公开(公告)号：US07832925B2

公开(公告)日：2010-11-16

申请号：US11950758

申请日：2007-12-05

申请人： Matthew R. Archibald ,  Richard C. Chu ,  Hendrik F. Hamann ,  Madhusudan K. Iyengar ,  Roger R. Schmidt

发明人： Matthew R. Archibald ,  Richard C. Chu ,  Hendrik F. Hamann ,  Madhusudan K. Iyengar ,  Roger R. Schmidt

IPC分类号： G01K1/12 ,  G01K1/16 ,  G01K13/10 ,  G01K17/06

CPC分类号： G06F17/5009 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20609 ,  H05K7/20745

摘要： Apparatus and method are provided for facilitating simulation of heated airflow exhaust of an electronics subsystem, electronics rack or row of electronics racks. The apparatus includes a thermal simulator, which includes an air-moving device and a fluid-to-air heat exchanger. The air-moving device establishes airflow from an air inlet to air outlet side of the thermal simulator tailored to correlate to heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The fluid-to-air heat exchanger heats airflow through the thermal simulator, with temperature of airflow exhausting from the simulator being tailored to correlate to temperature of the heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The apparatus further includes a fluid distribution apparatus, which includes a fluid distribution unit disposed separate from the fluid simulator and providing hot fluid to the fluid-to-air heat exchanger of the thermal simulator.

摘要翻译： 提供了设备和方法，以便于模拟电子子系统，电子机架或电子机架行的热气流排气。 该装置包括热模拟器，其包括空气移动装置和流体对空气热交换器。 空气移动装置建立从热模拟器的空气入口到空气出口侧的气流，其被定制成与要模拟的电子子系统，机架或行架排的加热气流排气相关联。 流体对空气热交换器通过热模拟器加热气流，使来自模拟器的气流的温度被调整为与正在模拟的电子子系统，机架或行架的加热气流排气的温度相关。 该装置还包括流体分配装置，其包括与流体模拟器分离设置的流体分配单元，并向热模拟器的流体对空气热交换器提供热流体。

公开(公告)号：US07830664B2

公开(公告)日：2010-11-09

申请号：US12137775

申请日：2008-06-12

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： G06F1/20 ,  G06F2200/201 ,  H05K7/2079

摘要： Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at least one coolant carrying channel disposed therebetween; and a manifold for distributing coolant to and exhausting coolant from the cold plates. The cooling apparatus also includes multiple flexible hoses connecting the coolant inlets of the cold plates to the manifold, as well as the coolant outlets to the manifold, with each hose segment being disposed between a respective cold plate and the manifold. A biasing mechanism biases the cold plates away from the manifold and towards the electronics components, and at least one fastener secures the manifold to the support structure, compressing the biasing mechanism, and thereby forcing the parallel coupled cold plates towards their respective electronics components to ensure good thermal interface.

摘要翻译： 提供冷却装置和方法用于冷却包括支撑多个电子部件的平面支撑结构的组件。 冷却装置包括：多个分立的冷板，每个分别具有冷却剂入口，冷却剂出口和设置在其间的至少一个冷却剂承载通道; 以及用于将冷却剂分配到冷板并从冷板排出冷却剂的歧管。 冷却装置还包括将冷板的冷却剂入口连接到歧管的多个柔性软管以及到歧管的冷却剂出口，每个软管段设置在相应的冷板和歧管之间。 偏置机构将冷板偏离歧管并朝向电子部件，并且至少一个紧固件将歧管固定到支撑结构，压缩偏置机构，从而迫使并联的冷板朝向它们各自的电子部件以确保 良好的热界面。

公开(公告)号：US07791882B2

公开(公告)日：2010-09-07

申请号：US12108020

申请日：2008-04-23

申请人： Richard C. Chu ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Roger R. Schmidt

发明人： Richard C. Chu ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Roger R. Schmidt

IPC分类号： H05K7/20 ,  G06F1/20 ,  G05D23/00

CPC分类号： H05K7/20745 ,  H05K7/20836

摘要： Apparatus and method are provided for cooling an electronics rack in an energy efficient, dynamic manner. The apparatus includes one or more extraction mechanisms for facilitating cooling of the electronics rack, an enclosure, a heat removal unit, and a control unit. The enclosure has an outer wall, a cover coupled to the outer wall and a central opening sized to surround the electronics rack and the heat extraction mechanism. A liquid coolant loop couples the heat removal unit in fluid communication with the heat extraction mechanism, which removes heat from liquid coolant passing therethrough. The control unit is coupled to the heat removal unit for dynamically adjusting energy consumption of the heat removal unit to limit its energy consumption, while providing a required cooling to the electronics rack employing the liquid coolant passing through the heat extraction mechanism.

