公开(公告)号：US20190239760A9

公开(公告)日：2019-08-08

申请号：US15421283

申请日：2017-01-31

Applicant: Kabushiki Kaisha Toshiba

Inventor： Yoshihiko Fuji ,  Hideaki Fukuzawa ,  Shiori Kaji

IPC: A61B5/021 ,  H04R19/04 ,  G01L1/12 ,  G01L9/16 ,  G01L9/00

CPC classification number: A61B5/02141 ,  B81B3/0078 ,  B81B2201/0257 ,  B81B2201/06 ,  G01L1/125 ,  G01L9/0041 ,  G01L9/16 ,  G06F3/0414 ,  H04R3/00 ,  H04R19/04 ,  H04R23/00 ,  H04R23/006 ,  H04R31/006 ,  H04R2201/003 ,  H04R2410/03 ,  H04R2420/07 ,  H04R2499/11

Abstract: According to one embodiment, a strain sensing element provided on a deformable substrate includes: a first magnetic layer; a second magnetic layer; a spacer layer; and a bias layer. Magnetization of the second magnetic layer changes according to deformation of the substrate. The spacer layer is provided between the first magnetic layer and the second magnetic layer. The second magnetic layer is provided between the spacer layer and the bias layer. The bias layer is configured to apply a bias to the second magnetic layer.

公开(公告)号：US20170046479A1

公开(公告)日：2017-02-16

申请号：US15338734

申请日：2016-10-31

Applicant: International Business Machines Corporation

Inventor： Effendi Leobandung

IPC: G06F19/22 ,  G01N27/414 ,  C12Q1/68 ,  H01L21/266 ,  H01L21/311

CPC classification number: C12Q1/6869 ,  B01L3/502707 ,  B01L3/502715 ,  B01L3/502761 ,  B81B2201/058 ,  B81B2201/06 ,  C12Q2565/629 ,  G01N27/4145 ,  G01N27/4146 ,  G01N27/4148 ,  G01N27/44791 ,  G01N33/48721 ,  H01L21/266 ,  H01L21/31111 ,  H01L21/762 ,  H01L29/78696

Abstract: Embodiments of the invention include a method for fabricating a semiconductor device, the resulting structure, and a method for using the resulting structure. A substrate is provided. A hard mask layer is patterned over at least a portion of the substrate. Regions of the substrate not protected by the hard mask are doped to form a source region and a drain region. The hard mask layer is removed. A dielectric layer is deposited on the substrate. An insulative layer is deposited on the dielectric layer. A nano-channel is created by etching a portion of the insulative layer which passes over the source region and the drain region.

Abstract translation: 本发明的实施例包括制造半导体器件的方法，所得结构以及使用所得结构的方法。 提供基板。 在掩模的至少一部分上形成硬掩模层。 不经硬掩模保护的衬底的区域被掺杂以形成源极区域和漏极区域。 去除硬掩模层。 介电层沉积在基片上。 绝缘层沉积在电介质层上。 通过蚀刻通过源极区域和漏极区域的绝缘层的一部分来产生纳米通道。

公开(公告)号：US20160158933A1

公开(公告)日：2016-06-09

申请号：US14216063

申请日：2014-03-17

Applicant: Infinite Corridor Technology, LLC ,  The Board of Trustees of the Leland Stanford Junior University

Inventor： Rebecca Elizabeth Taylor ,  Beth L. Pruitt ,  Mary C. Boyce ,  Christopher M. Boyce

IPC: B25J7/00

CPC classification number: B81B3/0048 ,  B81B2201/038 ,  B81B2201/042 ,  B81B2201/06 ,  B81B2203/058 ,  B81B2203/06 ,  G02B26/0825 ,  G02B26/0833

Abstract: A micromechanical device capable of providing out-of-plane motion and force generation in response to an in-plane strain applied to the device is provided. Embodiments of the present invention comprise one or more islands that are operatively coupled with one or more hinges. The hinges are operative for inducing rotation of the islands when a lateral strain is applied to the structure. In some embodiments, the hinges are also electrically conductive such that they enable electrical communication between the one or more islands and devices external to the structure. Some embodiments of the present invention are particularly well suited for use in biological applications. Some devices in accordance with the present invention are fabricated using conventional planar processes, such as flex-circuit fabrication techniques.

