利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

65 条记录 (耗时 0.014 秒)

    CHEMICAL MECHANICAL PLANARIZATION SITE ISOLATION REACTOR
    1.
    发明申请
    CHEMICAL MECHANICAL PLANARIZATION SITE ISOLATION REACTOR 审中-公开
    化学机械平面化分离反应器

    公开(公告)号：US20130164937A1

    公开(公告)日：2013-06-27

    申请号：US13333686

    申请日：2011-12-21

    申请人： Glen Egami

    发明人： Glen Egami

    IPC分类号： H01L21/306 ,  H01L21/304

    CPC分类号： B24B27/0023 ,  B24B1/00 ,  B24B29/00 ,  B24B37/107 ,  B24B37/34 ,  B24B57/04 ,  H01L21/3212 ,  H01L21/67051 ,  Y02P70/179

    摘要： The embodiments describe systems and methods for combinatorial processing of a substrate. In some embodiments, chemical mechanical polishing (CMP) techniques are combinatorially processed and evaluated. The CMP system is capable of providing a localized planarization surface to at least a region of a substrate being combinatorially processed. In some embodiments, the CMP system comprises a reactor assembly having plurality of reaction chambers, with at least a reaction chamber comprising a rotatable polishing head, slurry and chemical distribution, chemical and water rinse, and slurry and fluid removal. Accordingly, from a single substrate, a variety of materials, process conditions, and process sequences may be evaluated for desired planarization results.

    摘要翻译： 实施例描述了用于组合处理衬底的系统和方法。 在一些实施例中，化学机械抛光（CMP）技术被组合处理和评估。 CMP系统能够向组合处理的衬底的至少一个区域提供局部平坦化表面。 在一些实施方案中，CMP系统包括具有多个反应室的反应器组件，其中至少一个反应室包括可旋转的抛光头，浆料和化学分布，化学和水冲洗以及淤浆和流体的去除。 因此，从单个衬底可以评估各种材料，工艺条件和工艺顺序，以获得所需的平坦化结果。

    AUTOMATIC ABRASIVE SAND DELIVERY MACHINE ESPECIALLY FOR WATER-JET CUTTING MACHINES
    2.
    发明申请
    AUTOMATIC ABRASIVE SAND DELIVERY MACHINE ESPECIALLY FOR WATER-JET CUTTING MACHINES 审中-公开
    自动抛光机特别适用于水刀切割机

    公开(公告)号：US20130005225A1

    公开(公告)日：2013-01-03

    申请号：US13539698

    申请日：2012-07-02

    申请人： Salvatore RUSSO

    发明人： Salvatore RUSSO

    IPC分类号： B24C7/00

    CPC分类号： B24B57/04 ,  B24C7/0046 ,  B24C9/00

    摘要： An automatic loader of abrasive sand into a storage and supply tank (T) of a machine tool that uses the abrasive sand, and in particular of a cutting machine, includes a loading chamber (1) for loading the abrasive sand arranged above the supply opening of the tank (T) and having a suction inlet, connected through an air suction pipe (6) to a vacuum pump (2), and a sand inlet, in a lower position, connected through a sand suction pipe (7) to a supply container (S) for abrasive sand. A filter (F) is arranged inside the loading chamber (1), between the suction inlet and the sand inlet, and the loading chamber (1) is closed below by a butterfly valve (9) provided with spring element apt to retain the valve in the closed position when there is no sand inside the loading chamber (1).

    摘要翻译： 砂磨机自动装载到使用研磨砂的机床（特别是切割机）的储存和供给罐（T）中，包括装载室（1），用于装载布置在供应开口 （T）并具有通过空气吸入管（6）连接到真空泵（2）的抽吸入口，并且在下部位置通过吸砂管（7）连接到吸入管 用于研磨砂的供应容器（S）。 过滤器（F）布置在装载室（1）的内部，在吸入口和砂入口之间，并且装载室（1）通过设有弹簧元件的蝶阀（9）在下闭合，该弹簧元件易于保持阀 在装载室（1）内没有沙子时处于关闭位置。

    Supply wax for polisher
    3.
    发明申请
    Supply wax for polisher 审中-公开
    供应抛光剂蜡

    公开(公告)号：US20090148643A1

    公开(公告)日：2009-06-11

    申请号：US11951313

    申请日：2007-12-05

    申请人： Tsung Chen Yu

    发明人： Tsung Chen Yu

    IPC分类号： B32B33/00

    CPC分类号： B24B57/04 ,  Y10T428/1419

    摘要： A supply wax structure of a reel for a polisher includes a protective layer on one surface; a releasable layer on the other surface; and a wax layer adhered between the protective layer and the releasable layer. In one embodiment, the protective layer has a plurality of first apertures arranged in rows filled with wax and the releasable layer has a plurality of second apertures arranged in rows filled with wax. Preferably, the releasable layer is formed of fabric. Preferably, the protective layer is formed of paper. Preferably, the width of the wax layer is substantially equal to that of a polishing wheel of the polisher.