摘要翻译： 提供了用于以节能，动态的方式冷却电子机架的装置和方法。 该装置包括用于促进电子机架的冷却，外壳，散热单元和控制单元的一个或多个提取机构。 外壳具有外壁，联接到外壁的盖和大小为围绕电子机架和散热机构的中心开口。 液体冷却剂回路联接散热单元与散热机构的流体连通，其从通过其中的液体冷却剂中除去热量。 控制单元联接到除热单元，用于动态地调节散热单元的能量消耗以限制其能量消耗，同时使用通过热提取机构的液体冷却剂向电子机架提供所需的冷却。

公开(公告)号：US07762314B2

公开(公告)日：2010-07-27

申请号：US11739160

申请日：2007-04-24

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： F28F7/00 ,  H05K7/20

CPC分类号： F28F3/12 ,  F28F3/02 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from an electronic device. The cooling apparatus includes a manifold structure having a plurality of inlet and outlet passageways for injecting coolant onto, and exhausting coolant after impinging on, a surface to be cooled. The coolant inlet and outlet passageways are interleaved in the manifold structure, and coolant is injected and exhausted through a common edge of the manifold. The manifold structure further includes coolant inlet and outlet plenums, with coolant passing through the inlet passageways from the inlet plenum in a first direction and coolant passing through the outlet passageways to the outlet plenum in a second direction, the first and second directions being perpendicular to the surface to be cooled and being opposite directions, and wherein the manifold structure is contained within a rectangular volume defined by a projection of the common edge.

摘要翻译： 提供冷却装置和制造方法以便于从电子设备移除热量。 冷却装置包括具有多个入口和出口通道的歧管结构，该入口和出口通道用于将冷却剂喷射到待冷却的表面上并且在撞击待冷却表面之后排出冷却剂。 冷却剂入口和出口通道在歧管结构中交错，并且冷却剂通过歧管的公共边缘被注入和排出。 歧管结构还包括冷却剂入口和出口增压室，其中冷却剂沿着第一方向从入口通风室通过入口通道，并且冷却剂在第二方向上通过出口通道到出口增压室，第一和第二方向垂直于 待冷却的表面并且是相反的方向，并且其中歧管结构包含在由公共边缘的突出部限定的矩形体积内。

公开(公告)号：US07609519B2

公开(公告)日：2009-10-27

申请号：US12053863

申请日：2008-03-24

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F25B21/02

CPC分类号： H05K7/2079

摘要： A coolant control unit for a liquid cooled electronics system is provided, which includes an external coolant inlet and outlet for receiving and returning external coolant; an internal coolant loop for circulating coolant to the electronics system; a first and second control valve coupling the external coolant inlet and outlet to the internal coolant loop; a heat exchanger connected between the first and second control valves; and control logic for controlling operation of the coolant control unit in one of an external coolant mode and an internal coolant mode. In the external coolant mode, the first and second control valves allow passage of external coolant through the internal coolant loop to the electronics system, and in the internal coolant mode, the first and second control valves isolate coolant within the internal coolant loop from the external coolant inlet and outlet, and pass the coolant therein through the heat exchanger.

