-
公开(公告)号：US10414122B2
公开(公告)日：2019-09-17
申请号：US15459409
申请日：2017-03-15
Applicant: INTERFACE TECHNOLOGY (CHENGDU) CO., LTD. , INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD. , GENERAL INTERFACE SOLUTION LIMITED
Inventor： Chin-Yang Wu
IPC: B32B7/02 , B32B27/36 , G06F3/00 , B29C45/14 , B29L31/30 , B29K69/00 , B29K633/04 , B29K669/00 , B29L31/34
Abstract: A low-stress line workpiece and a method for integrally forming the same is disclosed. Firstly, an in-mold injection molding mold is provided, wherein a function film, a 3D curved-surface plastic material, and an anti-rainbow stripe combination layer are placed in the in-mold injection molding mold. The in-mold injection molding mold is used to mold the function film, the plastic material and the combination layer into a low-stress line workpiece integrally formed by in-mold forming. The low-stress line workpiece includes the function film, the plastic layer and the combination layer, wherein the plastic layer is located between the function film and the combination layer. The present invention provides a low-stress line workpiece with high surface hardness and a method for forming the same to reduce lamination fabrication processes and improve lamination yield.
-
公开(公告)号：US10386979B2
公开(公告)日：2019-08-20
申请号：US15818776
申请日：2017-11-21
Applicant: Interface Technology (ChengDu) Co., Ltd. , Interface Optoelectronics (ShenZhen) Co., Ltd. , General Interface Solution Limited
Inventor： Chun-Ming Chen
Abstract: The present disclosure provides a touch panel structure, including a display device, a dielectric layer, a first sensing circuit, a second sensing circuit and a shielding layer. The dielectric layer is disposed on the display device. The first sensing circuit includes a plurality of first sensing electrodes and a plurality of conducting bridges, wherein the first sensing electrodes are disposed on the dielectric layer, and the conducting bridges are disposed between the dielectric layer and the display device. Adjacent ones of the first sensing electrodes are electrically connected with each other through one of the conducting bridges. The second sensing circuit includes a plurality of second sensing electrodes, which are disposed on the dielectric layer. The second sensing circuit is insulated from and crosses the first sensing circuit. The shielding layer is disposed between the dielectric layer and the display device and coplanar with the conducting bridges.
-
公开(公告)号：US20190239359A1
公开(公告)日：2019-08-01
申请号：US15947858
申请日：2018-04-08
Applicant: Interface Technology (ChengDu) Co., Ltd. , Interface Optoelectronics (ShenZhen) Co., Ltd. , General Interface Solution Limited
Inventor： Shuenn-Ching WANG
Abstract: The present disclosure provides a printed circuit board connecting structure including a first printed circuit board, a protection layer, an ACF (anisotropy conductive film), and a second printed circuit board. The first printed circuit board includes a first circuit. The protection layer covers a first area of the first circuit. The ACF covers a second area of the first circuit and extending to the protection layer. The second printed circuit board includes a second circuit facing the first circuit. The second printed circuit board partially overlaps with the ACF on the second area of the first circuit, and there is a gap between the second printed circuit board and the protection layer.
-
公开(公告)号：US20180200928A1
公开(公告)日：2018-07-19
申请号：US15459409
申请日：2017-03-15
Applicant: INTERFACE TECHNOLOGY (CHENGDU) CO., LTD. , INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD. , GENERAL INTERFACE SOLUTION LIMITED
Inventor： CHIN-YANG WU
CPC classification number: B32B7/02 , B29C45/14811 , B29K2069/00 , B29K2633/12 , B29K2669/00 , B29K2995/0018 , B29K2995/007 , B29L2031/30 , B29L2031/3475 , B32B27/365 , B32B2333/12 , B32B2457/208 , G06F3/00
Abstract: A low-stress line workpiece and a method for integrally forming the same is disclosed. Firstly, an in-mold injection molding mold is provided, wherein a function film, a 3D curved-surface plastic material, and an anti-rainbow stripe combination layer are placed in the in-mold injection molding mold. The in-mold injection molding mold is used to mold the function film, the plastic material and the combination layer into a low-stress line workpiece integrally formed by in-mold forming The low-stress line workpiece includes the function film, the plastic layer and the combination layer, wherein the plastic layer is located between the function film and the combination layer. The present invention provides a low-stress line workpiece with high surface hardness and a method for forming the same to reduce lamination fabrication processes and improve lamination yield.
-
公开(公告)号：US20180143705A1
公开(公告)日：2018-05-24
申请号：US15484128
申请日：2017-04-10
Applicant: Interface Technology (ChengDu) Co., Ltd. , Interface Optoelectronics (ShenZhen) Co., Ltd. , General Interface Solution Limited
Inventor： Yen-Heng HUANG , Po-Lin CHEN , Yue-Feng YANG
IPC: G06F3/041
Abstract: A touch sensing module includes a substrate, sensing electrodes, and a covering layer. The sensing electrodes are disposed on a surface of the substrate. Each of the sensing electrodes has a first end and a second end opposite to the first end. The second end is adopted to be electrically connected with an external circuit. The covering layer is disposed on a side of the sensing electrodes distal from the substrate, and covers the sensing electrodes. The covering layer has openings. The first ends of the sensing electrodes are exposed within the openings respectively.
