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公开(公告)号：US20090014335A1
公开(公告)日：2009-01-15
申请号：US12156839
申请日：2008-06-05
申请人： Yutaka Morii , Masanori Orihashi
发明人： Yutaka Morii , Masanori Orihashi
摘要： A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
摘要翻译： 一种金合金电镀液及其电镀方法，其通过使用含有氰化金，钴离子，六亚甲基四胺的金镀液和特定的光泽剂，提供具有高沉积选择性的镀金溶液。
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公开(公告)号：US20090000953A1
公开(公告)日：2009-01-01
申请号：US11894444
申请日：2007-08-21
IPC分类号： C25D3/62
CPC分类号： C25D3/62
摘要： A hard gold plating solution and plating method which provides a gold plating solution with high deposition selectivity using a gold plating solution containing gold cyanide, cobalt salt, and hexamethylenetetramine.
摘要翻译： 使用含有氰化金，钴盐和六亚甲基四胺的镀金溶液提供具有高沉积选择性的镀金溶液的硬金镀液和电镀方法。
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公开(公告)号：US07431817B2
公开(公告)日：2008-10-07
申请号：US11126954
申请日：2005-05-10
申请人： Hana Hradil , George Hradil , Edward Hradil
发明人： Hana Hradil , George Hradil , Edward Hradil
CPC分类号： C25D3/62
摘要： The invention relates to an electrolyte used in connection with the deposition of a gold-tin alloy on an electroplatable substrate. This solution generally includes water; stannous and/or stannic tin ions, a complexing agent to render the stannous and/or stannic tin ions soluble, complexed gold ions, and an alloy stabilizing agent that includes ethoxylated compounds with phosphate ester functional group, brightening additives based on ethoxylated phosphate esters and alkali metal fatty acids dipropionates. The brighteners may be used alone or in conjunction with each other to achieve beneficial synergistic effect. The alloy stabilizing agent is present in an amount sufficient to stabilize the composition of the gold-tin deposit over a usable current density range. The solution has a pH of between 2 and 10 and the gold ions and tin ions are present in relative amounts sufficient to provide a deposit having a gold content less than 90% by weight and a tin content greater than 10% by weight.
摘要翻译： 本发明涉及一种与在可电镀基底上沉积金 - 锡合金有关的电解质。 该溶液通常包括水; 亚锡和/或锡锡离子，一种使锡和/或锡锡离子可溶的络合剂，络合的金离子和包含具有磷酸酯官能团的乙氧基化合物的合金稳定剂，基于乙氧基化磷酸酯的增亮添加剂和 碱金属脂肪酸二丙酸酯。 增白剂可以单独使用或者彼此结合使用以实现有益的协同效应。 合金稳定剂的存在量足以在可用的电流密度范围内稳定金 - 锡沉积物的组成。 该溶液的pH值在2至10之间，金离子和锡离子以足以提供金含量小于90重量％且锡含量大于10重量％的沉积物的相对量存在。
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公开(公告)号：US20050252783A1
公开(公告)日：2005-11-17
申请号：US11126954
申请日：2005-05-10
申请人： Hana Hradil , George Hradil , Edward Hradil
发明人： Hana Hradil , George Hradil , Edward Hradil
CPC分类号： C25D3/62
摘要： The invention relates to an electrolyte used in connection with the deposition of a gold-tin alloy on an electroplatable substrate. This solution generally includes water; stannous and/or stannic tin ions, a complexing agent to render the stannous and/or stannic tin ions soluble, complexed gold ions, and an alloy stabilizing agent that includes ethoxylated compounds with phosphate ester functional group, brightening additives based on ethoxylated phosphate esters and alkali metal fatty acids dipropionates. The brighteners may be used alone or in conjunction with each other to achieve beneficial synergistic effect. The alloy stabilizing agent is present in an amount sufficient to stabilize the composition of the gold-tin deposit over a usable current density range. The solution has a pH of between 2 and 10 and the gold ions and tin ions are present in relative amounts sufficient to provide a deposit having a gold content less than 90% by weight and a tin content greater than 10% by weight.