Abstract translation: 提供了一种能够响应于施加到设备的平面内应变来提供面外运动和力产生的微机械装置。 本发明的实施例包括与一个或多个铰链可操作地联接的一个或多个岛。 当向结构施加横向应变时，铰链用于引起岛的旋转。 在一些实施例中，铰链也是导电的，使得它们使得能够在结构外部的一个或多个岛和装置之间进行电连通。 本发明的一些实施方案特别适用于生物应用。 根据本发明的一些装置使用诸如柔性电路制造技术的常规平面工艺制造。

公开(公告)号：US20130270225A1

公开(公告)日：2013-10-17

申请号：US13862023

申请日：2013-04-12

Applicant: Technische Universitaet Ilmenau

Inventor： Joerg Hampl ,  Frank Weise ,  Gregor Schlingloff ,  Andreas Schober ,  Uta Fernekorn

IPC: B44C1/22

CPC classification number: B44C1/227 ,  B81B2201/06 ,  B81B2203/0346 ,  B81B2207/056 ,  B81C99/0085 ,  B81C2201/034 ,  Y10T428/24281

Abstract: A method is provided for producing a microstructured molded object that is intended for culturing of biological cells. According to this method, a plastically deformable first porous film is prepared, as well as a deformable second film and a deformable sacrificial film. The first, second and sacrificial film are placed in a stack. Next, the sacrificial film is subjected to pressure to press the stack into a mold. The mold has recesses, such that deformed regions in the form of cavities are produced in the sacrificial film, the first film and the second film, and undeformed regions remain. During the pressing of the film stack into the mold, the first film and the second film are joined to each other, so that they form a composite film. At least portions of the deformed regions of the second film are etched so that sections of the second film are chemically dissolved. In these sections of the second film, sections in the deformed regions of the first film are opened up, so that the pores in these sections are again free.

Abstract translation: 提供了用于生产用于培养生物细胞的微结构模制物体的方法。 根据该方法，制备可塑性变形的第一多孔膜，以及可变形的第二膜和可变形的牺牲膜。 第一，第二和牺牲膜被放置在堆叠中。 接下来，牺牲膜经受压力以将叠层压入模具中。 模具具有凹部，使得在牺牲膜，第一膜和第二膜中产生空腔形式的变形区域，并且保留未变形的区域。 在将膜堆叠压入模具期间，第一膜和第二膜彼此接合，从而形成复合膜。 蚀刻第二膜的变形区域的至少部分，使得第二膜的部分化学溶解。 在第二膜的这些部分中，第一膜的变形区域中的部分被打开，使得这些部分中的孔再次游离。

公开(公告)号：US20120282682A1

公开(公告)日：2012-11-08

申请号：US13505417

申请日：2010-10-28

Applicant: Peter Walsh ,  David Albin ,  Martin Gouch

Inventor： Peter Walsh ,  David Albin ,  Martin Gouch

IPC: B81C1/00 ,  B32B37/00 ,  B05D1/02 ,  B05D3/00 ,  C12M1/34 ,  B01L3/00

CPC classification number: B01L3/502707 ,  B01L3/50273 ,  B01L3/502738 ,  B01L3/502746 ,  B01L2300/047 ,  B01L2300/0809 ,  B01L2300/0822 ,  B01L2300/161 ,  B01L2400/0487 ,  B81B2201/0214 ,  B81B2201/06 ,  B81B2203/0338 ,  B81B2207/056 ,  B81C1/00119 ,  G01N33/54366 ,  Y10T29/49885 ,  Y10T156/10

Abstract: A method is provided of forming a micro-channel structure for use in a biosensing device. A master structure is provided having a first configuration of micro-channels with respective first fluid flow characteristics. One or more regions of material are deposited onto the master structure using a fluidjet process so as to modify the first configuration into a second configuration having respective second fluid flow characteristics, different from the first. Functional biosensing devices formed using the method are also described.

