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公开(公告)号：US20240339387A1
公开(公告)日：2024-10-10
申请号：US18625482
申请日：2024-04-03
发明人： Jacek RUDZKI , Mohammadhadi MAGHSOUDI , Lars PAULSEN , Tino FILIPIAK-RESSEL , Holger BEER , Tobias SCHUETZ
IPC分类号： H01L23/498 , H01L21/48 , H01L21/56 , H01L23/10 , H01L23/31
CPC分类号： H01L23/49811 , H01L21/4853 , H01L21/565 , H01L23/10 , H01L23/3121 , H01L23/49838
摘要： A semiconductor power module includes one or more semiconductors placed on a substrate. At least one contact pin extends basically perpendicular to the substrate and is electrically connected to the substrate or the semiconductor via a pin foot. A terminal end of the contact pin protrudes outside an encapsulation compound encapsulating at least partially the substrate, the one or more semiconductors, and the contact pin. At least one sealing ring and at least one washer are received by a pin shaft of the contact pin such that they rest on the pin foot. The washer is fixed by the encapsulation compound, and the sealing ring is held in longitudinal direction of the pin shaft in an elastically deformed state by the washer.
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公开(公告)号：US12087699B2
公开(公告)日：2024-09-10
申请号：US17609885
申请日：2020-04-22
IPC分类号： H01L23/498 , H01L23/538 , H01L25/07 , H01L23/00 , H02M7/00 , H02M7/537
CPC分类号： H01L23/5386 , H01L25/072 , H01L23/49811 , H01L24/48 , H01L24/49 , H01L2224/48225 , H01L2224/49175 , H02M7/003 , H02M7/537
摘要： A power module (1) providing a half bridge, the power module including: at least one substrate (2) including an inner load track (3), two intermediate load tracks (4) and two outer load tracks (5), each of which load tracks is elongated and extends substantially across the at least one substrate (2) in a first direction (6); wherein the two intermediate load tracks (4) are arranged adjacent to the inner load track (3), and each outer load track (5) is arranged on the opposite side of one of the two intermediate load tracks (4) with respect to a second direction (7) substantially orthogonal to the first direction (6).
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公开(公告)号：US12046584B2
公开(公告)日：2024-07-23
申请号：US17861217
申请日：2022-07-10
IPC分类号： H01L23/538 , H01L23/00 , H01L23/498 , H01L25/07
CPC分类号： H01L25/072 , H01L23/49811 , H01L23/5386 , H01L24/49 , H01L2224/49175
摘要： A half bridge power module (1) comprising a substrate (2) comprising an inner load track (11), two intermediate load tracks (12, 14) and two outer load tracks (10,13), wherein an external terminal is mounted on one of the intermediate load tracks (12, 14), an external terminal (3, 4) is mounted on one of the outer load tracks (10, 13) and an external terminal (5) is mounted on the inner load track (11); wherein semiconductor switches (101, 12, 105, 106) are mounted on the outer load tracks (10, 13) and are electrically connected to the intermediate load track (12); and semiconductor switches (103, 104, 107, 108) are mounted on the intermediate load tracks (12, 14) and are electrically connected to the inner load track (11).
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公开(公告)号：US20230253891A1
公开(公告)日：2023-08-10
申请号：US18004712
申请日：2021-07-07
发明人： Ole MÜHLFELD
IPC分类号： H02M7/00 , H03K17/16 , H05K7/14 , H02M1/088 , H01L23/495 , H01L23/367
CPC分类号： H02M7/003 , H03K17/162 , H05K7/14329 , H02M1/088 , H01L23/49568 , H01L23/367
摘要： An apparatus is described having: a baseplate; an AC busbar mounted on the baseplate; a DC busbar having an upper DC busbar, a lower DC busbar and an insulating material therebetween, wherein the DC busbar is mounted such that the lower DC busbar is mounted to the baseplate and wherein the upper DC busbar has one or more openings through which the lower DC busbar is exposed; a first group of switching components mounted on the AC busbar, wherein the first group of switching components are connected to the upper DC busbar using first electrical connection means; and a second group of switching components mounted on the lower DC busbar, wherein at least one of the switching components of said second group of switching components is mounted within one of said openings, wherein the second group of switching components are to the AC busbar using second electrical connection means.