摘要翻译： 本发明涉及一种与在可电镀基底上沉积金 - 锡合金有关的电解质。 该溶液通常包括水; 亚锡和/或锡锡离子，一种使锡和/或锡锡离子可溶的络合剂，络合的金离子和包括具有磷酸酯官能团的乙氧基化合物的合金稳定剂，基于乙氧基化磷酸酯的增亮添加剂和 碱金属脂肪酸二丙酸酯。 增白剂可以单独使用或者彼此结合使用以实现有益的协同效应。 合金稳定剂的存在量足以在可用的电流密度范围内稳定金 - 锡沉积物的组成。 该溶液的pH值在2至10之间，金离子和锡离子以足以提供金含量小于90重量％且锡含量大于10重量％的沉积物的相对量存在。
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95.发明申请公开(公告)号：US20040065225A1
公开(公告)日：2004-04-08
申请号：US10469146
申请日：2003-08-27
发明人： Susanne Ruebel , Manfred Stuemke
IPC分类号： C25D003/48
摘要： The invention relates to a bath for the electrodeposition of gold and gold alloys and to its use for producing dental moldings. In this bath, the gold is in the form of a gold sulfite complex. The bath according to the invention and/or the use according to the invention is distinguished by the fact that in addition to the optional presence of further metals and standard additives for gold sulfite baths of this type, there is at least one bismuth compound. This bismuth compound is preferably a complex compound, in particular with the complex-forming agents NTA, HEDTA, TEPA, DTPA, EDNTA or EDTA. The invention has a whole range of advantages associated with it. One advantage which should be particularly emphasized is that the addition of bismuth can be added to the bath as early as during its preparation. This means that the user is provided with a bath which is able to function for a prolonged period of time and to which it is not imperative to add further additives prior to the electrodeposition.
摘要翻译： 本发明涉及一种用于电沉积金和金合金的浴及其用于生产牙科用品的用途。 在这个洗澡中，金子是亚硫酸金属复合物的形式。 根据本发明的浴和/或根据本发明的用途的区别在于，除了任选存在其它金属和这种类型的亚硫酸铜浴的标准添加剂之外，还存在至少一种铋化合物。 该铋化合物优选为络合物，特别是与络合物形成剂NTA，HEDTA，TEPA，DTPA，EDNTA或EDTA。 本发明具有与之相关的全部优点。 应特别强调的一个优点是，可以在制备过程中尽早加入铋。 这意味着给用户提供能够延长时间功能的浴，并且在电沉积之前不必再添加其它添加剂。
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公开(公告)号：US4744871A
公开(公告)日：1988-05-17
申请号：US56546
申请日：1987-06-01
申请人： Jean A. Lochet
发明人： Jean A. Lochet
摘要： Gold plating baths comprising a nickel or cobalt brightener/hardener, containing a dicarboxylic acid having the formula HOOC--(CH.sub.2).sub.n --COOH in which n is an integer from 1 to 4 and mixtures thereof, an acid selected from the group consisting of malic acid, gluconic acid and formic acid and mixtures thereof, plus optionally oxalic acid, enable the use of high current densities with attainment of improved efficiencies in producing bright deposits; also enable bright deposits to be obtained at high temperatures of about 150.degree. F.
摘要翻译： 包含镍或钴增白剂/硬化剂的镀金浴，其含有式为HOOC-（CH 2）n -COOH的二羧酸，其中n为1至4的整数，及其混合物，选自苹果酸 酸，葡萄糖酸和甲酸及其混合物，加上任选的草酸，使得能够使用高电流密度，从而提高生产明亮沉积物的效率; 也可以在约150°F的高温下获得明亮的沉积物。
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公开(公告)号：US4717459A
公开(公告)日：1988-01-05
申请号：US845522
申请日：1986-03-28
摘要： An electrolytic gold plating solution including a soluble gold salt, a conductivity salt, and, in addition, a mixture of a lead compound and a complexing agent having the stability constant with lead of not less than 15 or a complex obtained from the lead compound and the complexing agent and/or an amine compound having a pyrrolidine, piperazine, piperidine, or pyridine skeleton.
