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公开(公告)号：US20210048230A1
公开(公告)日：2021-02-18
申请号：US16989880
申请日：2020-08-10
Applicant: INERTECH IP LLC
Inventor： Ming Zhang , John Costakis
Abstract: The cooling systems of the present disclosure include a first refrigerant circuit in thermal communication with a heat load and in fluid communication with a main condenser, a free cooling circuit in fluid communication with the main condenser and a free-cooled water source, a chilled water circuit in fluid communication with the main condenser and an evaporator, and a second refrigerant circuit in fluid communication with the evaporator and a secondary condenser. The free cooling circuit is in thermal communication with the first refrigerant circuit via the main condenser, the chilled water circuit is in thermal communication with the first refrigerant circuit via the main condenser, and the second refrigeration circuit is in thermal communication with the chilled water circuit and the free cooling circuit. The second refrigeration circuit cools a fluid flowing in the chilled water circuit. Methods of operating a cooling system are also disclosed.
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公开(公告)号：US10916966B2
公开(公告)日：2021-02-09
申请号：US16505543
申请日：2019-07-08
Applicant: Inertech IP LLC
Inventor： Jakob Carnemark , Piero Oliveri
Abstract: A power supply system includes an energy storage device electrically connected to a power grid, a power distribution assembly electrically connected to a load, and a power generation device electrically connected to the power distribution assembly. The energy storage device and the power grid are configured to supply electric power having a first voltage range to the power distribution assembly, which in turn, is configured to supply electric power having a second voltage range less than the first voltage range to the load. The energy storage device and the power generation device each are configured to at least temporarily supply a flow of electric power to the power distribution assembly when electric power from the power grid is interrupted such that a substantially uninterrupted flow of electric power is supplied to the load.
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公开(公告)号：US10716241B2
公开(公告)日：2020-07-14
申请号：US14473395
申请日：2014-08-29
Applicant: INERTECH IP LLC
Inventor： Earl Keisling , John Costakis , Gerald McDonnell
IPC: H05K7/20 , F21V33/00 , F21W131/40
Abstract: An air flow distribution system for cooling server racks includes at least one server rack partially defining a hot aisle and a cold aisle, a first air foil disposed above the server rack, and a second air foil disposed above the first air foil. The first air foil and the second air foil are configured to receive air from the hot aisle, and to form turbulent wake patterns in the cold aisle partially defined by the server rack. The air flow distribution system may include a convex ceiling member above the second air foil. A corresponding method includes causing air to be directed between a first air foil disposed above a server rack and a second air foil disposed above the first air foil to form turbulent wake patterns in the cold aisle. An electrical enclosure assembly includes a receptacle and a cover member configured as an air foil.
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公开(公告)号：US20200163250A1
公开(公告)日：2020-05-21
申请号：US16653509
申请日：2019-10-15
Applicant: Inertech IP LLC
Inventor： Earl Keisling , John Costakis , Gerald McDonnell , Michael Welch
Abstract: A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.
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95.发明授权公开(公告)号：US10345012B2
公开(公告)日：2019-07-09
申请号：US15715783
申请日：2017-09-26
Applicant: Inertech IP LLC
Inventor： Gerald McDonnell , Earl Keisling
Abstract: Cooling systems and methods use first and second evaporators and first and second liquid refrigerant distribution units to increase the efficiency of the cooling systems and methods. The first evaporator is in thermal communication with an air intake flow to a heat load, and the first liquid refrigerant distribution unit is in thermal communication with the first evaporator. The second evaporator is disposed in series with the first evaporator in the air intake flow and is in thermal communication with the air intake flow, and the second liquid refrigerant distribution unit is in thermal communication with the second evaporator. A trim compression cycle of the second liquid refrigerant distribution unit is configured to further cool the air intake flow through the second evaporator when the temperature of the first fluid flowing out of a main compressor of the second liquid refrigerant distribution unit exceeds a predetermined threshold temperature.
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Patent Agency Ranking
公开(公告)号：US10254021B2
公开(公告)日：2019-04-09
申请号：US14520322
申请日：2014-10-21
Applicant: Inertech IP LLC
Inventor： Gerald McDonnell , Ming Zhang , John Costakis , Earl Keisling
Abstract: The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio.
