Touch member and method of manufacturing the same
    1.
    发明授权
    Touch member and method of manufacturing the same 有权
    触摸成员和制造方法相同

    公开(公告)号:US09320143B2

    公开(公告)日:2016-04-19

    申请号:US13845325

    申请日:2013-03-18

    Abstract: A wiring board includes a substrate, a first conductor layer, a second conductor layer, and a through-via conductor. The substrate has a first surface, a second surface, and at least one through-via. The first conductor layer is formed on the first surface, and the second conductor layer is formed on the second surface. The through-via conductor is formed in the through-via for electrically connecting to the first conductor layer and the second conductor layer. The through-via has a first depressed portion exposed in the first surface, a second depressed portion exposed in the second surface, and a tunnel portion between the first depressed portion and the second depressed portion for connecting the first depressed portion and the second depressed portion. The first depressed portion and the second depressed, portion are non-coaxial.

    Abstract translation: 布线基板包括基板,第一导体层,第二导体层和通孔导体。 衬底具有第一表面,第二表面和至少一个通孔。 第一导体层形成在第一表面上,第二导体层形成在第二表面上。 通孔导体形成在用于电连接到第一导体层和第二导体层的通孔中。 通孔具有暴露在第一表面中的第一凹陷部分,暴露在第二表面中的第二凹部,以及在第一凹陷部分和第二凹陷部分之间的用于连接第一凹陷部分和第二凹陷部分的隧道部分 。 第一凹陷部分和第二凹陷部分是非同轴的。

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