Heat sink and method of manufacturing the same
    92.
    发明授权
    Heat sink and method of manufacturing the same 有权
    散热器及其制造方法

    公开(公告)号:US08296947B2

    公开(公告)日:2012-10-30

    申请号:US12506213

    申请日:2009-07-20

    IPC分类号: B21D53/02 H05K7/20

    摘要: A heat sink includes a base with a plurality of recesses defined therein, a plurality of columned fins each having a head and a body extending from the head, and a cover joining with the base. Each head is received in and higher than a corresponding recess of the base. The heads are sandwiched between the cover and the base, whereby the columned fins are secured on the base. A portion of the cover contacting the head of each of the columned fins protrudes to form a deformed part. A method of manufacturing the heat sink is also disclosed.

    摘要翻译: 散热器包括:基部,其具有限定在其中的多个凹部;多个柱状散热片,各自具有从头部延伸的头部和主体;以及与基部接合的盖。 每个头部被接收在基座的相应凹部中并且高于基座的相应凹部。 头部被夹在盖和基座之间,由此将柱状翅片固定在基座上。 接触每个柱状翅片的头部的盖的一部分突出以形成变形部分。 还公开了一种制造散热器的方法。

    Heat dissipation device
    93.
    发明授权
    Heat dissipation device 失效
    散热装置

    公开(公告)号:US08220528B2

    公开(公告)日:2012-07-17

    申请号:US12396480

    申请日:2009-03-03

    IPC分类号: H05K7/20

    摘要: A heat dissipation device for cooling an electronic device mounted on a printed circuited board, comprises a heat spreader contacting the electronic device, a fin assembly comprising a plurality of fins, a supporting bracket contacting the heat spreader and supporting the fin assembly, and a heat pipe extending through the fin assembly and the supporting bracket and attached to the heat spreader, wherein a lowermost fin of the fin assembly has a plurality of clasps extending near two opposite ends thereof and towards the supporting bracket. The clasps are bent to press against a bottom of the supporting bracket after the clasps extend through the supporting bracket.

    摘要翻译: 一种用于冷却安装在印刷线路板上的电子装置的散热装置,包括接触电子装置的散热器,包括多个翅片的散热片组件,与散热器相接触并支撑散热片组件的支架,以及散热片 延伸穿过翅片组件和支撑托架并连接到散热器的管,其中翅片组件的最下部翅片具有多个在其两个相对端附近并朝向支撑托架延伸的钩扣。 在扣环延伸穿过支撑托架之后,该扣被弯曲以压靠支撑托架的底部。

    Heat dissipation device with heat pipe
    94.
    发明授权
    Heat dissipation device with heat pipe 有权
    散热装置带热管

    公开(公告)号:US08220527B2

    公开(公告)日:2012-07-17

    申请号:US12056295

    申请日:2008-03-27

    IPC分类号: F28D15/02

    CPC分类号: F28D15/0233

    摘要: A heat dissipation device includes a heat spreader for thermally engaging with a heat generating electronic device, a heat sink assembly located above the heat spreader, and first and second heat pipes connecting with the heat spreader and the heat sink assembly. Each of the first and second heat pipes comprises an evaporation section engaged in the heat spreader, two arc-shaped condensation sections thermally inserted in the heat sink assembly, and two connecting sections interconnecting corresponding condensation sections and the evaporation section. The condensation sections are coplanar with each other and located in a same circle. The condensation sections of the first heat pipe extend in a clockwise direction, while the condensation sections of the second heat pipe extend in an anticlockwise direction.