Abstract translation: 提供一种形成用于生物传感装置的微通道结构的方法。 提供具有具有相应的第一流体流动特性的微通道的第一构造的主结构。 使用流体喷射方法将一个或多个材料区域沉积到主结构上，以便将第一配置改变成具有与第一配置不同的具有相应的第二流体流动特性的第二配置。 还描述了使用该方法形成的功能生物传感装置。

公开(公告)号：US07541257B2

公开(公告)日：2009-06-02

申请号：US11519064

申请日：2006-09-12

Applicant: Eiji Ishikawa ,  Takaaki Aoki

Inventor： Eiji Ishikawa ,  Takaaki Aoki

IPC: H01L21/76

CPC classification number: H01L31/035281 ,  B81B2201/058 ,  B81B2201/06 ,  B81C1/00071 ,  B81C2201/0169 ,  Y02E10/50

Abstract: A semiconductor device includes: a silicon substrate; and a silicon oxide film disposed on the silicon substrate. The silicon oxide film includes a part, which separates from a surface of the silicon substrate, so that the silicon oxide film provides a three-dimensional construction. By using the three-dimensional construction, an additional function such as a resistor or a capacitor is easily added in the device. Further, a manufacturing method of this three-dimensional construction is simple and has a low cost.

Abstract translation: 半导体器件包括：硅衬底; 以及设置在硅衬底上的氧化硅膜。 氧化硅膜包括从硅衬底的表面分离的部分，使得氧化硅膜提供三维结构。 通过使用三维构造，在该装置中容易添加诸如电阻器或电容器的附加功能。 此外，该三维构造的制造方法简单，成本低。

公开(公告)号：US20090060782A1

公开(公告)日：2009-03-05

申请号：US11817944

申请日：2006-03-30

Applicant: Takaaki Shimasaki

Inventor： Takaaki Shimasaki

IPC: G01N21/78 ,  B32B37/00 ,  B32B37/30 ,  B29C45/17 ,  B01J19/00

CPC classification number: B01L3/502707 ,  B01L2200/0689 ,  B01L2200/12 ,  B01L2300/0636 ,  B01L2300/0816 ,  B01L2300/0887 ,  B29C65/1406 ,  B29C65/1435 ,  B29C65/1454 ,  B29C65/1483 ,  B29C65/1496 ,  B29C65/1606 ,  B29C65/1616 ,  B29C65/1635 ,  B29C65/1654 ,  B29C65/1677 ,  B29C65/1683 ,  B29C65/1696 ,  B29C66/0044 ,  B29C66/112 ,  B29C66/1122 ,  B29C66/131 ,  B29C66/43 ,  B29C66/45 ,  B29C66/53461 ,  B29C66/54 ,  B29C66/5412 ,  B29C66/71 ,  B29C66/723 ,  B29C66/73115 ,  B29C66/7332 ,  B29C66/73361 ,  B29C66/73365 ,  B29C66/73921 ,  B29C66/8122 ,  B29C66/81267 ,  B29C66/8322 ,  B29K2021/003 ,  B29K2023/00 ,  B29K2023/083 ,  B29K2025/00 ,  B29K2027/06 ,  B29K2033/04 ,  B29K2075/00 ,  B29K2077/00 ,  B29K2101/12 ,  B29K2909/08 ,  B29K2995/0027 ,  B29K2995/0072 ,  B29L2031/756 ,  B81B2201/06 ,  B29K2883/00 ,  B29K2827/12 ,  B29C65/00 ,  B29K2069/00 ,  B29K2067/003 ,  B29K2059/00 ,  B29K2055/02 ,  B29K2033/12 ,  B29K2025/06 ,  B29K2023/18 ,  B29K2023/12 ,  B29K2023/06

Abstract: A method for bonding a first substrate and a second substrate includes the steps of forming the main body of at least one of the first substrate and the second substrate from an optically transmissive material that transmits light, forming at least part of the bonding faces of the first substrate and the second substrate from a thermoplastic resin that contains an optical absorption agent that absorbs light, and bonding the first substrate and the second substrate together by irradiating the optical absorption agent of the bonding faces with light via the substrate that transmits light.

