摘要:
A thin film transistor array substrate and a fabricating method thereof are disclosed. The thin film transistor array substrate protects a thin film transistor without a protective film and accordingly reduces the manufacturing cost. In the thin film transistor array substrate, a gate electrode is connected to a gate line. A source electrode is connected to a data line crossing the gate line to define a pixel area. A drain electrode is opposed to the source electrode with a channel therebetween. A semiconductor layer is in the channel. A pixel electrode in the pixel area contacts the drain electrode over substantially the entire overlapping area between the two. A channel protective film is provided on-the semiconductor layer corresponding to the channel to protect the semiconductor layer.
摘要:
A thin film transistor substrate and a fabricating method simplify a process and enlarge a capacitance value of a storage capacitor without any reduction of aperture ratio. A transparent first conductive layer and an opaque second conductive layer of a double-layer structured gate line are formed having a step coverage. A pixel electrode is provided on the gate insulating film within a pixel hole of said pixel area passing through the passivation film to be connected to the thin film transistor. A storage capacitor overlaps with the pixel electrode with having the gate insulating film therebetween and has a lower storage electrode protruded from the first conductive layer.
摘要:
A substrate is provided. A first die is attached to the substrate. The first die is electrically connected to the substrate. A heat sink having an undercut around its periphery is attached to the first die. A second die is attached to the heat sink. The second die is electrically connected to the substrate, and the first die, the heat sink, and the second die are encapsulated.
摘要:
The present invention provides a helical core and fabricating method thereof, by which a material and weight for fabrication of a core are reduced and by which a fabrication process is simplified. The present invention has a multi-layer structure configured by helically winding to stack a steel plate core from a bottom layer to a top layer and includes the steel plate core blanked in two rows from an electrical steel sheet to form a pair of bases confronting each other in a width direction and teeth protruding from each of the bases to alternately cross with each other, wherein to prevent an unwinding of the steel plate core in a direction reverse to a rotation of the steel plate core and a loosening between the stacked layers of the steel plate core in helically winding to stack the steel plate core, an engaging protrusion is provided to each upper or lower surface of the teeth of the steel plate core and an engaging recess is provided to each lower or upper surface of the teeth of the steel plate core to correspond to the engaging protrusion, wherein a recess is provided to the base to reduce stress in winding the steel plate core, and wherein both corners of an end of each of the teeth is chamfered straight or round to form a ‘C’ shape to reduce vibration and noise generated by cogging torque on driving a motor.
摘要:
Method for fabricating a stator core and a back yoke of an outer rotor type BLDC motor in a direct coupling type washing machine, including the steps of providing a base metal of a circular electric sheet having a predetermined diameter, and pressing the base metal to form a back yoke at a periphery of the base metal, and divisional cores on an inside of the back yoke of the base metal, whereby forming the stator core and the back yoke at a time, to reduce working hours, and saving a material.
摘要:
The present invention provides a washing apparatus and control method thereof, by which laundry can be dry-cleaned through the loaded configurations of the wet pad cloth, the filth transfer cloth, the steam providing unit, the fragrance spraying unit, and the detergent supplying unit using either the wet pad cloth or the filth transfer cloth or without using both of the wet pad cloth and the filth transfer cloth.
摘要:
Semiconductor packages provide a leadframe for packages that are singulated with respective predetermined package body sizes. Individual mold caps are formed on the leadframe with mold cap dimensions that are larger than the respective predetermined package body sizes. The mold caps and leadframe are singulated to the respective predetermined package body sizes.
摘要:
A liquid crystal display (LCD) panel is fabricated with a reduced number of mask processes and includes a thin film transistor (TFT) array substrate and a color filter array substrate. The TFT array substrate includes gate and data lines insulatively crossing each other to define a pixel area, a TFT provided at the crossing of the gate and data lines, a passivation film protecting the TFT, a pixel electrode partially overlapped by the TFT, a gate pad connected to the gate line, and a data pad connected to the data line. The gate line, the gate and data pads, and the pixel electrode include a transparent conductive material. A gate metal material is on the transparent conductive material where the TFT partially overlaps the pixel electrode. The passivation film over the gate and data pads is removed to expose the transparent conductive material included within the gate and data pads.