    摘要翻译: 散热装置包括用于与发热电子设备热接合的散热器,位于散热器上方的散热器组件,以及与散热器和散热器组件连接的第一和第二热管。 第一和第二热管中的每一个包括接合在散热器中的蒸发部分,热插入散热器组件中的两个弧形冷凝部分和互连相应的冷凝部分和蒸发部分的两个连接部分。 冷凝段彼此共面并且位于同一个圆中。 第一热管的冷凝部沿顺时针方向延伸,第二热管的冷凝部沿逆时针方向延伸。

    Heat dissipation device having a clip
    95.
    发明授权
    Heat dissipation device having a clip 失效
    具有夹子的散热装置

    公开(公告)号:US08109323B2

    公开(公告)日:2012-02-07

    申请号:US12409502

    申请日:2009-03-24

    IPC分类号: F28F7/00 H05K7/20 F28D15/00

    摘要: A heat dissipation device removing heat from a heat generating electronic device on a printed circuit board includes a base, a plurality of fins attached to the base and a clip for mounting the base and the fins onto the heat generating electronic device. Each of the fins defines a closed through hole therein. The holes of the fins cooperatively define a channel. The clip includes a locking beam extending through the channel of the fins and two fasteners engaging the locking beam mounting the base and the fins onto the heat generating electronic device.

    摘要翻译: 从印刷电路板上的发热电子装置中除去热的散热装置包括底座,安装在基座上的多个翅片以及用于将基座和翅片安装在发热电子设备上的夹子。 每个翅片在其中限定了一个封闭的通孔。 翅片的孔协同地限定通道。 夹具包括延伸穿过翅片的通道的锁定梁和两个紧固件,其接合将基座和翅片安装到发热电子设备上的锁定梁。

    Heat dissipation device
    96.
    发明授权
    Heat dissipation device 失效
    散热装置

    公开(公告)号:US08050038B2

    公开(公告)日:2011-11-01

    申请号:US12504681

    申请日:2009-07-17

    IPC分类号: H05K7/20 G06F1/20

    摘要: A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. Two engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The heat pipe extends between the two engaging portions. The two engaging portions press two opposite ends of the clip downwardly, thereby securing the heat pipe to the top face of the heat-conducting board.

    摘要翻译: 一种用于从安装在印刷电路板上的电子部件散热的散热装置,包括翅片单元,安装在电子部件上的导热板,热连接翅片单元和导热板的热管,以及 设置在热管上的夹子。 两个接合部分从导热板的顶面朝向彼此向上突出。 热管在两个接合部分之间延伸。 两个接合部分向下按压夹子的两个相对端,从而将热管固定到导热板的顶面。

    Electronic system with heat dissipation device
    97.
    发明授权
    Electronic system with heat dissipation device 有权
    具有散热装置的电子系统

    公开(公告)号:US07990719B2

    公开(公告)日:2011-08-02

    申请号:US12610388

    申请日:2009-11-02

    IPC分类号: H05K7/20 G06F1/20

    CPC分类号: H05K7/20154

    摘要: A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different heights. The heat dissipation device includes a connecting plate, at least two elastic members mounted on the connecting plate, and a heat sink having a substrate mounted on the connecting plate and located above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the substrate to attach the substrate on the one electronic component on the printed circuit board. A distance between the substrate and the connecting plate is adjustable by adjusting the joining members to make the substrate intimately contact the one electronic component.

    摘要翻译: 散热装置用于散发电子系统中安装在印刷电路板上的电子元件产生的热量。 电子元件具有不同的高度。 所述散热装置包括连接板,安装在所述连接板上的至少两个弹性部件和散热器,所述散热器具有安装在所述连接板上且位于所述电子部件之一上方的基板。 多个接合构件延伸穿过印刷电路板并与衬底接合以将衬底附着在印刷电路板上的一个电子部件上。 基板和连接板之间的距离可通过调节连接部件来调节,以使基板与一个电子部件紧密接触。

    HIGH EFFICIENCY LED DRIVER WITH CURRENT SOURCE REGULATIONS
    98.
    发明申请
    HIGH EFFICIENCY LED DRIVER WITH CURRENT SOURCE REGULATIONS 有权
    高效LED驱动器与电流源规范