Abstract translation: 一种用于接合第一基板和第二基板的方法包括以下步骤：从透光的光学透镜材料形成第一基板和第二基板中的至少一个的主体，形成至少一部分接合面的接合面 第一基板和第二基板，其包含吸收光的光吸收剂的热塑性树脂，并且通过经由透射基板的基板用光照射接合面的光吸收剂来将第一基板和第二基板接合在一起。

公开(公告)号：US20070066052A1

公开(公告)日：2007-03-22

申请号：US11519064

申请日：2006-09-12

Applicant: Eiji Ishikawa ,  Takaaki Aoki

Inventor： Eiji Ishikawa ,  Takaaki Aoki

IPC: H01L21/4763 ,  H01L29/06

CPC classification number: H01L31/035281 ,  B81B2201/058 ,  B81B2201/06 ,  B81C1/00071 ,  B81C2201/0169 ,  Y02E10/50

Abstract: A semiconductor device includes: a silicon substrate; and a silicon oxide film disposed on the silicon substrate. The silicon oxide film includes a part, which separates from a surface of the silicon substrate, so that the silicon oxide film provides a three-dimensional construction. By using the three-dimensional construction, an additional function such as a resistor or a capacitor is easily added in the device. Further, a manufacturing method of this three-dimensional construction is simple and has a low cost.

Abstract translation: 半导体器件包括：硅衬底; 以及设置在硅衬底上的氧化硅膜。 氧化硅膜包括从硅衬底的表面分离的部分，使得氧化硅膜提供三维结构。 通过使用三维构造，在该装置中容易添加诸如电阻器或电容器的附加功能。 此外，该三维构造的制造方法简单，成本低。

公开(公告)号：US20060236436A1

公开(公告)日：2006-10-19

申请号：US10544801

申请日：2004-02-13

Applicant: Yangyang Li ,  Frederique Cunin ,  Michael Sailor ,  Jamie Link ,  Ting Gao

Inventor： Yangyang Li ,  Frederique Cunin ,  Michael Sailor ,  Jamie Link ,  Ting Gao

IPC: H01L51/40

CPC classification number: B29D11/00346 ,  B29D11/0074 ,  B81B2201/06 ,  B81B2203/0361 ,  B81C99/0085 ,  B81C2201/0115 ,  B81C2201/034 ,  Y10S977/921

Abstract: A method of generating three-dimensional nanostructures that includes providing a silicon substrate, creating a porous silicon template from the silicon substrate, wherein the template is created to have a predetermined configuration, depositing a predetermined material on the porous silicon template, and removing the porous silicon template from the deposited material to leave a freestanding nanostructure.

Abstract translation: 一种产生三维纳米结构的方法，其包括提供硅衬底，从所述硅衬底产生多孔硅模板，其中所述模板被创建为具有预定构型，在所述多孔硅模板上沉积预定材料，以及除去所述多孔硅模板 硅模板从沉积的材料离开独立的纳米结构。

公开(公告)号：US20040238484A1

公开(公告)日：2004-12-02

申请号：US10480082

申请日：2004-07-12

Inventor： Bruno Le Pioufle ,  Horoyuki Fujita ,  Eiichi Tamiya ,  Laurent Griscom ,  Patrick Degenaar

IPC: H05H001/26 ,  B29C033/40 ,  B29C059/16

CPC classification number: B01J19/00 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00833 ,  B01J2219/00907 ,  B01L3/502707 ,  B01L2200/12 ,  B29C33/3842 ,  B29C33/424 ,  B29K2995/0093 ,  B81B2201/058 ,  B81B2201/06 ,  B81B2203/0127 ,  B81C1/00119 ,  B81C2201/034 ,  G01N27/44791

Abstract: A method of manufacturing a microfluidic structure, in particular a biochip, said method consisting at least: in manufacturing a three-dimensional micro-mould with means for defining a three-dimensional geometry including at least micro-wells and micro-grooves or micro-channels interconnecting said micro-wells; and in using only said three-dimensional micro-mould for molding a membrane made of a polymer material, said membrane incorporating at least said micro-wells and said micro-grooves or micro-channels, said membrane constituting a three-dimensional microfluidic structure.

Abstract translation: 一种制造微流体结构，特别是生物芯片的方法，所述方法至少包括：制造三维微型模具，其具有用于限定至少包括微孔和微凹槽或微凹槽的三维几何形状的装置， 连接所述微孔的通道; 并且仅使用用于模制由聚合物材料制成的膜的所述三维微型模具，所述膜至少包含所述微孔和所述微槽或微通道，所述膜构成三维微流体结构。