Cooling structure, electronic device using same, and cooling method
    102.
    发明授权
    Cooling structure, electronic device using same, and cooling method 有权
    冷却结构,使用电子装置及冷却方式

    公开(公告)号:US09557117B2

    公开(公告)日:2017-01-31

    申请号:US13062258

    申请日:2009-10-07

    摘要: A cooling structure is provided which includes: an evaporation chamber defined by a base plate having a boiling surface, a ceiling plate and a side wall; a plurality of plate-shaped fins arranged in parallel on the boiling surface, defining a plurality of coolant passages in the evaporation chamber, a liquid phase coolant flows through the coolant passages in one direction from one end portion thereof toward another end portion; a liquid return port formed in the side wall facing the one end portion of coolant passages; and a vapor port formed in the ceiling plate facing the other end portion of coolant passages, wherein space is formed between the ceiling plate and an upper end portion of the plurality of plate-shaped fins, the space expanding gradually from a liquid return port side of the side wall toward the vapor port.

    摘要翻译: 提供了一种冷却结构,其包括:由具有沸腾表面的底板,顶板和侧壁限定的蒸发室; 在沸腾表面上平行布置的多个板状翅片,在蒸发室中限定多个冷却剂通道,液相冷却剂从一个端部向另一端部沿一个方向流过冷却剂通道; 形成在面向冷却剂通道的一个端部的侧壁中的液体返回口; 以及形成在所述顶板中的与所述冷却剂通路的另一端部分形成的蒸气口,其中,在所述顶板与所述多个板状翅片的上端部之间形成有空间,所述空间从液体返回口侧逐渐扩展 的侧壁朝向蒸汽口。

    Vapor phase cooling apparatus and electronic equipment using same
    103.
    发明授权
    Vapor phase cooling apparatus and electronic equipment using same 有权
    气相冷却装置及使用该装置的电子设备

    公开(公告)号:US09386724B2

    公开(公告)日:2016-07-05

    申请号:US13824908

    申请日:2011-08-31

    摘要: A vapor phase cooling apparatus (10) includes: a housing (11) including a heat receiver (14a) configured to receive heat generated by an electronic component (50) that is a heat generating source, the electronic component (50) being connected to a vertical outer surface on the +Z side of the housing, the housing including an internal space for enclosing refrigerant; and a first heat sink (21) and a second heat sink (22) that are disposed on the +Y side and the −Y side from the electronic component (50) and that dissipate heat to the outside. Both ends of the first heat sink (21) and the second heat sink (22) in X direction extend further along the surface on the +Z side than both ends of the heat receiver (14a) in X direction.

    摘要翻译: 气相冷却装置(10)包括:壳体(11),其包括被配置为接收由作为发热源的电子部件(50)产生的热量的热接收器(14a),所述电子部件(50)连接到 壳体的+ Z侧的垂直外表面,壳体包括用于封闭制冷剂的内部空间; 以及设置在电子部件(50)的+ Y侧和-Y侧的第一散热器(21)和第二散热器(22),并且向外部散热。 X方向上的第一散热器21和第二散热器22的两端沿X方向沿着热接收器14a的两端向+ Z侧的面延伸。

    Flat Plate Cooling Device and Method for Using the Same
    104.
    发明申请
    Flat Plate Cooling Device and Method for Using the Same 审中-公开
    平板冷却装置及其使用方法

    公开(公告)号:US20150034288A1

    公开(公告)日:2015-02-05

    申请号:US14349034

    申请日:2012-09-26

    IPC分类号: F28F3/12

    摘要: In a cooling device using an ebullient cooling system, a cooling device becomes larger when a degree of freedom of the arrangement in installing it in electronic equipment is increased, and that it is impossible to obtain a sufficient degree of freedom of the arrangement, therefore, a flat plate cooling device according to an exemplary aspect of the invention includes a plate-like container including a first flat plate and a second flat plate opposite to the first flat plate; a refrigerant enclosed in the plate-like container; and a guiding wall unit connecting the first flat plate to the second flat plate and controlling a flow of the refrigerant in the plate-like container; wherein the plate-like container includes a heat receiving area which is thermally connected to a heating element disposed on at least one of the first flat plate and the second flat plate; and the guiding wall unit includes a pair of guiding walls, and the guiding walls are disposed on opposite sides of the heat receiving area.

