Retainer
    101.
    发明授权
    Retainer 有权

    公开(公告)号:US11031316B2

    公开(公告)日:2021-06-08

    申请号:US16587188

    申请日:2019-09-30

    发明人: Yan-Sian Jheng

    IPC分类号: A47B97/00 H01L23/40 F16M13/02

    摘要: The disclosure provides a retainer which is configured to be mounted on and fix heat dissipation module onto chip platform. The retainer includes pressing portion, first and second latching portions. The first latching portion includes flat portion and flexible curved portion, the flexible curved portion is connected between the pressing portion and the flat portion, long side of the flat portion is substantially perpendicular to a long side of the pressing portion. The second latching portion is connected to the pressing portion. A long side of the second latching portion is substantially perpendicular to the long side of the pressing portion. The first portion and the second latching portion are configured to be detachably engaged at two opposite sides of the chip platform so as to deform the flexible curved portion and utilize the flexible curved portion to enhance a pressing force applied to the heat dissipation module.

    LIGHT EMITTING FAN DEVICE AND NON-LIGHT EMITTING FAN DEVICE

    公开(公告)号:US20210102547A1

    公开(公告)日:2021-04-08

    申请号:US17027329

    申请日:2020-09-21

    发明人: Lin TSUNG-WEI

    摘要: A cooling device includes a fan frame including a bottom plate and a base part disposed on the bottom plate, a stationary pillar coupled to the fan frame, and a fan assembly that is rotatably disposed about the stationary pillar. The fan assembly is supported on the stationary pillar by at least one bearing positioned between the fan assembly and the stationary pillar. The cooling device also includes a decorative plate coupled to the stationary pillar. The decorative plate has an identifying indicia that permits at least some light to pass therethrough. The cooling device further includes a light emitting assembly disposed on the fan frame and configured to emit light that is directed toward the identifying indicia.

    Thermal conducting structure
    105.
    发明授权

    公开(公告)号:US10935326B2

    公开(公告)日:2021-03-02

    申请号:US16444771

    申请日:2019-06-18

    摘要: A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh extends through the opening into the cavity to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.

    External heat dissipation device and temperature adjusting device

    公开(公告)号:US10824210B2

    公开(公告)日:2020-11-03

    申请号:US16140623

    申请日:2018-09-25

    摘要: An external heat dissipation device includes an airflow-guiding base and a refrigerating device. The airflow-guiding base has a supporting surface and a perforation located thereon. The refrigerating device includes a casing, a thermoelectric cooler, a cold air transferring assembly and a hot air transferring assembly. The casing has a storage space. The thermoelectric cooler is located in the storage space and has a cooling surface and a heat releasing surface opposite to each other. The cold air transferring assembly includes a cooling plate and a cooling radiator, and the cooling plate is in thermal contact with the cooling surface. The hot air transferring assembly includes a cooling plate and a cooling radiator, and the cooling plate is in thermal contact with the heat releasing surface. The storage space is divided into a cold chamber and a hot chamber by the thermoelectric cooler and the cooling plates.

    COOLING DEVICE
    107.
    发明申请
    COOLING DEVICE 审中-公开

    公开(公告)号:US20200332804A1

    公开(公告)日:2020-10-22

    申请号:US16389618

    申请日:2019-04-19

    发明人: Fu-Lung LIN

    IPC分类号: F04D29/00

    摘要: A cooling device includes a frame including a base portion and a barrel portion connected to the base portion, a fan assembly including a hub and a plurality of fan blades connected to the hub, the fan assembly rotatably coupled to the frame via at least one bearing positioned between the barrel part and the hub, a driving assembly disposed on the frame, and a decorative plate having a marking and a column coupled thereto and extending therefrom. The decorative plate is coupled to the base portion using the column and is stationary with respect to the fan assembly. The cooling device further includes a light assembly disposed on the driving assembly and emitting light that illuminates the marking.

    HEAT DISSIPATION ASSEMBLY, AIR PIPE ASSEMBLY, AND TABLE HAVING HEAT DISSIPATION DEVICE

    公开(公告)号:US20200272212A1

    公开(公告)日:2020-08-27

    申请号:US15931361

    申请日:2020-05-13

    发明人: Wen-Hsien LIN

    IPC分类号: G06F1/20 F24F1/022 H05K7/20

    摘要: A heat dissipation device for electronic device, a heat dissipation assembly, an air pipe assembly and a table. The heat dissipation device includes a refrigerator, an air pipe assembly and a heat dissipation assembly. The refrigerator has a cool air opening. The air pipe assembly has a first and second end portions, the first end portion detachably connects to the cool air opening. The heat dissipation assembly has a base body detachably connected to the refrigerator and a supporting plate pivoted to the base body. When the supporting plate is in a first position, the supporting plate has a first angle with a bottom plate of the base body. When the supporting plate is in a second position, the supporting plate has a second angle with the bottom plate. The second end portion is detachably connected to the supporting plate and is movably disposed in the air permeable.

    Fluid connector assembly
    109.
    发明授权

    公开(公告)号:US10739833B2

    公开(公告)日:2020-08-11

    申请号:US16140604

    申请日:2018-09-25

    摘要: The disclosure provides a connector assembly which includes a first connector module, a second connector module and a connection assistance module. The first connector module includes a first carrier and two first connectors which are fixed to the first carrier. The second connector module includes a second carrier and two second connectors which are fixed to the second carrier. The second connectors are respectively and detachably connected to the first connectors. The connection assistance module includes a rotatable component and an assembled component respectively disposed on the first carrier and the second carrier. The rotatable component has an inclined surface, and the assembled component has an engaging portion. When the rotatable component is rotated, the engaging portion is guided by the inclined surface so that the first carrier is moved toward or away from the second carrier, allowing the first connectors to be detachably connected to the second connectors.

    Vane, fan blade and fan including the same

    公开(公告)号:US10690143B2

    公开(公告)日:2020-06-23

    申请号:US16103162

    申请日:2018-08-14

    IPC分类号: F04D29/38 H05K7/20 F04D19/00

    摘要: A fan blade includes a hub and a plurality of vanes. The vanes are connected to the hub. Each of the vanes includes a main body and a guide plate. The main body has an inflow surface and an outflow surface. The guide plate is disposed on the outflow surface. When the fan blade rotates, an airflow occurs and flows into a side of the fan blade via the inflow surface, and the guide plate guides part of the airflow to flow out of another side of the fan blade in a first direction and a second direction so as to cool an electronic component disposed adjacent to the another side of the fan blade.