公开(公告)号：US06940630B2

公开(公告)日：2005-09-06

申请号：US10835344

申请日：2004-04-29

Applicant: Huikai Xie

Inventor： Huikai Xie

IPC: B81B3/00 ,  G02B6/35 ,  G02B26/08 ,  G02B26/00

CPC classification number: G02B26/0866 ,  B81B3/0018 ,  B81B2201/038 ,  B81B2201/06 ,  G02B6/3512 ,  G02B6/3526 ,  G02B6/3534 ,  G02B6/3584

Abstract: A MEMS vertical displacement device capable of moving one or more vertically displaceable platforms relative to a base. In particular, the vertical displacement device may be capable of moving a vertically displaceable platform so that the vertically displaceable platform remains generally parallel to a base. The vertically displaceable platform may be, but is not limited to, a microlens, a micromirror, micro-grating, or other device. The vertical displacement device may also be included in optical coherence and confocal imaging systems.

Abstract translation: 能够相对于基座移动一个或多个可垂直移位的平台的MEMS垂直位移装置。 特别地，垂直位移装置可以能够移动可垂直移动的平台，使得垂直移位的平台保持大致平行于基部。 可垂直移位的平台可以是但不限于微透镜，微镜，微光栅或其他器件。 垂直位移装置也可以包括在光学相干和共焦成像系统中。

公开(公告)号：US20050140987A1

公开(公告)日：2005-06-30

申请号：US11065017

申请日：2005-02-24

Applicant: Huikai Xie

Inventor： Huikai Xie

IPC: B81B3/00 ,  G02B6/35 ,  G02B26/08 ,  G01B11/02

CPC classification number: G02B26/0866 ,  B81B3/0018 ,  B81B2201/038 ,  B81B2201/06 ,  G02B6/3512 ,  G02B6/3526 ,  G02B6/3534 ,  G02B6/3584

Abstract: A MEMS vertical displacement device capable of moving one or more vertically displaceable platforms relative to a base. In particular, the vertical displacement device may be capable of moving a vertically displaceable platform so that the vertically displaceable platform remains generally parallel to a base. The vertically displaceable platform may be, but is not limited to, a microlens, a micromirror, micro-grating, or other device. The vertical displacement device may also be included in optical coherence and confocal imaging systems.

公开(公告)号：US20030119220A1

公开(公告)日：2003-06-26

申请号：US10284048

申请日：2002-10-29

Applicant: Boston MicroSystems, Inc.

Inventor： Richard Mlcak ,  Dharanipal Doppalapudi ,  Harry L. Tuller

IPC: H01L021/00

CPC classification number: B81B3/0089 ,  B81B3/0094 ,  B81B2201/06 ,  B81B2203/0127 ,  H01L41/094 ,  H01L41/18 ,  H01L41/316 ,  H01L41/331 ,  H01L41/332

Abstract: A micromechanical device includes a single crystal micromachined micromechanical structure. At least a portion of the micromechanical structure is capable of performing a mechanical motion. A piezoelectric epitaxial layer covers at least a part of said portion of the micromechanical structure that is capable of performing a mechanical motion. The micromechanical structure and piezoelectric epitaxial layer are composed of different materials. At least one electrically conducting layer is formed to cover at least part of the piezoelectric epitaxial layer.

Abstract translation: 微机械装置包括单晶微加工微机械结构。 微机械结构的至少一部分能够执行机械运动。 压电外延层覆盖能够执行机械运动的微机械结构的所述部分的至少一部分。 微机械结构和压电外延层由不同的材料组成。 形成至少一个导电层以覆盖至少部分压电外延层。