公开(公告)号：US09308059B2

公开(公告)日：2016-04-12

申请号：US13024223

申请日：2011-02-09

Applicant: Jae Ho Ryu ,  Tae Hyun Gong ,  Moo Yong Park ,  Kwang Hoon Lee

Inventor： Jae Ho Ryu ,  Tae Hyun Gong ,  Moo Yong Park ,  Kwang Hoon Lee

IPC: A61C8/00

CPC classification number: A61C8/0001

Abstract: An implant bite registration jig includes a coupling portion configured to produce a clear impression in bite impression material; a connecting portion that connects the implant jig with a fixture embedded in a patient's gums; and a body that is formed between the coupling portion and the connecting portion. The implant bite registration jig is positioned in an embedded fixture and a bite impression is taken. Reference marks are formed in the bite impression material by the registration jig, which permit accurate location of the fixture. This makes it possible to simultaneously take a dental impression and a bite impression in an implant operation, similar to a natural teeth operation, such that it is possible to reduce the cost and time for manufacturing a prosthesis.

Abstract translation: 植入物咬合配准夹具包括：联接部分，其构造成在咬合印模材料中产生清晰印象; 连接部分，其将植入物夹具与嵌入患者牙龈中的固定器连接; 以及形成在所述联接部和所述连接部之间的主体。 植入物咬合配准夹具定位在嵌入式夹具中，并采取咬合印记。 通过配准夹具在咬合印模材料中形成参考标记，其允许夹具的准确定位。 这使得可以在类似于天然牙齿操作的植入操作中同时采取牙齿印象和咬伤印象，使得可以降低制造假体的成本和时间。

公开(公告)号：US07166019B2

公开(公告)日：2007-01-23

申请号：US11044373

申请日：2005-01-27

Applicant: Moo-Yong Park ,  Ja-Eung Koo ,  Sang-Cheol Han ,  Duk-Ho Hong

Inventor： Moo-Yong Park ,  Ja-Eung Koo ,  Sang-Cheol Han ,  Duk-Ho Hong

IPC: B24B49/00

CPC classification number: B24B37/30 ,  Y10T279/11

Abstract: A flexible membrane for a polishing head and a chemical mechanical polishing (CMP) apparatus having the same are provided. The flexible membrane for a polishing head includes a compressing plate having a first face and a second face opposite to the first face. The first face of the compressing plate holds a substrate with a vacuum provided thereto and compresses the substrate on a polishing pad. The second face of the compressing plate is combined with a supporter of the polishing head. The second face and the supporter define a space to which the vacuum for holding the substrate and a first pneumatic pressure for compressing the substrate are applied. A dividing member combined with the supporter is formed on the second face. The dividing member divides the space into at least two regions. A pneumatic pressure-introducing portion is formed at the dividing member. A second pneumatic pressure is provided to the compressing plate through the pneumatic pressure-introducing portion.

Abstract translation: 提供了一种用于抛光头的柔性膜和具有该柔性膜的化学机械抛光（CMP）装置。 用于抛光头的柔性膜包括具有第一面和与第一面相对的第二面的压缩板。 压缩板的第一面保持提供真空的基板，并将基板压在抛光垫上。 压缩板的第二面与抛光头的支撑件组合。 第二面和支撑件限定了用于保持基板的真空和用于压缩基板的第一气动压力的空间。 与支撑件组合的分隔构件形成在第二面上。 分隔构件将空间分成至少两个区域。 在分隔构件上形成气压导入部。 通过气动压力引入部分向压缩板提供第二气动压力。

