CPC classification number: G01N21/9503 ,  G01N21/8851 ,  G01N21/95607 ,  G06T5/50 ,  G06T7/001 ,  G06T7/0004 ,  G06T7/13 ,  G06V10/22 ,  G06V10/26 ,  G06V10/28 ,  G06V10/30 ,  H01L22/24 ,  G06T2207/20212 ,  G06T2207/20221 ,  G06T2207/30148

Abstract: An automatic detection method and an automatic detection system for detecting any crack on wafer edges are provided. The automatic detection method includes the following steps. Several wafer images of several wafers are obtained. The wafer images are integrated to create a templet image. Each of the wafer images is compared with the templet image to obtain a differential image. Each of the differential images is binarized. Each of the differential images which are binarized is de-noised. Whether each of the differential images has an edge crack is detected according to pattern of each of the differential images which are de-noised.

公开(公告)号：US11151724B2

公开(公告)日：2021-10-19

申请号：US16429772

申请日：2019-06-03

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Tzu-Ping Kao ,  Ching-Hsing Hsieh ,  Chia-Chi Chang ,  Ju-Te Chen ,  Chen-Hui Huang ,  Cheng-Hsien Chen

IPC: G06T7/13 ,  G06T7/00 ,  G06T7/60

Abstract: An automatic detecting method and an automatic detecting apparatus using the same are provided. The automatic detecting apparatus includes an inputting unit, a dividing unit, a contouring unit, a range analyzing unit, a boundary analyzing unit, an edge detecting unit, an expanding unit and an overlapping unit. The dividing unit is used for dividing an overlooking image into four clusters via a clustering algorithm. The contouring unit is used for obtaining a contour. The range analyzing unit is used for obtaining a detecting range. The boundary analyzing unit is used for obtaining a circular boundary in the detecting range. The edge detecting unit is used for obtaining a plurality of edges in the circular boundary. The expanding unit is used for expanding the edges to obtain a plurality of expanded edges. The overlapping unit is used for overlapping the expanded edges and the contour to obtain a defect pattern.