    摘要翻译： 用于抛光机的卷轴的供应蜡结构包括在一个表面上的保护层; 在另一个表面上的可释放层; 以及粘附在保护层和可剥离层之间的蜡层。 在一个实施例中，保护层具有多个以蜡填充的行排列的第一孔，并且可释放层具有排列成填充有蜡的行的多个第二孔。 优选地，可释放层由织物形成。 优选地，保护层由纸形成。 优选地，蜡层的宽度基本上等于抛光机的抛光轮的宽度。

    POLISHING PAD AND CHEMICAL MECHANICAL POLISHING APPARATUS COMPRISING THE SAME
    4.
    发明申请
    POLISHING PAD AND CHEMICAL MECHANICAL POLISHING APPARATUS COMPRISING THE SAME 审中-公开
    抛光垫和化学机械抛光装置

    公开(公告)号：US20080090503A1

    公开(公告)日：2008-04-17

    申请号：US11941120

    申请日：2007-11-16

    申请人： Moo-yong PARK ,  Tae-hoon LEE ,  Jae-eung KOO

    发明人： Moo-yong PARK ,  Tae-hoon LEE ,  Jae-eung KOO

    IPC分类号： B24B29/02 ,  B24B7/04 ,  B24D11/00

    CPC分类号： B24B37/04 ,  B24B57/04 ,  Y02P70/179

    摘要： A polishing pad for use in chemically mechanically polishing a semiconductor substrate enhances the uniformity of the rate at which material is removed from the surface of the semiconductor substrate, thereby ensuring the reproducibility of the chemical mechanical polishing process. The polishing pad has main grooves that divide an upper portion of the pad into a plurality of cells. At least one of the cells includes a land portion and a grooved portion substantially enclosed by the land portion. A respective slurry hole extends through the pad to the grooved portion such that slurry supplied through the slurry hole feeds into the grooved portion but is impeded by the land portion from flowing outwardly of the cell.

    摘要翻译： 用于化学机械抛光半导体衬底的抛光垫增强了从半导体衬底的表面去除材料的速率的均匀性，从而确保了化学机械抛光工艺的再现性。 抛光垫具有将焊盘的上部分成多个单元的主凹槽。 至少一个电池包括基部和基本上由接地部分包围的开槽部分。 相应的浆料孔通过垫延伸到开槽部分，使得通过浆料孔供应的浆料进入槽部分，但是被陆部部分阻碍从池中向外流动。

    Pivotable slurry arm
    5.
    发明申请
    Pivotable slurry arm 审中-公开
    透视浆臂

    公开(公告)号：US20050164603A1

    公开(公告)日：2005-07-28

    申请号：US10763469

    申请日：2004-01-22

    申请人： Colby House ,  Herng Liu

    发明人： Colby House ,  Herng Liu

    IPC分类号： B24B37/04 ,  B24B57/04 ,  B24B49/00

    CPC分类号： B24B37/04 ,  B24B37/042 ,  B24B57/04

    摘要： Embodiments of methods and apparatus of the present invention provide a chemical mechanical planarization (CMP) apparatus including a pivotable slurry arm for dispensing slurry.

    摘要翻译： 本发明的方法和装置的实施例提供了一种化学机械平面化（CMP）装置，其包括用于分配浆料的可枢转的浆液臂。

    Method of forming ink fill slot of ink-jet printhead
    6.
    发明申请
    Method of forming ink fill slot of ink-jet printhead 失效
    形成喷墨打印头的墨水填充槽的方法

    公开(公告)号：US20020045405A1

    公开(公告)日：2002-04-18

    申请号：US10023064

    申请日：2001-12-17

    发明人： Thomas E. Pettit ,  James Denning Smith

    IPC分类号： B24B001/00

    CPC分类号： B24B37/04 ,  B24B57/04

    摘要： A pressurized delivery system for abrasive particulate material includes a storage container adapted to contain the abrasive particulate material therein, an input pressure line adapted to communicate with a pressurized source, and a fluidizing pressure line communicating with the input pressure line and an inlet opening in the storage container. A back-pressure pressure line communicates with an unoccupied portion of the storage container and an output pressure line. The output pressure line, into which the abrasive particulate material is fed from the storage container, communicates with the input pressure line, the back-pressure pressure line, and an outlet opening of storage container. During operation, pressurized gas is released through the inlet opening and into the storage container such that the abrasive particulate material adjacent the outlet opening is fluidized and maintained flowable so as to achieve consistent flow of the abrasive particulate material through the outlet opening.

    摘要翻译： 用于磨料颗粒材料的加压输送系统包括适于在其中容纳磨料颗粒材料的储存容器，适于与加压源连通的输入压力管线和与输入压力管路连通的流化压力管线和 储存容器。 背压压力线与存储容器的未占用部分和输出压力线连通。 磨料颗粒材料从储存容器供给的输出压力线与输入压力管线，背压压力管线和存储容器的出口开口连通。 在操作期间，加压气体通过入口开口释放并进入储存容器，使得与出口开口相邻的磨料颗粒材料被流化并保持可流动，以便使磨料颗粒材料通过出口开口一致地流动。