公开(公告)号：US20050176354A1

公开(公告)日：2005-08-11

申请号：US11044373

申请日：2005-01-27

Applicant: Moo-Yong Park ,  Ja-Eung Koo ,  Sang-Cheol Han ,  Duk-Ho Hong

Inventor： Moo-Yong Park ,  Ja-Eung Koo ,  Sang-Cheol Han ,  Duk-Ho Hong

IPC: B24B37/005 ,  B24B37/30 ,  H01L21/304 ,  B24B1/00

CPC classification number: B24B37/30 ,  Y10T279/11

Abstract: A flexible membrane for a polishing head and a chemical mechanical polishing (CMP) apparatus having the same are provided. The flexible membrane for a polishing head includes a compressing plate having a first face and a second face opposite to the first face. The first face of the compressing plate holds a substrate with a vacuum provided thereto and compresses the substrate on a polishing pad. The second face of the compressing plate is combined with a supporter of the polishing head. The second face and the supporter define a space to which the vacuum for holding the substrate and a first pneumatic pressure for compressing the substrate are applied. A dividing member combined with the supporter is formed on the second face. The dividing member divides the space into at least two regions. A pneumatic pressure-introducing portion is formed at the dividing member. A second pneumatic pressure is provided to the compressing plate through the pneumatic pressure-introducing portion.

Abstract translation: 提供了一种用于抛光头的柔性膜和具有该柔性膜的化学机械抛光（CMP）装置。 用于抛光头的柔性膜包括具有第一面和与第一面相对的第二面的压缩板。 压缩板的第一面保持提供真空的基板，并将基板压在抛光垫上。 压缩板的第二面与抛光头的支撑件组合。 第二面和支撑件限定了用于保持基板的真空和用于压缩基板的第一气动压力的空间。 与支撑件组合的分隔构件形成在第二面上。 分隔构件将空间分成至少两个区域。 在分隔构件上形成气压导入部。 通过气动压力引入部分向压缩板提供第二气动压力。

公开(公告)号：US07364497B2

公开(公告)日：2008-04-29

申请号：US11169731

申请日：2005-06-30

Applicant: Moo-yong Park ,  Tae-hoon Lee ,  Jae-eung Koo

Inventor： Moo-yong Park ,  Tae-hoon Lee ,  Jae-eung Koo

IPC: B24B5/00 ,  B24B29/00

CPC classification number: B24B37/04 ,  B24B57/04 ,  Y02P70/179

Abstract: A polishing pad for use in chemically mechanically polishing a semiconductor substrate enhances the uniformity of the rate at which material is removed from the surface of the semiconductor substrate, thereby ensuring the reproducibility of the chemical mechanical polishing process. The polishing pad has main grooves that divide an upper portion of the pad into a plurality of cells. At least one of the cells includes a land portion and a grooved portion substantially enclosed by the land portion. A respective slurry hole extends through the pad to the grooved portion such that slurry supplied through the slurry hole feeds into the grooved portion but is impeded by the land portion from flowing outwardly of the cell.

Abstract translation: 用于化学机械抛光半导体衬底的抛光垫增强了从半导体衬底的表面去除材料的速率的均匀性，从而确保了化学机械抛光工艺的再现性。 抛光垫具有将焊盘的上部分成多个单元的主凹槽。 至少一个电池包括基部和基本上由接地部分包围的开槽部分。 相应的浆料孔通过垫延伸到开槽部分，使得通过浆料孔供应的浆料进入槽部分，但是被陆部部分阻碍从池中向外流动。

公开(公告)号：US07559824B2

公开(公告)日：2009-07-14

申请号：US11494613

申请日：2006-07-28

Applicant: Moo-yong Park ,  Tai-hyoung Kim ,  Choon-goang Kim ,  Dong-Il Kim

Inventor： Moo-yong Park ,  Tai-hyoung Kim ,  Choon-goang Kim ,  Dong-Il Kim

IPC: B24B53/00

CPC classification number: B24B53/017 ,  B24B1/04

Abstract: Chemical mechanical polishing (CMP) devices, a pad conditioner assembly and a polishing pad conditioning method thereof are provided. The CMP device planarizes a wafer by rotating a carrier, which has a wafer mounted on a lower surface of the carrier, over a rotating polishing table while supplying a slurry onto a polishing pad attached to an upper surface of the rotating polishing table. The CMP device may include a pad conditioner assembly that conditions the polishing pad by supplying a pad conditioning liquid onto the polishing pad and simultaneously transferring a megasonic vibration to the pad conditioning liquid to remove foreign substances from a surface of the polishing pad.

