公开(公告)号：US20160151635A1

公开(公告)日：2016-06-02

申请号：US14556239

申请日：2014-12-01

Applicant: Greatbatch Ltd.

Inventor： Christine A. Frysz ,  Robert A. Stevenson ,  Thomas Marzano ,  Xiaohong Tang ,  William C. Thiebolt ,  Keith W. Seitz

IPC: A61N1/39 ,  A61N1/08 ,  A61N1/362

CPC classification number: A61N1/3968 ,  A61N1/086 ,  A61N1/362 ,  A61N1/3718 ,  A61N1/3754 ,  H03H1/00 ,  H03H7/0107 ,  H03H7/1758 ,  H03H7/1766 ,  H03H2001/0042 ,  H03H2001/005 ,  H03H2001/0085 ,  H03H2007/013

Abstract: A hermetic terminal assembly for an AIMD includes a shielded three-terminal flat-through EMI energy dissipating filter and a hermetically sealed feedthrough configured to be attachable to the ferrule or AIMD housing. The flat-through filter includes a first shield plate, an active electrode plate, and a second shield plate where the shield plates are electrically coupled to a metallization which in turn is coupled either to the ferrule or AIMD housing. The feedthrough includes an alumina substrate comprised of at least 96% alumina and a via hole with a substantially closed pore and substantially pure platinum fill. The platinum fill forms a tortuous and mutually conformal knitline or interface between the alumina substrate and the platinum fill, wherein the platinum fill is electrically coupled to at least one active electrode plate in non-conductive relationship to the at least one first and second shield plates.

Abstract translation: 用于AIMD的密封端子组件包括屏蔽的三端子平通EMI消散滤波器和被配置为可附接到套圈或AIMD壳体的密封馈通。 平通过滤器包括第一屏蔽板，有源电极板和第二屏蔽板，其中屏蔽板电耦合到金属化，金属化层又连接到套圈或AIMD壳体。 馈通包括由至少96％的氧化铝组成的氧化铝衬底和具有基本上闭孔的通孔和基本上纯的铂填充物。 铂填充物在氧化铝基底和铂填充物之间形成曲折且相互共形的编织物或界面，其中铂填充物与非至少一个第一和第二屏蔽板的非导电关系电耦合到至少一个有源电极板 。

公开(公告)号：US09233253B2

公开(公告)日：2016-01-12

申请号：US13743276

申请日：2013-01-16

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Thomas Marzano ,  Keith W. Seitz ,  Steven W. Winn ,  Christine A. Frysz ,  Richard L. Brendel ,  Jason Woods ,  Dominick J. Frustaci ,  Xiaohong Tang ,  William C. Thiebolt

IPC: H01G4/35 ,  A61N1/375 ,  A61N1/05 ,  H01G2/10 ,  H01R43/00 ,  A61N1/372 ,  C22C29/12

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.

Abstract translation: 一个共同连接的密封馈通电源，馈通电容器和引线组件包括具有通孔的电介质基片，其通过介电基片从体液侧设置到器件侧。 导电填料设置在通孔内形成气密密封，并且在体液侧和装置侧之间导电。 馈通电容器附接到电介质基板，并且包括电容器电介质基板，包括内部金属化的未填充的电容器通孔，电耦合到内部金属化的一组电容器有源电极板，设置的外部金属化和一组电容器接地 电极板电耦合到外部金属化。 导电引线设置在未填充的电容器通孔内。 电接头将导电填充物，电容器内部金属化以及电容器有源电极板和导电引线连接。

公开(公告)号：US20140036409A1

公开(公告)日：2014-02-06

申请号：US13743276

申请日：2013-01-16

Applicant: GREATBATCH LTD.

Inventor： Robert A. Stevenson ,  Thomas Marzano ,  Keith W. Seitz ,  Steven W. Winn ,  Christine A. Frysz ,  Richard L. Brendel ,  Jason Woods ,  Dominick J. Frustaci ,  Xiaohong Tang ,  William C. Thiebolt

IPC: H01G4/35

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.

Abstract translation: 一个共同连接的密封馈通电源，馈通电容器和引线组件包括具有通孔的电介质基片，其通过介电基片从体液侧设置到器件侧。 导电填料设置在通孔内形成气密密封，并且在体液侧和装置侧之间导电。 馈通电容器附接到电介质基板，并且包括电容器电介质基板，包括内部金属化的未填充的电容器通孔，电耦合到内部金属化的一组电容器有源电极板，设置的外部金属化和一组电容器接地 电极板电耦合到外部金属化。 导电引线设置在未填充的电容器通孔内。 电接头将导电填充物，电容器内部金属化以及电容器有源电极板和导电引线连接。