公开(公告)号：US20240217808A1

公开(公告)日：2024-07-04

申请号：US18609571

申请日：2024-03-19

Applicant: Winbond Electronics Corp.

Inventor： Jin-Neng WU

IPC: B81B3/00 ,  B81C3/00

CPC classification number: B81B3/0018 ,  B81C3/001 ,  B81B2201/0214 ,  B81B2201/03 ,  B81B2203/033 ,  B81B2207/09

Abstract: A method for manufacturing package structure is provided, including: providing a substrate having recesses; forming first MEMS chips on the substrate, each with a through-substrate via, and a first sensor or microactuator on the lower surface, located in one of the recesses; forming first intermediate chips on the substrate, each respectively on one of the first MEMS chips, having a through-substrate via, and including a signal conversion unit, a logic operation unit, control unit, or a combination thereof; forming second MEMS chips on the first intermediate chips, each with a through-substrate via, having a second sensor or microactuator on its upper surface, wherein the package structure includes at least one of the first sensor and the second sensor; and forming first capping plates on the second MEMS chips, each providing a receiving space for the second sensor or microactuator on the upper surface of each second MEMS chip.

公开(公告)号：US20250118631A1

公开(公告)日：2025-04-10

申请号：US18424400

申请日：2024-01-26

Applicant: Winbond Electronics Corp.

Inventor： Jin-Neng WU

IPC: H01L23/48 ,  H01L21/768 ,  H01L23/00 ,  H01L23/522 ,  H01L23/532 ,  H01L25/10

Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a BEOL layer, a plurality of first metal structures and a plurality of second metal structures. The substrate has a first side and a second side opposite to the first side. The BEOL layer is disposed on the first side of the substrate. The first metal structures penetrate the substrate. The second metal structures are disposed in the substrate, extending from the second side towards the first side of the substrate, corresponding to the first metal structures.

公开(公告)号：US20240274565A1

公开(公告)日：2024-08-15

申请号：US18168434

申请日：2023-02-13

Applicant: Winbond Electronics Corp.

Inventor： Yu-Cheng CHEN ,  Jin-Neng WU

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/49

CPC classification number: H01L24/19 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3192 ,  H01L23/49 ,  H01L24/20 ,  H01L24/95 ,  H01L23/3185 ,  H01L2224/19 ,  H01L2224/214 ,  H01L2224/95001

Abstract: A method for forming a die package structure, including disposing a plurality of dies on a carrier substrate, wherein the top surface of each die has a plurality of signal junctions. The method also includes forming a vertical wire on each of the signal junctions, forming a supporting dielectric layer on the carrier substrate, wherein the supporting dielectric layer covers the dies and exposes the top of the vertical wires, and forming a plurality of redistribution traces on the supporting dielectric layer, wherein the redistribution traces are electrically connected to each of the vertical wires. The method further includes forming a bump at the bonding site of each of the redistribution traces, and performing a cutting process to singulate the dies.

公开(公告)号：US20220185655A1

公开(公告)日：2022-06-16

申请号：US17550607

申请日：2021-12-14

Applicant: Winbond Electronics Corp.

Inventor： Jin-Neng WU

IPC: B81B3/00 ,  B81C3/00

Abstract: A package structure and its manufacturing method are provided. The package structure includes a substrate with a recess, and a first MEMS chip, a first intermediate chip, a second MEMS chip and a first capping plate sequentially formed on the substrate. The lower surface of the first MEMS chip has a first sensor or a microactuator. The upper surface of the second MEMS chip has a second sensor or a microactuator. The first intermediate chip has a through-substrate via, and includes a signal conversion unit, a logic operation unit, a control unit, or a combination thereof. The package structure includes at least one of the first sensor and the second sensor.