公开(公告)号：US10940694B2

公开(公告)日：2021-03-09

申请号：US16094113

申请日：2016-04-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Daryl E. Anderson ,  Michael W. Cumbie ,  James Michael Gardner ,  Berkeley Fisher

IPC: B41J2/175 ,  G01F23/00 ,  G01F23/24

Abstract: An example printing cartridge includes a sensing die including a plurality of sensing locations in thermal contact with a fluid container, an on-die controller to select a sensing location of the plurality of sensing locations to activate and to provide a variable threshold voltage, and a voltage comparator to compare a sensed voltage generated at a selected sensing location to the variable threshold voltage, and output time-based information based on the comparison, the time-based information representative of whether a fluid is present at a fluid level associated with the selected sensing location.

公开(公告)号：US20210039390A1

公开(公告)日：2021-02-11

申请号：US17083156

申请日：2020-10-28

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Michael W. Cumbie ,  Devin Alexander Mourey ,  Chien-Hua Chen

IPC: B41J2/14 ,  B41J2/16 ,  B41J2/135 ,  B41J2/175 ,  B41J2/315

Abstract: In example implementations, a method is provided, which may include providing a carrier, applying a thermal release tape over the carrier, attaching a print head die, a drive integrated circuit (IC) and an interposer on the thermal release tape, wherein the print head die comprises ink feed holes formed in a back surface of the print head die, encapsulating the print head die, the drive IC and the interposer with an epoxy molded compound (EMC), removing the carrier and the thermal release tape, and forming a slot over an area of the EMC that covers the ink feed holes, wherein the ink feed holes are to be fluidically coupled to the slot.

公开(公告)号：US20210023867A1

公开(公告)日：2021-01-28

申请号：US16607454

申请日：2018-04-13

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Jayprakash C. Bhatt ,  Michael W. Cumbie

IPC: B41M5/34 ,  B41M5/382 ,  B41J2/335

Abstract: An example of an imaging medium includes a substrate, a color-forming layer on the substrate, and a registration mark. The color-forming layer includes a repeated pattern. A repeat of the pattern includes four adjacent color-forming stripes including a black-forming stripe, a cyan-forming stripe, a magenta-forming stripe, and a yellow-forming stripe, or a grid of four color-forming sections including i) a color-forming section selected from the group consisting of black-forming, cyan-forming, light cyan-forming, yellow-forming, magenta-forming, and light magenta-forming, ii) a cyan-forming section, iii) a magenta-forming section, and iv) a yellow-forming section.

公开(公告)号：US10815121B2

公开(公告)日：2020-10-27

申请号：US16099020

申请日：2016-07-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Si-lam J. Choy ,  Chien-Hua Chen ,  Michael W. Cumbie ,  Devin Alexander Mourey

IPC: H01L23/18 ,  B81B7/00 ,  B81C1/00 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/29

Abstract: A composite wafer includes a first silicon die with a first top surface; and a polymer substrate with a top surface and a bottom surface. The silicon die is embedded in the polymer substrate such that the top surface of the substrate and the first top surface of the first silicon die are coplanar and the bottom surface of the polymer substrate is planar.

公开(公告)号：US10739181B2

公开(公告)日：2020-08-11

申请号：US16129169

申请日：2018-09-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Michael W. Cumbie ,  Robert N. K. Browning

IPC: G01F23/24 ,  B41J2/175 ,  B41J2/195 ,  G01F23/22 ,  H05B3/82

Abstract: In some examples, a liquid container comprises a chamber forming a volume containing a liquid, an elongated strip extending into the volume containing the liquid, the strip supported along a side of the volume such that a face of the strip adjacent the side of the volume is not opposed by the liquid, a plurality of heaters supported by the strip along the strip, and a plurality of temperature sensors supported by the strip along the strip.

公开(公告)号：US20200061602A1

公开(公告)日：2020-02-27

申请号：US16493084

申请日：2017-04-03

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Gary G. Lutnesky ,  Paul Schweitzer ,  Michael W. Cumbie

IPC: B01L3/02

Abstract: A cassette may include a substrate and a die coupled to the substrate wherein the substrate is made of modified polyetherimide (PEI). A system for ejecting a fluid into an assay may include at least one dispense head, the at least one dispense head including a substrate and a die coupled to the substrate wherein the substrate is made of modified polyetherimide (PEI).

公开(公告)号：US10559512B2

公开(公告)日：2020-02-11

申请号：US15763865

申请日：2015-11-16

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Stephen Farrar

IPC: B41J2/14 ,  H01L23/31 ,  H01L21/56 ,  H01L23/29

Abstract: A method of molding a circuit may include depositing a first epoxy mold compound (EMC) over a cavity, upon the first EMC gelling over a predetermined period of time, depositing a second EMC over the first EMC, and depositing a circuit in at least one of the first and second epoxy mold compounds. A circuit package may include a packaging and a circuit device in the packaging, wherein the packaging comprises a first EMC with a first CTE and a second EMC with a second CTE higher than the first CTE, the second EMC being dispensed onto the first EMC after the first EMC is allowed to gel to a predetermined degree.

公开(公告)号：US10532568B2

公开(公告)日：2020-01-14

申请号：US16061215

申请日：2016-04-14

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Vincent C. Korthuis ,  Eric T Martin ,  Michael W. Cumbie ,  Scott A Linn ,  Pere Esterri

IPC: B41J2/045

Abstract: First electronics may determine a count of bubble jet resistors to be fired by a fire pulse group. A fire pulse generator may generate a fire pulse train for bubble jet resistors, the fire pulse train comprising a precursor pulse and a firing pulse separated by a dead time. Second electronics may adjust a width of the fire pulse for the bubble jet resistors of the fire pulse group by maintaining a first edge of the fire pulse relative to the precursor pulse and adjusting a second edge of the fire pulse relative to the precursor pulse based upon the determined count for the fire pulse group.

公开(公告)号：US10464324B2

公开(公告)日：2019-11-05

申请号：US15872713

申请日：2018-01-16

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/155 ,  B41J2/14 ,  B41J2/16 ,  B41J2/145 ,  B41J25/34

Abstract: A method of manufacturing a fluid flow structure may include coupling a flex circuit to a carrier. The flex circuit may include at least one conductor. The method may include coupling an orifice side of a fluidic die to the carrier at an opening on the carrier. The fluidic die may include at least one electrical terminal. The method may include coupling the electrical terminal to the conductor, and overmolding the fluid flow structure with a moldable material. The overmolded fluid flow structure may include a channel molded therein, and the channel may be fluidically coupled to the fluidic die. The conductor may be surrounded by the moldable material.

公开(公告)号：US10434770B2

公开(公告)日：2019-10-08

申请号：US15570827

申请日：2015-07-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Garrett E. Clark ,  Michael W. Cumbie ,  Mark H. MacKenzie ,  Jose Luis Valero

IPC: B41J2/045 ,  B41J2/14 ,  B41J2/155

Abstract: A temperature of one printing element is adjusted based upon a temperature of another of printing element.