公开(公告)号：US20210273356A1

公开(公告)日：2021-09-02

申请号：US17322906

申请日：2021-05-18

Applicant: Unimicron Technology Corp.

Inventor： Tzyy-Jang TSENG ,  Pei-Wei WANG ,  Ching-Ho HSIEH ,  Shao-Chien LEE ,  Kuo-Wei LI

IPC: H01R12/62 ,  H05K1/02 ,  H05K1/14 ,  H05K1/11 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46

Abstract: A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.

公开(公告)号：US20220240368A1

公开(公告)日：2022-07-28

申请号：US17455918

申请日：2021-11-21

Applicant: Unimicron Technology Corp.

Inventor： Pei-Wei WANG ,  Heng-Ming NIEN ,  Ching-Sheng CHEN ,  Yi-Pin LIN ,  Shih-Liang CHENG

IPC: H05K1/02

Abstract: A co-axial structure includes a substrate, a first conductive structure, a second conductive structure, and an insulating layer. The substrate includes a first surface. The first conductive structure includes a first circuit deposited on the first surface and a first via penetrating the substrate. The second conductive structure includes a second circuit deposited on the first surface and a second via penetrating the substrate. The first via and the second via extend along a first direction. The first circuit and the second circuit extend along a second direction, and the second direction is perpendicular to the first direction. The insulating layer is located between the first via and the second via. The insulating layer includes a filler. The first conductive structure and the second conductive structure are electrically insulated. The first circuit and the second circuit are coplanar.

公开(公告)号：US20240023251A1

公开(公告)日：2024-01-18

申请号：US17899467

申请日：2022-08-30

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Shao-Chien LEE ,  Ching-Sheng CHEN ,  Heng-Ming NIEN ,  Pei-Wei WANG

IPC: H05K3/46 ,  H05K3/40 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K3/4679 ,  H05K3/4046 ,  H05K1/0298 ,  H05K1/116 ,  H05K2203/016 ,  H05K2203/1131

Abstract: A manufacturing method for circuit board structure includes steps of providing a carrier, forming a first build-up layer including a plurality of first circuits, forming a second build-up layer including a plurality of second circuits on a side of the first build-up layer located away from the carrier, attaching a side of the second build-up layer located away from the first build-up layer to a core layer, and removing the carrier from the first build-up layer, where the first circuits are finer than the second circuits.

公开(公告)号：US20200235272A1

公开(公告)日：2020-07-23

申请号：US16842716

申请日：2020-04-07

Applicant: Unimicron Technology Corp.

Inventor： Pei-Wei WANG ,  Cheng-Ta KO ,  Yu-Hua CHEN ,  De-Shiang LIU ,  Tzyy-Jang TSENG

IPC: H01L33/62

Abstract: A manufacturing method of a light emitting device package structure is provided. The method includes following operations: (i) providing a circuit redistribution structure; (ii) providing a first substrate; (iii) forming a circuit layer structure over the first substrate, wherein the circuit layer structure includes a first circuit layer; (iv) before or after operation (iii), placing a light emitting device between the first substrate and the circuit layer structure or over the circuit layer structure, wherein the light emitting device is electrically connected with the first circuit layer; and (v) placing the circuit redistribution structure over the light emitting device, wherein the circuit redistribution structure includes a first redistribution layer, a second redistribution layer, and a chip, and the first redistribution layer includes a second circuit layer and a conductive contact that contacts the second circuit layer.

公开(公告)号：US20200006610A1

公开(公告)日：2020-01-02

申请号：US16140563

申请日：2018-09-25

Applicant: Unimicron Technology Corp.

Inventor： Pei-Wei WANG ,  Cheng-Ta KO ,  Yu-Hua CHEN ,  De-Shiang LIU ,  Tzyy-Jang TSENG

IPC: H01L33/62

Abstract: A light emitting device package structure includes a substrate, a circuit layer structure, a light emitting device, a first redistribution layer, a conductive connector, a second redistribution layer, and a chip. The circuit layer structure is disposed over the substrate, and the circuit layer structure includes a first circuit layer. The light emitting device is disposed over the circuit layer structure and is electrically connected with the first circuit layer. The first redistribution layer is disposed over the light emitting device and includes a second circuit layer and a conductive contact contacting the second circuit layer. The conductive connector connects the first circuit layer and the second circuit layer. The second redistribution layer is disposed over the first redistribution layer and includes a third circuit layer contacting the conductive contact. The chip is disposed over the second redistribution layer and is electrically connected with the third circuit layer.