-
Patent Agency Ranking
公开(公告)号：US09746703B2
公开(公告)日：2017-08-29
申请号：US14828512
申请日：2015-08-17
Inventor： Chen-Yun Ma , Kuo-Tung Liao , Chia-Jung Fan
IPC: G02F1/1345 , G02F1/1333 , H05K1/02
CPC classification number: G02F1/133308 , G02F1/13452 , G02F2001/133314 , H05K1/02 , H05K2201/09063 , H05K2201/10136
Abstract: A panel assembly includes a frame, a cell module, a retaining structure, and a flexible circuit board. The frame has a first surface and a second surface respectively located at opposite sides of the frame. The cell module and the retaining structure are respectively disposed on the first and second surfaces. The flexible circuit board is connected to the cell module and bended to extend over the second surface. The flexible circuit board has a through hole having a passing zone and an inwardly reduced zone communicated with each other. A part of the retaining structure extends from the second surface to a side of the flexible circuit board distal to the second surface via the inwardly reduced zone for preventing the flexible circuit board from moving away from the second surface. The passing zone is configured for the retaining structure to pass through.
-
公开(公告)号：US20170129805A1
公开(公告)日：2017-05-11
申请号：US14988011
申请日：2016-01-05
Inventor： CHUNG-WU LIU , CHUN-TE CHANG
CPC classification number: C03C17/32 , C03C15/00 , C03C2218/112
Abstract: An enhanced blind cover and a method for fabricating the same is disclosed. Firstly, a cover having at least one blind hole is provided. Then, liquidized protection glue is formed on an inner sidewall and an inner bottom surface of the blind hole. Finally, the liquidized protection glue is solidified to form solidified protection glue.
-
108.发明申请METHOD FOR MANUFACTURING BLIND HOLE OF INSULATING SUBSTRATE FOR ELECTRONIC DEVICE 审中-公开用于制造用于电子设备的绝缘衬底的盲孔的方法公开(公告)号：US20170062102A1
公开(公告)日：2017-03-02
申请号：US14972107
申请日：2015-12-17
Inventor： Chun-Te CHANG , Yu-Pi KUO , Chung-Wu LIU , Wei-Chung CHUANG
Abstract: The present disclosure provides a method for manufacturing a blind hole of an insulating substrate for an electronic device. The method includes following steps. A patterned photoresist layer is formed over the insulating substrate. The patterned photoresist layer has an opening exposing a portion of the insulating substrate. A wet etching process is performed to remove the exposed insulating substrate to form a blind hole in the opening.
Abstract translation: 本公开提供了一种用于制造用于电子设备的绝缘基板的盲孔的方法。 该方法包括以下步骤。 在绝缘基板上形成图案化的光致抗蚀剂层。 图案化的光致抗蚀剂层具有露出绝缘基板的一部分的开口。 进行湿蚀刻处理以去除暴露的绝缘基板，以在开口中形成盲孔。
-
公开(公告)号：US20160313589A1
公开(公告)日：2016-10-27
申请号：US14804420
申请日：2015-07-21
Inventor： YU-CHEN KUO , CHIA-JUNG FAN , KUO-TUNG LIAO
IPC: G02F1/1333 , G02F1/1335 , G02F1/133 , G06F3/041
CPC classification number: G02F1/13338 , G02F1/133308 , G02F2001/133334 , G02F2201/54 , G02F2202/22 , G06F3/0412 , G06F2203/04103
Abstract: The present invention discloses a touch control device, which is addressed to the rimple problem resulting from the full-lamination design of the touch control panel and the liquid crystal display module. The present invention compensates for the elevation drop of the slightly lower control circuit region of the liquid crystal display module in a thickness-increasing way to make the entire liquid crystal display module have an identical elevation. In some embodiments, the present invention increases the thickness of a portion of a ground tape or an optical adhesion layer to compensate for the elevation drop of the liquid crystal display module with respect to the touch control panel. Thereby, the rimple problem is effectively solved.
Abstract translation: 本发明公开了一种触摸控制装置，其涉及由触摸控制面板和液晶显示模块的全层压设计引起的边缘问题。 本发明以增厚的方式来补偿液晶显示模块的稍微下降的控制电路区域的升高点，使整个液晶显示模块具有相同的高度。 在一些实施例中，本发明增加了接地带或光学粘合层的一部分的厚度，以补偿液晶显示模块相对于触摸控制面板的仰角。 从而有效地解决了边缘问题。
-
公开(公告)号：US20160262252A1
公开(公告)日：2016-09-08
申请号：US14742721
申请日：2015-06-18
Inventor： Shih-Chieh HUANG
IPC: H05K1/02
CPC classification number: H05K1/02 , G06F3/041 , G06F2203/04103 , H05K1/0306 , H05K3/28 , H05K2201/09145 , H05K2201/09154
Abstract: A substrate structure includes a substrate, a buffer layer, and a protecting layer. The substrate includes a side surface. The buffer layer is disposed between the side surface of the substrate and the protecting layer, and the hardness of the protecting layer is greater than the hardness of the buffer layer.
Abstract translation: 衬底结构包括衬底，缓冲层和保护层。 基板包括侧面。 缓冲层设置在基板的侧面和保护层之间，保护层的硬度大于缓冲层的硬度。
-
-
-
-
-
-
-
-
-
Search Results
315
records
(took 0.023 seconds)