摘要翻译： 提供了一种用于液冷电子系统的冷却剂控制单元，其包括用于接收和返回外部冷却剂的外部冷却剂入口和出口; 用于将冷却剂循环到电子系统的内部冷却剂回路; 将外部冷却剂入口和出口连接到内部冷却剂回路的第一和第二控制阀; 连接在第一和第二控制阀之间的热交换器; 以及用于控制冷却剂控制单元在外部冷却剂模式和内部冷却剂模式之一中的操作的控制逻辑。 在外部冷却剂模式中，第一和第二控制阀允许外部冷却剂通过内部冷却剂回路到电子系统，并且在内部冷却剂模式中，第一和第二控制阀将内部冷却剂回路内的冷却剂与外部 冷却剂入口和出口，并使冷却剂通过热交换器。

公开(公告)号：US20080245506A1

公开(公告)日：2008-10-09

申请号：US12137775

申请日：2008-06-12

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： F28F7/00

CPC分类号： G06F1/20 ,  G06F2200/201 ,  H05K7/2079

摘要： Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at least one coolant carrying channel disposed therebetween; and a manifold for distributing coolant to and exhausting coolant from the cold plates. The cooling apparatus also includes multiple flexible hoses connecting the coolant inlets of the cold plates to the manifold, as well as the coolant outlets to the manifold, with each hose segment being disposed between a respective cold plate and the manifold. A biasing mechanism biases the cold plates away from the manifold and towards the electronics components, and at least one fastener secures the manifold to the support structure, compressing the biasing mechanism, and thereby forcing the parallel coupled cold plates towards their respective electronics components to ensure good thermal interface.

摘要翻译： 提供冷却装置和方法用于冷却包括支撑多个电子部件的平面支撑结构的组件。 冷却装置包括：多个分立的冷板，每个分别具有冷却剂入口，冷却剂出口和设置在其间的至少一个冷却剂承载通道; 以及用于将冷却剂分配到冷板并从冷板排出冷却剂的歧管。 冷却装置还包括将冷板的冷却剂入口连接到歧管的多个柔性软管以及到歧管的冷却剂出口，每个软管段设置在相应的冷板和歧管之间。 偏置机构将冷板偏离歧管并朝向电子部件，并且至少一个紧固件将歧管固定到支撑结构，压缩偏置机构，从而迫使并联的冷板朝向它们各自的电子部件以确保 良好的热界面。

公开(公告)号：US07400505B2

公开(公告)日：2008-07-15

申请号：US11539902

申请日：2006-10-10

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20736 ,  F28F1/20 ,  F28F1/22 ,  H05K7/20009 ,  H05K7/20554 ,  H05K7/20772

摘要： A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least one primary and at least one secondary heat generating component to be cooled; and a liquid-based cooling subsystem including at least one cold plate, physically coupled to the at least one primary heat generating component, and a thermally conductive coolant-carrying tube in fluid communication with the at least one cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and includes a plurality of thermally conductive fins extending from a surface thereof. The plurality of thermally conductive fins are disposed at least partially over the at least one secondary heat generating component to be cooled, and provide supplemental cooling of at least a portion of the air flow established across the multiple components of the electronics system.

摘要翻译： 为多组件电子系统提供混合冷却系统和制造方法。 该冷却系统包括用于建立穿过要被冷却的至少一个主要和至少一个次要发热部件的空气流的空气移动装置; 以及液体冷却子系统，其包括物理耦合到所述至少一个主发热部件的至少一个冷板和与所述至少一个冷板流体连通的导热冷却剂供给管。 导热辅助结构联接到冷却剂承载管并且包括从其表面延伸的多个导热翅片。 多个导热翅片至少部分地设置在待冷却的至少一个二次发热组件上，并且为跨越电子系统的多个部件建立的空气流的至少一部分提供补充冷却。

公开(公告)号：US07380409B2

公开(公告)日：2008-06-03

申请号：US10954792

申请日：2004-09-30

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Donald W. Porter ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Donald W. Porter ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： F25D23/12 ,  F28D15/00 ,  H05K7/20 ,  F16K31/44

CPC分类号： H05K7/20772

摘要： An isolation valve assembly, a coolant connect/disconnect assembly, a cooled multi-blade electronics center, and methods of fabrication thereof are provided employing an isolation valve and actuation mechanism. The isolation valve is disposed within at least one of a coolant supply or return line providing liquid coolant to the electronics subsystem. The actuation member is coupled to the isolation valve to automatically translate a linear motion, resulting from insertion of the electronics subsystem into the operational position within the electronics housing, into a rotational motion to open the isolation valve and allow coolant to pass. The actuation mechanism, which operates to automatically close the isolation valve when the liquid cooled electronics subsystem is withdrawn from the operational position, can be employed in combination with a compression valve coupling, with one fitting of the compression valve coupling being disposed serially in fluid communication with the isolation valve.

