公开(公告)号：US10329368B2

公开(公告)日：2019-06-25

申请号：US15484135

申请日：2017-04-11

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Mao-Feng Hsu ,  Chen-Feng Yen ,  Shou-Jui Hsiang ,  Yen-Chin Hsiao

IPC: C08F220/32 ,  G03F7/029 ,  G03F7/11 ,  H05K1/03 ,  H05K3/46 ,  H05K3/06 ,  C08F2/48 ,  G03F7/027 ,  G03F7/031 ,  H05K3/28

Abstract: A non-reactive photosensitive resin composition storable at room temperature comprises a carboxylic acid-modified bisphenol epoxy (meth)acrylate, a photosensitive monomer, a photosensitive prepolymer, a photo-initiator, and a coloring agent. Each of the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer, and photosensitive prepolymer has a plurality of carbon-carbon double bonds, so that the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer and photosensitive prepolymer may be polymerized to form a dense cross-linking network structure when the photosensitive resin composition is exposed to ultraviolet radiation. A film and a printed circuit board using the photosensitive resin composition are also provided.

公开(公告)号：US10423069B2

公开(公告)日：2019-09-24

申请号：US15691282

申请日：2017-08-30

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Chen-Feng Yen ,  Chang-Hung Lee ,  Yi-Fang Lin ,  Yen-Chin Hsiao ,  Shou-Jui Hsiang ,  Mao-Feng Hsu

IPC: G03F7/029 ,  H05K1/03 ,  C09D139/04 ,  C07D263/12 ,  C07D263/14 ,  C09D133/06 ,  G03F7/031 ,  G03F7/038 ,  G03F7/07 ,  H05K3/28 ,  H05K3/34

Abstract: A non-toxic water soluble photosensitive resin composition able to function as a solder mask coating comprises a polymer containing oxazolinyl, a photosensitive monomer, and a photo-initiator. These elements are all water soluble or water dispersible. The polymer containing oxazolinyl and the photosensitive monomer have a plurality of carbon-carbon double bonds. The polymer containing oxazolinyl and the photosensitive monomer are polymerized to form a dense cross-linking network structure when the water soluble photosensitive resin composition is exposed to ultraviolet radiation. A film using the water soluble photosensitive resin composition is also provided.