    摘要翻译: 在使用沸腾冷却系统的冷却装置中,当安装在电子设备中的布置的自由度增加时,冷却装置变大,并且不可能获得足够的布置自由度, 根据本发明的示例性方面的平板冷却装置包括:板状容器,包括第一平板和与第一平板相对的第二平板; 封闭在板状容器中的制冷剂; 以及引导壁单元,其将所述第一平板连接到所述第二平板并控制所述板状容器中的制冷剂的流动; 其特征在于,所述板状容器具有与设置在所述第一平板和所述第二平板中的至少一个上的加热元件热连接的热接收区域, 并且导向壁单元包括一对导向壁,并且引导壁设置在受热区域的相对侧上。

    COOLING DEVICE AND ELECTRONIC DEVICE MADE THEREWITH
    105.
    发明申请
    COOLING DEVICE AND ELECTRONIC DEVICE MADE THEREWITH 审中-公开
    冷却装置及其制造的电子装置

    公开(公告)号:US20140165638A1

    公开(公告)日:2014-06-19

    申请号:US14235951

    申请日:2012-07-20

    IPC分类号: H05K7/20

    摘要: A cooling device employing a boiling cooling method cannot exhibit sufficient cooling performance when it is installed in a low-profile electronic device.A cooling device of the present invention comprises an evaporation unit which contains a refrigerant, a condensation unit which performs heat radiation by condensing and liquefying vapor-phase refrigerant which was vaporized at the evaporation unit, and piping which connects the evaporation unit with the condensation unit; wherein the evaporation unit comprises an evaporation container and a partition wall section which is arranged within the evaporation container and constitutes a flow path of the refrigerant, and the height of the partition wall section is equal to or larger than the height of the vapor-liquid interface of the refrigerant and is smaller than the height of the evaporation container.

    摘要翻译: 采用沸腾冷却方法的冷却装置安装在薄型电子装置中时不能表现出足够的冷却性能。 本发明的冷却装置包括:蒸发单元,其包含制冷剂;冷凝单元,其通过冷凝和液化在所述蒸发单元处蒸发的气相制冷剂进行散热;以及管道,其将所述蒸发单元与所述冷凝单元连接 ; 其中所述蒸发单元包括蒸发容器和分隔壁部分,所述分隔壁部分布置在所述蒸发容器内并构成所述制冷剂的流动路径,并且所述分隔壁部分的高度等于或大于所述气液体的高度 制冷剂的界面小于蒸发容器的高度。

    COOLING DEVICE AND METHOD FOR MAKING THE SAME
    106.
    发明申请
    COOLING DEVICE AND METHOD FOR MAKING THE SAME 审中-公开
    冷却装置及其制造方法

    公开(公告)号:US20130319639A1

    公开(公告)日:2013-12-05

    申请号:US14000681

    申请日:2012-02-17

    IPC分类号: F28D15/00 B23P15/26

    摘要: In a cooling device using an ebullient cooling system, it is difficult to improve the cooling performance without increasing manufacturing costs, therefore, a cooling device according to an exemplary aspect of the invention includes a heat receiving unit storing a refrigerant and receiving the heat from an object to be cooled; a heat radiating unit radiating heat by condensing and liquefying a vapor-state refrigerant arising from a refrigerant vaporizing in the heat receiving unit; and a connection connecting the heat receiving unit to the heat radiating unit; wherein the heat receiving unit includes a base thermally contacting with the object to be cooled, and a container connected to the connection; the base includes a heat receiving unit outer wall composing a part of an outer wall of the heat receiving unit, and a plurality of projections disposed on a heat receiving unit undersurface of an undersurface at an inner wall side contacting with the refrigerant; the base includes a bubble nucleus forming surface on a refrigerant contacting surface composed of the heat receiving unit undersurface and the surface of the projection; and the heat receiving unit includes a vapor-state refrigerant region containing a vapor-state refrigerant between the top edge of the projection and one of inner wall surfaces of the container facing the heat receiving unit undersurface.

