公开(公告)号：US10329368B2

公开(公告)日：2019-06-25

申请号：US15484135

申请日：2017-04-11

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Mao-Feng Hsu ,  Chen-Feng Yen ,  Shou-Jui Hsiang ,  Yen-Chin Hsiao

IPC: C08F220/32 ,  G03F7/029 ,  G03F7/11 ,  H05K1/03 ,  H05K3/46 ,  H05K3/06 ,  C08F2/48 ,  G03F7/027 ,  G03F7/031 ,  H05K3/28

Abstract: A non-reactive photosensitive resin composition storable at room temperature comprises a carboxylic acid-modified bisphenol epoxy (meth)acrylate, a photosensitive monomer, a photosensitive prepolymer, a photo-initiator, and a coloring agent. Each of the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer, and photosensitive prepolymer has a plurality of carbon-carbon double bonds, so that the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer and photosensitive prepolymer may be polymerized to form a dense cross-linking network structure when the photosensitive resin composition is exposed to ultraviolet radiation. A film and a printed circuit board using the photosensitive resin composition are also provided.

公开(公告)号：US11672108B2

公开(公告)日：2023-06-06

申请号：US16996705

申请日：2020-08-18

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Sheng-Feng Chung ,  Chi-Fei Huang ,  Chen-Feng Yen

IPC: H05K9/00 ,  B41M3/00 ,  B41M7/00 ,  C09D11/102 ,  C09D11/322 ,  C09D11/36 ,  C09D11/037 ,  C09D11/033 ,  C09D11/52 ,  B05D1/38 ,  B05D1/26 ,  B05D3/06 ,  B05D7/00 ,  B05D1/36

CPC classification number: H05K9/0092 ,  B41M3/006 ,  B41M7/009 ,  B41M7/0081 ,  C09D11/033 ,  C09D11/037 ,  C09D11/102 ,  C09D11/322 ,  C09D11/36 ,  C09D11/52 ,  B05D1/26 ,  B05D1/36 ,  B05D1/38 ,  B05D3/065 ,  B05D3/067 ,  B05D7/52

Abstract: A method for manufacturing an electromagnetic shielding film of reduced thickness and a simplified manufacturing process includes forming a conductive ink layer by inkjet printing, on a component to be shielded, forming an insulative ink layer on the conductive ink layer by inkjet printing, and sintering the conductive ink layer and the insulative ink layer to form an electromagnetic shielding layer and an insulative layer, thereby obtaining the electromagnetic shielding film.

公开(公告)号：US10928730B2

公开(公告)日：2021-02-23

申请号：US16027327

申请日：2018-07-04

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Chen-Feng Yen ,  Shou-Jui Hsiang ,  Pei-Jung Wu ,  Szu-Hsiang Su

IPC: G03F7/038 ,  G03F7/32 ,  C08G18/67 ,  C08F2/50 ,  C08F299/06 ,  G03F7/037

Abstract: A photosensitive resin composition comprises a modified polyimide polymer having a chemical structural formula of: photosensitive monomers, a bisphenol A epoxy resin, a photo-initiator, and a pigment. The modified polyimide polymer is made by a reaction of a polyimide polymer having a chemical structural formula of: and glycidyl methacrylate. The carboxyl group of the polyimide polymer reacts with the epoxy group of glycidyl methacrylate. The polyimide polymer is made by a reaction of dianhydride monomers each having an A group, diamine monomers each having the R group, diamine monomers each having the R1 group, and diamine monomers each having the R2 group. The diamine monomer having R group is a diamine compound having R group bonding with the carboxyl group. The diamine monomer having R1 group is a soft long-chain diamine monomer. R2 group comprises at least one secondary amine group or tertiary amine group.

公开(公告)号：US10423069B2

公开(公告)日：2019-09-24

申请号：US15691282

申请日：2017-08-30

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Chen-Feng Yen ,  Chang-Hung Lee ,  Yi-Fang Lin ,  Yen-Chin Hsiao ,  Shou-Jui Hsiang ,  Mao-Feng Hsu

IPC: G03F7/029 ,  H05K1/03 ,  C09D139/04 ,  C07D263/12 ,  C07D263/14 ,  C09D133/06 ,  G03F7/031 ,  G03F7/038 ,  G03F7/07 ,  H05K3/28 ,  H05K3/34

Abstract: A non-toxic water soluble photosensitive resin composition able to function as a solder mask coating comprises a polymer containing oxazolinyl, a photosensitive monomer, and a photo-initiator. These elements are all water soluble or water dispersible. The polymer containing oxazolinyl and the photosensitive monomer have a plurality of carbon-carbon double bonds. The polymer containing oxazolinyl and the photosensitive monomer are polymerized to form a dense cross-linking network structure when the water soluble photosensitive resin composition is exposed to ultraviolet radiation. A film using the water soluble photosensitive resin composition is also provided.