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公开(公告)号：US09605907B2
公开(公告)日：2017-03-28
申请号：US13638474
申请日：2011-03-15
IPC分类号： F28D15/02 , H01L23/427 , H01L23/467
CPC分类号： F28D15/0266 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A phase change cooler of the present invention includes: a plurality of heat receiving units that cause a refrigerant to change phase from liquid to gas by heat received from a heat generating body; one heat radiating unit that causes the refrigerant to change phase from gas to liquid by radiating heat to surrounding area; a plurality of vapor tubes that respectively transport the refrigerant in a vapor state from each of the heat receiving units to the heat radiating unit; a liquid tube that respectively circulates the refrigerant in a liquid state from the heat radiating unit to each of the heat receiving units; and a bypass tube that connects each of the heat receiving units to each other.
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公开(公告)号：US20130025826A1
公开(公告)日：2013-01-31
申请号：US13638474
申请日：2011-03-15
IPC分类号： F28D15/02
CPC分类号： F28D15/0266 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A phase change cooler of the present invention includes: a plurality of heat receiving units that cause a refrigerant to change phase from liquid to gas by heat received from a heat generating body; one heat radiating unit that causes the refrigerant to change phase from gas to liquid by radiating heat to surrounding area; a plurality of vapor tubes that respectively transport the refrigerant in a vapor state from each of the heat receiving units to the heat radiating unit; a liquid tube that respectively circulates the refrigerant in a liquid state from the heat radiating unit to each of the heat receiving units; and a bypass tube that connects each of the heat receiving units to each other.
摘要翻译： 本发明的相变冷却器包括：多个热接收单元，其使得制冷剂通过从发热体接收的热量将液相变成气体; 一个散热单元，其通过向周围区域辐射热量使制冷剂从气体向液体变化; 多个蒸汽管，分别将来自每个热接收单元的蒸汽状态的制冷剂输送到散热单元; 液体管，其将从液体状态的制冷剂从散热单元分别循环到各个受热单元; 以及将每个所述热接收单元彼此连接的旁通管。
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公开(公告)号：US09557117B2
公开(公告)日：2017-01-31
申请号：US13062258
申请日：2009-10-07
IPC分类号： F28D15/00 , F28D15/02 , H01L23/427 , F28F9/02
CPC分类号： F28D15/0266 , F28F9/026 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A cooling structure is provided which includes: an evaporation chamber defined by a base plate having a boiling surface, a ceiling plate and a side wall; a plurality of plate-shaped fins arranged in parallel on the boiling surface, defining a plurality of coolant passages in the evaporation chamber, a liquid phase coolant flows through the coolant passages in one direction from one end portion thereof toward another end portion; a liquid return port formed in the side wall facing the one end portion of coolant passages; and a vapor port formed in the ceiling plate facing the other end portion of coolant passages, wherein space is formed between the ceiling plate and an upper end portion of the plurality of plate-shaped fins, the space expanding gradually from a liquid return port side of the side wall toward the vapor port.
摘要翻译： 提供了一种冷却结构，其包括：由具有沸腾表面的底板，顶板和侧壁限定的蒸发室; 在沸腾表面上平行布置的多个板状翅片，在蒸发室中限定多个冷却剂通道，液相冷却剂从一个端部向另一端部沿一个方向流过冷却剂通道; 形成在面向冷却剂通道的一个端部的侧壁中的液体返回口; 以及形成在所述顶板中的与所述冷却剂通路的另一端部分形成的蒸气口，其中，在所述顶板与所述多个板状翅片的上端部之间形成有空间，所述空间从液体返回口侧逐渐扩展 的侧壁朝向蒸汽口。
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公开(公告)号：US08593810B2
公开(公告)日：2013-11-26
申请号：US13143416
申请日：2010-01-14
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A cooling device of the present invention includes: a substrate having a first surface which supports an electronic component and a second surface on an opposite side to the first surface; a container which can form a space between itself and the second surface of the substrate; and an evaporation section which is thermally connected to the electronic component supported on the substrate, which is arranged in the space so that at least a portion thereof is in contact with a liquid within the space, and which changes a phase of at least a portion of the liquid to gas on a basis of heat generated by the electronic component.
摘要翻译： 本发明的冷却装置包括：基板，其具有支撑电子部件的第一表面和与所述第一表面相反的一侧上的第二表面; 容器，其能够在其与衬底的第二表面之间形成空间; 以及蒸发部，其与支撑在所述基板上的所述电子部件热连接，所述电子部件布置在所述空间中，使得其至少一部分与所述空间内的液体接触，并且将至少一部分 基于由电子部件产生的热量的液体对气体。
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公开(公告)号：US20110214840A1
公开(公告)日：2011-09-08
申请号：US13128740
申请日：2009-10-22
IPC分类号： F28D15/02
CPC分类号： F28D15/0266 , F28D1/024 , F28D15/0283 , F28D2015/0216 , F28F3/02 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A boiling heat transfer device of the present invention includes: a heat receiving portion that boils a liquefied refrigerant to convert it to vapor, and contacts with a device to be cooled and cools the device to be cooled; a vapor tube that connects to an upper portion of the heat receiving portion and conveys the vapor generated by the heat receiving portion; a heat dissipating portion that condenses the vapor conveyed from the vapor tube to convert it to a liquefied refrigerant and dissipates heat to an atmosphere; and a liquid tube that returns to the heat receiving portion the liquefied refrigerant condensed by the heat dissipating portion. At least a portion of a cross-sectional area of a flow passage of the vapor in the heat receiving portion gradually decreases from a lower portion of the heat receiving portion toward the upper portion of the heat receiving portion.