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公开(公告)号：US11626383B2
公开(公告)日：2023-04-11
申请号：US17126139
申请日：2020-12-18
发明人： Ronald Eisele , Holger Ulrich
摘要： Process for producing an electronic subassembly by low-temperature pressure sintering, comprising the following steps: arranging an electronic component on a circuit carrier having a conductor track, connecting the electronic component to the circuit carrier by the low-temperature pressure sintering of a joining material which connects the electronic component to the circuit carrier, characterized in that, to avoid the oxidation of the electronic component or of the conductor track, the low-temperature pressure sintering is carried out in a low-oxygen atmosphere having a relative oxygen content of 0.005 to 0.3%.
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公开(公告)号：US20230056722A1
公开(公告)日：2023-02-23
申请号：US17785091
申请日：2020-12-18
摘要： A power module (1) includes a group of at least three rectangular electrical power components (11, 12, 13, 14, 23, 24, 25, 26) arranged on a substrate (2), wherein in that at least one side (31) of at least one of the rectangular electrical power components (11, 14) is not orthogonal or parallel to a line (3) that passes through the geometric centres of the remaining rectangular electrical power components (12, 13) of the group.
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公开(公告)号：US20230032893A1
公开(公告)日：2023-02-02
申请号：US17781407
申请日：2020-11-13
发明人： Jörg BERGMANN
摘要： A power module (2) including a plurality of rectangular electrical power components (4, 4′) arranged on a substrate (6). The sides of at least a subset of the rectangular electrical power components (4, 4′) are not orthogonal to a line (12, 12′) that passes through the geometric centre (C) of the rectangular electrical power components (4, 4′) of the subset and extends orthogonal to a side (L, M) of the substrate (6).
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公开(公告)号：US11532600B2
公开(公告)日：2022-12-20
申请号：US15931703
申请日：2020-05-14
IPC分类号： H01L23/538 , H01L23/495 , H01L25/07 , H01L23/00 , H01L23/498
摘要： A half bridge power module (1) comprising a substrate (2) comprising an inner load track (11), two intermediate load tracks (12, 14) and two outer load tracks (10,13), wherein an external terminal is mounted on one of the intermediate load tracks (12, 14), an external terminal (3, 4) is mounted on one of the outer load tracks (10, 13) and an external terminal (5) is mounted on the inner load track (11); wherein semiconductor switches (101, 12, 105, 106) are mounted on the outer load tracks (10, 13) and are electrically connected to the intermediate load track (12); and semiconductor switches (103, 104, 107, 108) are mounted on the intermediate load tracks (12, 14) and are electrically connected to the inner load track (11).
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公开(公告)号：US20220344310A1
公开(公告)日：2022-10-27
申请号：US17861217
申请日：2022-07-10
IPC分类号： H01L25/07 , H01L23/538 , H01L23/00 , H01L23/498
摘要： A half bridge power module (1) comprising a substrate (2) comprising an inner load track (11), two intermediate load tracks (12, 14) and two outer load tracks (10,13), wherein an external terminal is mounted on one of the intermediate load tracks (12, 14), an external terminal (3, 4) is mounted on one of the outer load tracks (10, 13) and an external terminal (5) is mounted on the inner load track (11); wherein semiconductor switches (101, 12, 105, 106) are mounted on the outer load tracks (10, 13) and are electrically connected to the intermediate load track (12); and semiconductor switches (103, 104, 107, 108) are mounted on the intermediate load tracks (12, 14) and are electrically connected to the inner load track (11).
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公开(公告)号：US20220295662A1
公开(公告)日：2022-09-15
申请号：US17607959
申请日：2020-04-30
发明人： Stefan Behrendt , Ronald Eisele
IPC分类号： H05K7/20
摘要： The invention relates to a power electronics module including a flat circuit carrier (5) and an electronic assembly (10) arranged in an electrically contacting manner on the upper flat side of the circuit carrier (5) and cooling bodies (20) thermally in contact with the underside of the circuit carrier (5), wherein a heat-conducting bridge (30) arranged on the upper side of the circuit carrier (5), spanning the assembly (10) and extensively covering same, wherein the heat-conducting bridge (30) is in thermal contact with the cooling body (20) at mounting points arranged next to the assembly (10) and the space between the heat-conducting bridge (30) and the circuit carrier (5) is filled with a heat-conducting potting compound (50).
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