Method and structure for adding mass with stress isolation to MEMS structures
    2.
    发明授权
    Method and structure for adding mass with stress isolation to MEMS structures 有权
    向MEMS结构增加应力隔离质量的方法和结构

    公开(公告)号:US09321629B2

    公开(公告)日:2016-04-26

    申请号:US14217376

    申请日:2014-03-17

    Applicant: mCube Inc.

    Abstract: A method and structure for adding mass with stress isolation to MEMS. The structure has a thickness of silicon material coupled to at least one flexible element. The thickness of silicon material can be configured to move in one or more spatial directions about the flexible element(s) according to a specific embodiment. The apparatus also includes a plurality of recessed regions formed in respective spatial regions of the thickness of silicon material. Additionally, the apparatus includes a glue material within each of the recessed regions and a plug material formed overlying each of the recessed regions.

    Abstract translation: 一种将应力隔离加入MEMS的方法和结构。 该结构具有耦合到至少一个柔性元件的硅材料的厚度。 根据具体实施例,硅材料的厚度可被配置为围绕柔性元件在一个或多个空间方向上移动。 该设备还包括形成在硅材料厚度的相应空间区域中的多个凹陷区域。 此外,该设备包括在每个凹陷区域内的胶合材料和形成在每个凹陷区域上的塞子材料。

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