摘要翻译： 使用隔离阀和致动机构来提供隔离阀组件，冷却剂连接/断开组件，冷却的多叶片电子设备中心及其制造方法。 隔离阀设置在向电子子系统提供液体冷却剂的冷却剂供应或返回管线中的至少一个中。 致动构件联接到隔离阀以自动地将由电子系统子系统插入电子设备外壳内的操作位置而产生的直线运动转换成旋转运动，以打开隔离阀并允许冷却剂通过。 当液体冷却的电子子系统从操作位置退出时，操作以自动关闭隔离阀的致动机构可以与压缩阀联接一起使用，压缩阀联接器的一个配件串联设置为流体连通 与隔离阀。

公开(公告)号：US07366632B2

公开(公告)日：2008-04-29

申请号：US11195426

申请日：2005-08-02

申请人： Hendrik F. Hamann ,  Madhusudan K. Iyengar ,  James A. Lacey ,  Martin P. O'Boyle ,  Roger R. Schmidt

发明人： Hendrik F. Hamann ,  Madhusudan K. Iyengar ,  James A. Lacey ,  Martin P. O'Boyle ,  Roger R. Schmidt

IPC分类号： G01K1/06

CPC分类号： G01K1/026 ,  G01K2213/00

摘要： An apparatus and method for measuring the physical quantities of a data center during operation and method for servicing large-scale computing systems is disclosed. The apparatus includes a cart that supports a plurality of sensors. The cart is moveable within the data center. The sensors capture temperature or other physical parameters within the room. The sensor readings, along with position and orientation information pertaining to the cart are transmitted to a computer system where the data is analyzed to select the optimum temperature or other system environmental parameters for the data center.

摘要翻译： 公开了一种用于在操作期间测量数据中心的物理量的装置和方法以及用于维护大规模计算系统的方法。 该装置包括支撑多个传感器的推车。 购物车可在数据中心内移动。 传感器捕获房间内的温度或其他物理参数。 传感器读数以及与推车相关的位置和方向信息被传送到计算机系统，在该系统中分析数据以选择数据中心的最佳温度或其他系统环境参数。

公开(公告)号：US20080092387A1

公开(公告)日：2008-04-24

申请号：US11539907

申请日：2006-10-10

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： B21D53/02 ,  B23P15/26

CPC分类号： H05K7/20772 ,  H05K7/20009 ,  Y10T29/4935 ,  Y10T29/49359 ,  Y10T29/49895

摘要： A cooling system assembly method including: providing a support fixture having a multi-level support surface and multiple positioning dowels extending therefrom; positioning multiple liquid-cooled cold plates on the support surface employing the multiple dowels, the dowels providing relative positioning and alignment of the cold plates for facilitating subsequent coupling thereof to electronic components to be cooled; sealing multiple coolant-carrying tubes in fluid communication with the cold plates; and sealing a header subassembly to the coolant-carrying tubes to provide an assembled liquid-based cooling system. In operation, the support fixture facilitates shipping of the assembled cooling system by maintaining the components in fixed relation. A transfer fixture is employed in removing the cooling system from the support fixture and placing the cooling system in engagement with the electronics system. The transfer fixture includes multiple clips engaging and holding components of cooling system in fixed relation when removed from the support fixture.

摘要翻译： 一种冷却系统组装方法，包括：提供具有多级支撑表面的支撑夹具和从其延伸的多个定位销; 使用多个销钉将多个液冷冷板定位在支撑表面上，该销钉提供冷板的相对定位和对准，以便于其随后与要冷却的电子部件的耦合; 密封与冷板流体连通的多个冷却剂供给管; 并将集管组件密封到冷却剂供给管以提供组装的基于液体的冷却系统。 在操作中，支撑夹具有助于通过将部件保持固定关系来运输组装的冷却系统。 使用转移夹具来从支撑固定装置移除冷却系统并将冷却系统放置在与电子系统接合的位置。 转移夹具包括多个夹具，当从支撑固定装置移除时，将固定关系的冷却系统的部件接合并保持。