Optical switch package
    96.
    发明授权
    Optical switch package 有权
    光开关封装

    公开(公告)号:US06819824B1

    公开(公告)日:2004-11-16

    申请号:US09862220

    申请日:2001-05-21

    IPC分类号: G02B626

    CPC分类号: G02B6/3582 G02B6/3556

    摘要: Optical switch packaging techniques and optical switch components are described. In one aspect, an optical switch component that includes a die mounted on an interposer is described. The die has an exposed array of mirrors that can be used as part of an optical switch. Typically, the interposer will also have a fiber array mount arranged to receive a fiber bundle and to position the fiber bundle appropriately over the array of mirrors. In some embodiments, an optical switch can be formed by putting together two mirror image interposer based optical switch components. When placing two interposer based optical switch components together, an alignment frame may be positioned between the interposers to help maintain a desired spacing between the respective arrays of mirrors. In some such embodiments, an inner housing is provided that encloses the dice, the fiber array mounts the alignment frame and portions of the interposers, but leaves connectors mounted on the interposers exposed. An outer housing may optionally be provided to encase the optical switch components and the inner housing. A resilient filler material may also be provided between the inner and outer housings to provide additional protection to the optical switch.

    摘要翻译: 描述了光开关封装技术和光开关元件。 在一个方面,描述了包括安装在插入件上的管芯的光开关元件。 裸片具有暴露的反射镜阵列,可用作光开关的一部分。 通常,插入器还将具有布置成接收光纤束并将光纤束适当地定位在镜阵列上的光纤阵列安装座。 在一些实施例中,可以通过将两个基于镜像插入器的光学开关部件组合在一起来形成光学开关。 当将两个基于插入器的光学开关组件放置在一起时,对准框架可以定位在插入件之间,以帮助保持在相应的反射镜阵列之间的期望的间隔。在一些这样的实施例中,提供包围骰子的内壳体, 安装对准框架和插入件的一部分,但是将连接器安装在内插器上。 可以可选地设置外壳以包围光学开关部件和内部壳体。 还可以在内壳体和外壳体之间设置弹性填充材料,以为光开关提供额外的保护。

    Edge coupling of optical devices
    98.
    发明授权
    Edge coupling of optical devices 有权
    光学器件的边缘耦合

    公开(公告)号:US09217836B2

    公开(公告)日:2015-12-22

    申请号:US13694070

    申请日:2012-10-23

    IPC分类号: G02B6/42

    CPC分类号: G02B6/423

    摘要: A system includes optical modules. Each module includes a different base and one or more module waveguides on the base. Module waveguides from different modules are aligned such that the aligned module waveguides exchange light signals. At least a portion of one of the aligned module waveguides is between the base of one of the modules and the base of another module. First electronics operate a transmitter on a first one of the optical modules so as to generate one of the light signals. Second electronics operate a receiver on a second one of the modules such that the electronics generate an electrical signal in response to the receiver receiving one of the light signals.

    摘要翻译: 系统包括光模块。 每个模块在基座上包括不同的基座和一个或多个模块波导。 对准来自不同模块的模块波导,使得对准的模块波导交换光信号。 对准的模块波导中的一个的至少一部分在模块之一的基座和另一模块的基座之间。 第一电子装置在第一个光学模块上操作发射器,以便产生一个光信号。 第二电子装置在第二模块上操作接收器,使得电子装置响应于接收器接收光信号之一而产生电信号。

    Edge coupling of optical devices
    99.
    发明申请
    Edge coupling of optical devices 有权
    光学器件的边缘耦合

    公开(公告)号:US20140133864A1

    公开(公告)日:2014-05-15

    申请号:US13694070

    申请日:2012-10-23

    IPC分类号: H04B10/25

    CPC分类号: G02B6/423

    摘要: A system includes optical modules. Each module includes a different base and one or more module waveguides on the base. Module waveguides from different modules are aligned such that the aligned module waveguides exchange light signals. At least a portion of one of the aligned module waveguides is between the base of one of the modules and the base of another module. First electronics operate a transmitter on a first one of the optical modules so as to generate one of the light signals. Second electronics operate a receiver on a second one of the modules such that the electronics generate an electrical signal in response to the receiver receiving one of the light signals.

    摘要翻译: 系统包括光模块。 每个模块在基座上包括不同的基座和一个或多个模块波导。 对准来自不同模块的模块波导,使得对准的模块波导交换光信号。 对准的模块波导中的一个的至少一部分在模块之一的基座和另一模块的基座之间。 第一电子装置在第一个光学模块上操作发射器,以便产生一个光信号。 第二电子装置在第二模块上操作接收器,使得电子装置响应于接收器接收光信号之一而产生电信号。

    ELECTRICAL CONTACTS ON TOP OF WAVEGUIDE STRUCTURES FOR EFFICIENT OPTICAL MODULATION IN SILICON PHOTONIC DEVICES
    100.
    发明申请
    ELECTRICAL CONTACTS ON TOP OF WAVEGUIDE STRUCTURES FOR EFFICIENT OPTICAL MODULATION IN SILICON PHOTONIC DEVICES 有权
    用于在硅光电器件中进行有效光学调制的波形结构顶部的电气接触

    公开(公告)号:US20100215309A1

    公开(公告)日:2010-08-26

    申请号:US12389608

    申请日:2009-02-20

    IPC分类号: G02F1/035 H01L29/06

    摘要: A phase modulation waveguide structure includes one of a semiconductor and a semiconductor-on-insulator substrate, a doped semiconductor layer formed over the one of a semiconductor and a semiconductor-on-insulator substrate, the doped semiconductor portion including a waveguide rib protruding from a surface thereof not in contact with the one of a semiconductor and a semiconductor-on-insulator substrate, and an electrical contact on top of the waveguide rib. The electrical contact is formed of a material with an optical refractive index close to that of a surrounding oxide layer that surrounds the waveguide rib and the electrical contact and lower than the optical refractive index of the doped semiconductor layer. During propagation of an optical mode within the waveguide structure, the electrical contact isolates the optical mode between the doped semiconductor layer and a metal electrode contact on top of the electrical contact.

    摘要翻译: 相位调制波导结构包括半导体和绝缘体上半导体衬底之一,在半导体和绝缘体上半导体衬底之上形成的掺杂半导体层,掺杂半导体部分包括从 其表面不与半导体和绝缘体上半导体衬底之一接触,并且在波导肋的顶部上的电接触。 电接触由光学折射率接近包围波导肋和电接触并且低于掺杂半导体层的光折射率的周围氧化物层的材料形成。 在波导结构内的光学模式的传播期间,电接触将掺杂半导体层和电接触顶部上的金属电极接触之间的光学模式隔离开。