    公开(公告)号:US20110080109A1

    公开(公告)日:2011-04-07

    申请号:US12762386

    申请日:2010-04-19

    IPC分类号: H05B37/02

    摘要: The present invention provides a control circuit for LED driver. A voltage-feedback circuit is coupled to LEDs to sense a voltage-feedback signal for generating a voltage loop signal. Current sources are coupled to the LEDs to control LED currents. A detection circuit is connected to sense voltages of current sources for generating a current-source loop signal in response to a minimum voltage of the current sources. Furthermore, a buffer circuit generates a feedback signal in accordance with the voltage loop signal and the current-source loop signal. The feedback signal is coupled to limit a maximum voltage of the LEDs and regulate the minimum voltage across the current sources.

    摘要翻译: 本发明提供一种LED驱动器的控制电路。 电压反馈电路耦合到LED以感测用于产生电压环路信号的电压反馈信号。 电流源耦合到LED以控制LED电流。 连接检测电路以响应于电流源的最小电压来感测用于产生电流 - 源极环路信号的电流源的电压。 此外,缓冲电路根据电压环路信号和电流 - 源极环路信号产生反馈信号。 耦合反馈信号以限制LED的最大电压并调节跨过电流源的最小电压。

    Heat dissipation device with heat pipes
    99.
    发明授权
    Heat dissipation device with heat pipes 有权
    带热管的散热装置

    公开(公告)号:US07866375B2

    公开(公告)日:2011-01-11

    申请号:US11566003

    申请日:2006-12-01

    摘要: A heat dissipation device includes a base (10), a plurality of fins (20), first and second heat pipes (30), (40), a fan holder (50) and a fan (60) secured to the fan holder. The first heat pipe includes a heat-receiving section (32) and two heat-discharging sections (34). The second heat pipe includes an evaporating portion (42) and two condensing portions (44). The condensing portions of the second heat pipe extend into the fins and are disposed adjacent to opposite ends of each of the fins. One heat-discharging section extends in the fins and is disposed between the condensing portions, thus allowing heat absorbed from the base to be evenly distributed throughout the fins by the heat-discharging sections and the condensing portions.

    摘要翻译: 一种散热装置,包括底座(10),多个翅片(20),第一和第二热管(30),(40),风扇架(50)和固定到风扇架的风扇(60)。 第一热管包括受热部(32)和两个散热部(34)。 第二热管包括蒸发部分(42)和两个冷凝部分(44)。 第二热管的冷凝部分延伸到翅片中并且与每个翅片的相对端相邻设置。 一个放热部分在翅片中延伸并且设置在冷凝部分之间,从而允许从基座吸收的热量通过散热部分和冷凝部分均匀分布在整个翅片上。

    ELECTRICAL CONNECTOR INTEGRALLY FORMED WITH SCREW HOLES
    100.
    发明申请
    ELECTRICAL CONNECTOR INTEGRALLY FORMED WITH SCREW HOLES 有权
    电连接器与螺丝孔一体成型

    公开(公告)号:US20100297890A1

    公开(公告)日:2010-11-25

    申请号:US12786451

    申请日:2010-05-25

    IPC分类号: H01R24/00 H01R43/20

    摘要: An electrical connector includes a plurality of terminals and an insulating housing loading terminals and defining a pair of mounting portions. Each of mounting portions has a screw hole extending along an upper to lower direction in which the electrical connector is mounted. The hole is divided into at least a first segment and a second segment below the first segment. The first segment and the second segment are tapped with a plurality of threads thereinside and open in opposite directions along a front and rear direction respectively.

    摘要翻译: 电连接器包括多个端子和绝缘壳体装载端子并限定一对安装部分。 每个安装部分具有沿安装电连接器的上下方向延伸的螺孔。 孔被分成至少第一段和第一段下面的第二段。 第一段和第二段分别与其内部的多个螺纹分接,并沿着前后方向在相反的方向上打开。