OLED lighting device with short tolerant structure

    公开(公告)号:US10164000B2

    公开(公告)日:2018-12-25

    申请号:US15604748

    申请日:2017-05-25

    Abstract: A first device that may include a short tolerant structure, and methods for fabricating embodiments of the first device, are provided. A first device may include a substrate and a plurality of OLED circuit elements disposed on the substrate. Each OLED circuit element may include a fuse that is adapted to open an electrical connection in response to an electrical short in the pixel. Each OLED circuit element may comprise a pixel that may include a first electrode, a second electrode, and an organic electroluminescent (EL) material disposed between the first and the second electrodes. Each of the OLED circuit elements may not be electrically connected in series with any other of the OLED circuit elements.

    MANUFACTURING FLEXIBLE ORGANIC ELECTRONIC DEVICES
    5.
    发明申请
    MANUFACTURING FLEXIBLE ORGANIC ELECTRONIC DEVICES 审中-公开
    制造柔性有机电子器件

    公开(公告)号:US20160133838A1

    公开(公告)日:2016-05-12

    申请号:US14996600

    申请日:2016-01-15

    Abstract: A method of forming microelectronic systems on a flexible substrate includes depositing (typically sequentially) on a first side of the flexible substrate at least one organic thin film layer, at least one electrode and at least one thin film encapsulation layer over the at least one organic thin film layer and the at least one electrode, wherein depositing the at least one organic thin film layer, depositing the at least one electrode and depositing the at least one thin film encapsulation layer each occur under vacuum and wherein no physical contact of the at least one organic thin film layer or the at least one electrode with another solid material occurs prior to depositing the at least one thin film encapsulation layer.

    Abstract translation: 在柔性衬底上形成微电子系统的方法包括在柔性衬底的第一侧上沉积(通常顺序地)至少一个有机薄膜层,至少一个电极和至少一个有机薄膜封装层上的至少一个薄膜封装层 薄膜层和所述至少一个电极,其中沉积所述至少一个有机薄膜层,沉积所述至少一个电极并沉积所述至少一个薄膜封装层,每个都在真空下进行,并且其中至少一个 一个有机薄膜层或至少一个具有另一固体材料的电极在沉积至少一个薄膜封装层之前发生。

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