    摘要翻译: 在使用沸腾冷却系统的冷却装置中,难以提高冷却性能而不增加制造成本,因此,根据本发明的示例性方面的冷却装置包括:储存制冷剂的热量接收单元, 待冷却物体; 散热单元,其通过冷凝和液化在所述受热单元中蒸发的制冷剂产生的蒸气状制冷剂来散热; 以及将热接收单元连接到散热单元的连接; 其中所述热接收单元包括与待冷却物体热接触的基座和连接到所述连接件的容器; 所述基座包括构成所述受热单元的外壁的一部分的受热单元外壁和在与所述制冷剂接触的内壁侧的下表面的受热单元下表面上的多个突起; 底座包括由热接收单元下表面和突起的表面构成的制冷剂接触表面上的气泡核形成表面; 并且所述受热单元包括在所述突起的顶部边缘和所述容器的面对所述受热单元下表面的内壁表面之一中包含蒸气状态的制冷剂的蒸汽状态的制冷剂区域。

    Cooling device
    107.
    发明授权
    Cooling device 有权
    冷却装置

    公开(公告)号:US08593810B2

    公开(公告)日:2013-11-26

    申请号:US13143416

    申请日:2010-01-14

    IPC分类号: H05K7/20

    摘要: A cooling device of the present invention includes: a substrate having a first surface which supports an electronic component and a second surface on an opposite side to the first surface; a container which can form a space between itself and the second surface of the substrate; and an evaporation section which is thermally connected to the electronic component supported on the substrate, which is arranged in the space so that at least a portion thereof is in contact with a liquid within the space, and which changes a phase of at least a portion of the liquid to gas on a basis of heat generated by the electronic component.

    摘要翻译: 本发明的冷却装置包括:基板,其具有支撑电子部件的第一表面和与所述第一表面相反的一侧上的第二表面; 容器,其能够在其与衬底的第二表面之间形成空间; 以及蒸发部,其与支撑在所述基板上的所述电子部件热连接,所述电子部件布置在所述空间中,使得其至少一部分与所述空间内的液体接触,并且将至少一部分 基于由电子部件产生的热量的液体对气体。

    BOILING HEAT TRANSFER DEVICE
    109.
    发明申请
    BOILING HEAT TRANSFER DEVICE 有权
    锅炉换热装置

    公开(公告)号:US20110214840A1

    公开(公告)日:2011-09-08

    申请号:US13128740

    申请日:2009-10-22

    IPC分类号: F28D15/02

    摘要: A boiling heat transfer device of the present invention includes: a heat receiving portion that boils a liquefied refrigerant to convert it to vapor, and contacts with a device to be cooled and cools the device to be cooled; a vapor tube that connects to an upper portion of the heat receiving portion and conveys the vapor generated by the heat receiving portion; a heat dissipating portion that condenses the vapor conveyed from the vapor tube to convert it to a liquefied refrigerant and dissipates heat to an atmosphere; and a liquid tube that returns to the heat receiving portion the liquefied refrigerant condensed by the heat dissipating portion. At least a portion of a cross-sectional area of a flow passage of the vapor in the heat receiving portion gradually decreases from a lower portion of the heat receiving portion toward the upper portion of the heat receiving portion.

    摘要翻译: 本发明的沸腾传热装置包括:热接收部分,其使液化的制冷剂沸腾以将其转化为蒸汽,并与待冷却的装置接触并冷却待冷却的装置; 蒸气管,其连接到所述受热部的上部,并且传送由所述受热部产生的蒸气; 散热部,其冷凝从蒸气管输送的蒸气,将其转化为液化的制冷剂,并将热量散发到大气中; 以及液体管,其使由所述散热部冷凝的液化制冷剂返回到所述受热部。 受热部中的蒸气的流路的截面积的至少一部分从受热部的下部朝向受热部的上部逐渐减小。