Abstract translation: 提供化学机械抛光（CMP）装置，垫调节器组件和抛光垫调节方法。 CMP装置通过将具有安装在载体的下表面上的晶片的载体旋转在旋转的抛光台上，同时将浆料提供到附接到旋转的抛光台的上表面的抛光垫上来平坦化晶片。 CMP装置可以包括垫调节器组件，其通过将抛光垫调节液提供到抛光垫上来调节抛光垫，同时将兆声波振动传送到衬垫调节液以从抛光垫的表面去除异物。

公开(公告)号：US07488235B2

公开(公告)日：2009-02-10

申请号：US11381415

申请日：2006-05-03

Applicant: Moo-Yong Park ,  Sang-Rok Hah ,  Jong-Gyoon Kim ,  Hong-Seong Son ,  Ja-Hyung Han

Inventor： Moo-Yong Park ,  Sang-Rok Hah ,  Jong-Gyoon Kim ,  Hong-Seong Son ,  Ja-Hyung Han

IPC: B24B49/00

CPC classification number: B24B37/30 ,  B24B1/005 ,  B24B49/16

Abstract: Polishing apparatus and related methods employ aligned first and second magnetic field sources to adjust the compressive force and/or pressure applied by a carrier head against a target workpiece (such as a wafer) by selectively and controllably generating a repellant or attractive force between the two magnetic field sources.

Abstract translation: 抛光装置和相关方法使用对准的第一和第二磁场源来通过选择性地和可控地产生驱避剂或两者之间的吸引力来调节由载体头部抵靠目标工件（例如晶片）施加的压缩力和/或压力 磁场源

公开(公告)号：US20060003677A1

公开(公告)日：2006-01-05

申请号：US11169731

申请日：2005-06-30

Applicant: Moo-yong Park ,  Tae-hoon Lee ,  Jae-eung Koo

Inventor： Moo-yong Park ,  Tae-hoon Lee ,  Jae-eung Koo

IPC: B24B1/00

CPC classification number: B24B37/04 ,  B24B57/04 ,  Y02P70/179

Abstract: A polishing pad for use in chemically mechanically polishing a semiconductor substrate enhances the uniformity of the rate at which material is removed from the surface of the semiconductor substrate, thereby ensuring the reproducibility of the chemical mechanical polishing process. The polishing pad has main grooves that divide an upper portion of the pad into a plurality of cells. At least one of the cells includes a land portion and a grooved portion substantially enclosed by the land portion. A respective slurry hole extends through the pad to the grooved portion such that slurry supplied through the slurry hole feeds into the grooved portion but is impeded by the land portion from flowing outwardly of the cell.

Abstract translation: 用于化学机械抛光半导体衬底的抛光垫增强了从半导体衬底的表面去除材料的速率的均匀性，从而确保了化学机械抛光工艺的再现性。 抛光垫具有将焊盘的上部分成多个单元的主凹槽。 至少一个电池包括基部和基本上由接地部分包围的开槽部分。 相应的浆料孔通过垫延伸到开槽部分，使得通过浆料孔供应的浆料进入槽部分，但是被陆部部分阻碍从池中向外流动。