摘要翻译： 一种包含可溶性金盐，电导率盐，以及铅化合物与铅的稳定常数不小于15的络合剂或由铅化合物获得的络合物的混合物的电解镀金液，以及 络合剂和/或具有吡咯烷，哌嗪，哌啶或吡啶骨架的胺化合物。
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公开(公告)号：US4615774A
公开(公告)日：1986-10-07
申请号：US696932
申请日：1985-01-31
IPC分类号： C25D3/62
CPC分类号： C25D3/62
摘要： A citrate-free electroplating bath for the high speed deposition of gold alloy plates on substrates comprises a source of gold (for example gold (I) potassium cyanide), a source of alloying metal (for example, nickel sulfate), oxalic acid and formic acid. As citrate is not used, higher plating speeds are obtained and precipitates of certain citrate salts (for example, nickel citrate) are avoided.
摘要翻译： 用于在基底上高速沉积金合金板的无柠檬酸电镀浴包括金源（例如，金（I）氰化钾），合金金属（例如硫酸镍）源，草酸和甲酸 酸。 由于不使用柠檬酸盐，因此可获得较高的电镀速度，并避免某些柠檬酸盐（例如柠檬酸镍）的沉淀。
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公开(公告)号：US4586998A
公开(公告)日：1986-05-06
申请号：US642166
申请日：1984-08-20
申请人： Nicholas S. Wood
发明人： Nicholas S. Wood
CPC分类号： C25D3/62 , C25B11/0473
摘要： A method of producing a cathode which operates at low hydrogen over-voltage in the electrolysis of water or aqueous solutions by electrodepositing on a nickel or nickel alloy substrate a coating comprising at least an outer layer of at least one platinum group metal, the outer layer of the platinum group metal being deposited from a plating bath which contains a solution of at least one platinum group metal compound and at least one additive of the type which supresses maxima in polarographic waves associated with reactions carried out at a dropping mercury electrode, said additive being further selected from those which do not react with the platinum group metal in the plating bath.
摘要翻译： 一种制造阴极的方法，所述阴极在通过电沉积在镍或镍合金基底上的水或水溶液的电解中在低氢过电压下工作，所述涂层包括至少一层至少一种铂族金属的外层，外层 所述铂族金属由含有至少一种铂族金属化合物的溶液和至少一种抑制与在滴汞工序进行的反应相关的极谱波中最大值的添加剂的电镀浴沉积，所述添加剂 进一步选自不与镀浴中的铂族金属反应的那些。
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公开(公告)号：US4470886A
公开(公告)日：1984-09-11
申请号：US454503
申请日：1983-01-04
申请人： Robert Duva , Daniel R. Marx
发明人： Robert Duva , Daniel R. Marx
摘要： Improved electroplating ternary gold alloy plating baths wherein the gold ingredient is an alkali metal auricyanide, the gold metal being in the plus three oxidation state, and the alloying metals are both cobalt and molybdenum. The electroplating baths also contain citric acid. A wetting agent or surfactant as well as a stress reducer-brightener are also advantageously utilized in the bath. The ternary alloys may be deposited on various electronic and decorative substrates, and the deposits were characterized by unique physical and mechanical properties. Most importantly, there is a substantial improvement in wear resistance. The method of utilizing such improved electroplating baths on various substrates is also described and claimed.
摘要翻译： 改进的电镀三元金合金电镀浴，其中金成分是碱金属亚硝酸盐，金属金属处于正三氧化态，合金金属都是钴和钼。 电镀浴还含有柠檬酸。 润湿剂或表面活性剂以及应力减轻剂 - 增白剂也有利地用于浴中。 三元合金可以沉积在各种电子和装饰性基材上，并且沉积物的特征在于独特的物理和机械性质。 最重要的是，耐磨性有很大提高。 还描述和要求保护在各种基板上使用这种改进的电镀浴的方法。
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