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公开(公告)号：US12119420B2
公开(公告)日：2024-10-15
申请号：US18490663
申请日：2023-10-19
发明人： Shiliang Huang , Zhiqiu Guo , Yingli Guan , Jingguo Yang
IPC分类号： H01L31/048 , H01L31/05
CPC分类号： H01L31/048 , H01L31/0504
摘要： A method for manufacturing a photovoltaic module and a photovoltaic module are provided. The method includes: laying a front plate, a first adhesive layer on the front plate, and a plurality of cells on the first adhesive layer, and pre-curing the first adhesive layer between the front plate and the plurality of cells; forming a plurality of cell strings by connecting the plurality of cells through a plurality of solder strips after the first adhesive layer is pre-cured; and laying a second adhesive layer on the plurality of cell strings, laying a back plate on the second adhesive layer, and curing the second adhesive layer between the back plate and the plurality of cell strings, to form the photovoltaic module.
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公开(公告)号：US12113139B1
公开(公告)日：2024-10-08
申请号：US18531648
申请日：2023-12-06
发明人： Yuanfang Zhang , Peiting Zheng , Jie Yang , Xinyu Zhang
IPC分类号： H01L31/0224 , H01L31/0236
CPC分类号： H01L31/022441 , H01L31/02363
摘要： The solar cell includes a substrate having electrode regions and non-electrode regions alternatingly. The electrode regions have a first surface, the non-electrode regions have a second surface, and the first surface has a smaller roughness than the second surface. The solar cell further includes a first tunneling dielectric layer formed over the first surface, a first doped conductive layer arranged on a side of the first tunneling dielectric layer, a passivation layer formed over the second surface and the first doped conductive layer, and at least one first electrode. The at least one first electrode are arranged in the electrode regions, each of the at least one first electrode includes a connecting electrode formed over the electrode regions and multiple spot electrodes. The multiple spot electrodes are arranged below the connecting electrode and connected to the connecting electrode.
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公开(公告)号：US12100771B1
公开(公告)日：2024-09-24
申请号：US18332728
申请日：2023-06-10
发明人： Bike Zhang , Nannan Yang , Mengwei Xu , Jingsheng Jin
IPC分类号： H01L31/02 , H01L31/0203 , H01L31/0352 , H01L31/0376 , H01L31/18
CPC分类号： H01L31/02008 , H01L31/0203 , H01L31/035209 , H01L31/1816 , H01L31/1868 , H01L31/0376
摘要： The solar cell includes a substrate, a tunneling layer disposed on a first surface, and a first doped conductive layer disposed on a surface of the tunneling layer. The solar cell further includes a second doped conductive layer disposed on a surface of the first doped conductive layer, where the second doped conductive layer includes: multiple first portions and multiple second portions arranged alternately in a direction perpendicular to a predetermined direction and perpendicular to a thickness direction of the second doped conductive layer, each of the multiple first portions and the multiple second portions extends along the predetermined direction, a doping element concentration of the first doped conductive layer is lower than a doping element concentration of each of the multiple first portions, and the doping element concentration of each of the multiple first portions is lower than a doping element concentration of each of the multiple second portions.
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公开(公告)号：US12087917B2
公开(公告)日：2024-09-10
申请号：US17394371
申请日：2021-08-04
发明人： Yunhui Gao , Juan Wang , Zhiqiu Guo
IPC分类号： H01M50/209 , H01M10/42 , H01M50/172 , H01M50/543
CPC分类号： H01M10/425 , H01M50/172 , H01M50/209 , H01M50/543 , H01M2010/4271
摘要： The present disclosure provides a battery housing including a recess and a communication wiring socket. The recess is recessed inward from a side wall of the battery housing. The communication wiring socket is provided on an inner wall of the recess and configured to connect with a battery management system disposed within the battery housing. The recess is configured to provide a handheld space and to receive a communication wiring terminal plugged into the communication wiring socket. The present disclosure further provides an energy storage battery including the battery housing, and an energy storage system including the energy storage battery.
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公开(公告)号：US12087737B2
公开(公告)日：2024-09-10
申请号：US17535987
申请日：2021-11-26
发明人： Weiping Li
IPC分类号： H01L25/065 , H01L21/56 , H01L23/00 , H01L23/31 , H01L23/538 , H01L25/00
CPC分类号： H01L25/0657 , H01L21/568 , H01L23/3128 , H01L23/5389 , H01L24/13 , H01L25/50 , H01L2924/15311 , H01L2924/181
摘要： A method of forming a package comprises forming a stack of chip layers. Each chip layer has a front side facing away from the carrier substrate. A first chip layer includes a plurality of first chips having first chip contacts on the front side of the first chip layer and chip couplers having through vias. A second chip layer includes a plurality of second chip having second chip contacts on the front side of the second chip layer and coupled to respective ones of at least a first subset of the through vias. The method further comprises forming a redistribution layer on the front side of the first chip layer and dividing the stack of chip layers and the redistribution layer to form a plurality of chip packages. A chip package thus formed include a stack of chips and one or more chip connectors on a singulated redistribution layer.