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97.发明申请公开(公告)号：US20190044370A1
公开(公告)日：2019-02-07
申请号：US15883496
申请日：2018-01-30
Applicant: INERTECH IP LLC
Inventor： Subrata K. Mondal
CPC classification number: H02J9/06 , G06F1/30 , H02J1/10 , H02J9/04 , Y10T307/344
Abstract: An efficient, modular, direct current (DC) uninterruptible power supply (UPS) for at least one server of a data center is disclosed. The single-conversion DC UPS includes an AC-DC converter, an energy storage device electrically coupled to the output of the AC-DC converter, and a single conversion server supply DC-DC converter electrically coupled to the AC-DC converter and the energy storage device, which may be a low-voltage lithium-ion battery or combined with an ultra capacitor. The DC UPS may be incorporated into a UPS system for a data center including a plurality of server rack assemblies and a plurality of cooling distribution units (CDUs). The UPS system includes an electric generator, an AC UPS electrically coupled between the electric generator and the plurality of CDUs, and a plurality of DC UPSs coupled between the electric generator and the plurality of server rack assemblies.
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公开(公告)号：US09912251B2
公开(公告)日：2018-03-06
申请号：US15493978
申请日：2017-04-21
Applicant: Inertech IP LLC
Inventor： Subrata K Mondal
CPC classification number: H02M7/487 , H02J9/061 , H02M3/04 , H02M2007/53876
Abstract: Control systems for a multi-level diode-clamped inverter and corresponding methods include a processor and a digital logic circuit forming a hybrid controller. The processor identifies sector and region locations based on a sampled reference voltage vector V* and angle θe*. The processor then selects predefined switching sequences and pre-calculated turn-on time values based on the identified sector and region locations. The digital logic circuit generates PWM switching signals for driving power transistors of a multi-level diode-clamped inverter based on the turn-on time values and the selected switching sequences. The control system takes care of the existing capacitor voltage balancing issues of multi-level diode-clamped inverters while supplying both active and reactive power to an IT load. Using the control system, one can generate a symmetrical PWM signal that fully covers the linear under-modulation region.
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公开(公告)号：US09839163B2
公开(公告)日：2017-12-05
申请号：US15362487
申请日：2016-11-28
Applicant: Inertech IP LLC
Inventor： Earl Keisling , John Costakis , Gerald McDonnell
CPC classification number: H05K7/20745 , H05K7/20736 , H05K7/20781 , H05K7/20827 , Y10T29/49826
Abstract: A modular server rack cooling structure for cooling at least one server in at least one server rack of a data center assembly includes at least a first supporting member and at least a first heat exchanger. The first heat exchanger is coupled to the first supporting member, which is configured to position the first heat exchanger in heat transfer relationship with the at least one server. The first heat exchanger is not attached to the at least one server rack. The modular server rack cooling structure is also applied to a system that includes at least a first rack and at least a second rack disposed opposite from one another to form a hot aisle or a cold aisle. A method is disclosed for installing additional heat exchangers on the support structure of a modular server rack cooling structure to meet increased cooling capacity requirements without requiring additional space.
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公开(公告)号：US20170205119A1
公开(公告)日：2017-07-20
申请号：US15479588
申请日：2017-04-05
Applicant: Inertech IP LLC
Inventor： Ming Zhang , John Costakis
CPC classification number: F25B7/00 , F25B25/005 , F25B41/04 , F25B49/02 , F25B2500/18 , H05K7/20827
Abstract: The cooling systems of the present disclosure include a first refrigerant circuit in thermal communication with a heat load and in fluid communication with a main condenser, a free cooling circuit in fluid communication with the main condenser and a free-cooled water source, a chilled water circuit in fluid communication with the main condenser and an evaporator, and a second refrigerant circuit in fluid communication with the evaporator and a secondary condenser. The free cooling circuit is in thermal communication with the first refrigerant circuit via the main condenser, the chilled water circuit is in thermal communication with the first refrigerant circuit via the main condenser, and the second refrigeration circuit is in thermal communication with the chilled water circuit and the free cooling circuit. The second refrigeration circuit cools a fluid flowing in the chilled water circuit. Methods of operating a cooling system are also disclosed.
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