公开(公告)号：US20120202169A1

公开(公告)日：2012-08-09

申请号：US13024223

申请日：2011-02-09

Applicant: Jae Ho Ryu ,  Tae Hyun Gong ,  Moo Yong Park ,  Kwang Hoon Lee

Inventor： Jae Ho Ryu ,  Tae Hyun Gong ,  Moo Yong Park ,  Kwang Hoon Lee

IPC: A61C8/00 ,  A61C9/00

CPC classification number: A61C8/0001

Abstract: An implant bite registration jig includes a coupling portion configured to produce a clear impression in bite impression material; a connecting portion that connects the implant jig with a fixture embedded in a patient's gums; and a body that is formed between the coupling portion and the connecting portion. The implant bite registration jig is positioned in an embedded fixture and a bite impression is taken. Reference marks are formed in the bite impression material by the registration jig, which permit accurate location of the fixture. This makes it possible to simultaneously take a dental impression and a bite impression in an implant operation, similar to a natural teeth operation, such that it is possible to reduce the cost and time for manufacturing a prosthesis.

Abstract translation: 植入物咬合配准夹具包括：联接部分，其构造成在咬合印模材料中产生清晰印象; 连接部分，其将植入物夹具与嵌入患者牙龈中的固定器连接; 以及形成在所述联接部和所述连接部之间的主体。 植入物咬合配准夹具定位在嵌入式夹具中，并采取咬合印记。 通过配准夹具在咬合印模材料中形成参考标记，其允许夹具的准确定位。 这使得可以在类似于天然牙齿操作的植入操作中同时采取牙齿印象和咬伤印象，使得可以降低制造假体的成本和时间。

公开(公告)号：US08062102B2

公开(公告)日：2011-11-22

申请号：US10922778

申请日：2004-08-20

Applicant: Moo-Yong Park ,  Jong-Won Lee ,  Sang-Rok Ha ,  Hong-Seong Son

Inventor： Moo-Yong Park ,  Jong-Won Lee ,  Sang-Rok Ha ,  Hong-Seong Son

IPC: B24D11/00

CPC classification number: B24B37/22 ,  B24B37/24 ,  B24B37/26

Abstract: Polishing pads are provided that include a substrate for a polishing pad and a plurality of spaced apart members on the substrate and protruding from the substrate. The plurality of members include at least one abrasive layer and at least one chemical additive layer. Related methods of fabricating polishing pads are also provided herein.

Abstract translation: 提供了抛光垫，其包括用于抛光垫的基板和在基板上并从基板突出的多个间隔开的构件。 多个构件包括至少一个研磨层和至少一个化学添加剂层。 本文还提供了制造抛光垫的相关方法。

公开(公告)号：US20080090503A1

公开(公告)日：2008-04-17

申请号：US11941120

申请日：2007-11-16

Applicant: Moo-yong PARK ,  Tae-hoon LEE ,  Jae-eung KOO

Inventor： Moo-yong PARK ,  Tae-hoon LEE ,  Jae-eung KOO

IPC: B24B29/02 ,  B24B7/04 ,  B24D11/00

CPC classification number: B24B37/04 ,  B24B57/04 ,  Y02P70/179

Abstract: A polishing pad for use in chemically mechanically polishing a semiconductor substrate enhances the uniformity of the rate at which material is removed from the surface of the semiconductor substrate, thereby ensuring the reproducibility of the chemical mechanical polishing process. The polishing pad has main grooves that divide an upper portion of the pad into a plurality of cells. At least one of the cells includes a land portion and a grooved portion substantially enclosed by the land portion. A respective slurry hole extends through the pad to the grooved portion such that slurry supplied through the slurry hole feeds into the grooved portion but is impeded by the land portion from flowing outwardly of the cell.

Abstract translation: 用于化学机械抛光半导体衬底的抛光垫增强了从半导体衬底的表面去除材料的速率的均匀性，从而确保了化学机械抛光工艺的再现性。 抛光垫具有将焊盘的上部分成多个单元的主凹槽。 至少一个电池包括基部和基本上由接地部分包围的开槽部分。 相应的浆料孔通过垫延伸到开槽部分，使得通过浆料孔供应的浆料进入槽部分，但是被陆部部分阻碍从池中向外流动。