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公开(公告)号：US12080816B2
公开(公告)日：2024-09-03
申请号：US18357028
申请日：2023-07-21
发明人： Ning Li , Pengjun Xiao , Zhigang Dai , Sen Yang , Weichong Kong , Bo Li , Jiaxiang Yin , Chunhua Tao
IPC分类号： H01L31/0475 , H01L31/048 , H01L31/18
CPC分类号： H01L31/0475 , H01L31/048 , H01L31/186
摘要： The photovoltaic module includes multiple cell sheets arranged in an array including multiple rows and multiple columns, where each of the multiple rows of cell sheets is arranged at intervals along a first direction, each of the multiple columns of cell sheets is arranged at intervals along a second direction, and each of the multiple cell sheets has a first surface and a second surface. The photovoltaic module further includes a first flexible cover layer located on a side of the first surface of each of the multiple cell sheets, and a second flexible cover layer located on a side of the second surface of each of the multiple cell sheets. The photovoltaic module is configured to be folded along a gap between two adjacent rows of cell sheets or along a gap between two adjacent columns of cell sheets with the folding angle of 0 degree to 180 degrees.
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公开(公告)号：US12046525B2
公开(公告)日：2024-07-23
申请号：US17535986
申请日：2021-11-26
发明人： Weiping Li
CPC分类号： H01L23/3128 , H01L24/16 , H01L2224/16221 , H01L2224/73204 , H01L2924/15311 , H01L2924/181
摘要： A semiconductor packaging method, a semiconductor assembly and an electronic device comprising the semiconductor assembly are described herein. The semiconductor packaging method comprises providing at least one semiconductor device and a carrier board. A plurality of first alignment solder parts are formed on an active surface of each semiconductor device in addition to connection terminals. A plurality of second alignment solder parts are formed on a surface of the carrier board. The method further comprises forming a plurality of alignment solder joints by aligning and soldering the first alignment solder parts to respective ones of the second alignment solder parts whereby the semiconductor device is aligned and fixed to the carrier board; encapsulating the at least one semiconductor device to form a molded package body; sequentially forming a redistribution layer and external terminals on the molded package body so that the connection terminals are connected to the external terminal through the interconnection layer.
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公开(公告)号：US12009446B2
公开(公告)日：2024-06-11
申请号：US17483746
申请日：2021-09-23
发明人： Ding Yu , Wenqi Li , Shijie Zhao , Xiaowen Zhang , Jialei Chai , Xinyu Zhang , Hao Jin , Jie Yang
IPC分类号： H01L31/048 , H01L31/054 , H01L31/068 , H01L31/18
CPC分类号： H01L31/048 , H01L31/0543 , H01L31/068 , H01L31/1824 , H01L31/1868
摘要： A solar cell, a method for producing a solar cell and a solar cell module are provided. The solar cell includes: a substrate having a front surface and a rear surface opposite to the front surface; a first passivation layer, a second passivation layer and a third passivation layer sequentially formed on the front surface and in a direction away from the front surface; wherein the first passivation layer includes a dielectric material; the second passivation layer includes a first silicon nitride SimNn material, and a ratio of n/m is 0.5˜1; the third passivation layer includes a silicon oxynitride SiOiNj material, and a ratio of j/i is 0.1˜0.6; and a tunneling oxide layer and a doped conductive layer sequentially formed on the rear surface and in a direction away from the rear surface, wherein the doped conductive layer and the substrate have a doping element of a same conductivity type.
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公开(公告)号：US11973152B2
公开(公告)日：2024-04-30
申请号：US17960678
申请日：2022-10-05
发明人： Bike Zhang , Guangming Liao , Lin'an Zhang , Jingsheng Jin , Xinyu Zhang
IPC分类号： H01L31/0224 , H01L31/05
CPC分类号： H01L31/022425 , H01L31/022466 , H01L31/0504
摘要： The solar cell includes: a substrate; a tunneling dielectric layer located on the first surface of the substrate; multiple doped conductive layers, where the multiple doped conductive layers are located on a surface of the tunneling dielectric layer away from the substrate, and are disposed at intervals; multiple first electrodes, where the multiple first electrodes are disposed at intervals, extend along a first direction, are arranged on a side of the multiple doped conductive layers away from the substrate, and are electrically connected to the multiple doped conductive layers; at least one conductive transport layer, where the at least one conductive transport layer is located between every two adjacent doped conductive layers in the multiple doped conductive layers, and is in contact with a side surface of the multiple doped conductive layers.
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公开(公告)号：US11973061B2
公开(公告)日：2024-04-30
申请号：US17535984
申请日：2021-11-26
发明人： Weiping Li
IPC分类号： H01L23/00 , H01L21/56 , H01L23/31 , H01L23/538 , H01L25/00 , H01L25/065
CPC分类号： H01L25/0657 , H01L21/568 , H01L23/3128 , H01L23/5389 , H01L24/13 , H01L25/50 , H01L2924/15311 , H01L2924/181
摘要： A method of forming a package is provided. The method comprises assembling on a carrier a stack of chip layers including a plurality of first chip layers and a second chip layer; encapsulating the stack of chip layers in a molding compound; removing the carrier to form a package main body; forming a redistribution layer on an exposed side of a first chip layer; and dividing the package main body to form a plurality of packages. Each first chip layer includes first chips and chip couplers. A chip package includes at least one chip stack and at least one chip coupler stack on a singulated redistribution layer. Each chip stack includes at least one chip from each chip layer, and each chip coupler stack includes at least one chip coupler and/or at least one chip coupler segment from each of the first chip layers.
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