摘要翻译： 本发明的沸腾传热装置包括：热接收部分，其使液化的制冷剂沸腾以将其转化为蒸汽，并与待冷却的装置接触并冷却待冷却的装置; 蒸气管，其连接到所述受热部的上部，并且传送由所述受热部产生的蒸气; 散热部，其冷凝从蒸气管输送的蒸气，将其转化为液化的制冷剂，并将热量散发到大气中; 以及液体管，其使由所述散热部冷凝的液化制冷剂返回到所述受热部。 受热部中的蒸气的流路的截面积的至少一部分从受热部的下部朝向受热部的上部逐渐减小。
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公开(公告)号：US20110279978A1
公开(公告)日：2011-11-17
申请号：US13143416
申请日：2010-01-14
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A cooling device of the present invention includes: a substrate having a first surface which supports an electronic component and a second surface on an opposite side to the first surface; a container which can form a space between itself and the second surface of the substrate; and an evaporation section which is thermally connected to the electronic component supported on the substrate, which is arranged in the space so that at least a portion thereof is in contact with a liquid within the space, and which changes a phase of at least a portion of the liquid to gas on a basis of heat generated by the electronic component.
摘要翻译： 本发明的冷却装置包括：基板，其具有支撑电子部件的第一表面和与所述第一表面相反的一侧上的第二表面; 容器，其能够在其与衬底的第二表面之间形成空间; 以及蒸发部，其与支撑在所述基板上的所述电子部件热连接，所述电子部件布置在所述空间中，使得其至少一部分与所述空间内的液体接触，并且将至少一部分 基于由电子部件产生的热量的液体对气体。
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公开(公告)号：US09297589B2
公开(公告)日：2016-03-29
申请号：US13128740
申请日：2009-10-22
IPC分类号： F28D15/00 , F28D15/02 , H01L23/427
CPC分类号： F28D15/0266 , F28D1/024 , F28D15/0283 , F28D2015/0216 , F28F3/02 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A boiling heat transfer device of the present invention includes: a heat receiving portion that boils a liquefied refrigerant to convert it to vapor, and contacts with a device to be cooled and cools the device to be cooled; a vapor tube that connects to an upper portion of the heat receiving portion and conveys the vapor generated by the heat receiving portion; a heat dissipating portion that condenses the vapor conveyed from the vapor tube to convert it to a liquefied refrigerant and dissipates heat to an atmosphere; and a liquid tube that returns to the heat receiving portion the liquefied refrigerant condensed by the heat dissipating portion. At least a portion of a cross-sectional area of a flow passage of the vapor in the heat receiving portion gradually decreases from a lower portion of the heat receiving portion toward the upper portion of the heat receiving portion.
摘要翻译： 本发明的沸腾传热装置包括：热接收部分，其使液化的制冷剂沸腾以将其转化为蒸汽，并与待冷却的装置接触并冷却待冷却的装置; 蒸气管，其连接到所述受热部的上部，并且传送由所述受热部产生的蒸气; 散热部，其冷凝从蒸气管输送的蒸气，将其转化为液化的制冷剂，并将热量散发到大气中; 以及液体管，其使由所述散热部冷凝的液化制冷剂返回到所述受热部。 受热部中的蒸气的流路的截面积的至少一部分从受热部的下部朝向受热部的上部逐渐减小。
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公开(公告)号：US20110192574A1
公开(公告)日：2011-08-11
申请号：US13062258
申请日：2009-10-07
IPC分类号： F28D15/00
CPC分类号： F28D15/0266 , F28F9/026 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A maintenance-free cooling structure is provided which, by removing bubbles produced on a boiling surface utilizing an action other than buoyancy, heat change (heat transfer) is effectively brought about on the boiling surface, thus enabling efficient cooling and its miniaturization and low power consumption. The cooling structure has an evaporation chamber 11 connected through a vapor pipe and a liquid return pipe to a condensation chamber to allow a phase change to occur from a vapor phase coolant V to a liquid phase coolant L. In the evaporation chamber, as a result of contact of the liquid phase coolant L with the boiling surface of a base plate 21 and/or with plate-shaped fins, the phase change occurs from liquid to vapor. The evaporation chamber has an aperture operating as a vapor port 25 for the vapor pipe which is formed in a neighboring position along an inner circumferential surface 23a of a cylindrical plate 23 in a ceiling surface 22a and an aperture operating as a liquid return port for the liquid return pipe which is formed in a position neighboring to an end edge along the boiling surface on an inner circumferential surface on a side opposite to the vapor port 25, so that the flow-in direction of the liquid phase coolant is in parallel to the boiling surface.
摘要翻译： 提供一种免维护的冷却结构，其通过除了浮力之外的作用除去在沸腾表面产生的气泡，在沸腾表面上有效地实现了热变化（传热），从而能够有效地冷却其小型化和低功率 消费。 冷却结构具有通过蒸汽管和液体返回管连接到冷凝室的蒸发室11，以允许从气相冷却剂V发生相变到液相冷却剂L.在蒸发室中，结果 液相冷却剂L与基板21的沸腾表面和/或板状翅片的接触，相变由液体发生。 蒸发室具有作为蒸汽管25的蒸气口的孔，该孔形成在沿天花板表面22a的圆柱形板23的内圆周表面23a的相邻位置和作为液体返回端口的孔中 液体返回管，其形成在与蒸气口25相反的一侧的内周面上沿着沸腾面的端部边缘的位置，使得液相冷却剂的流入方向平行于 沸腾的表面。
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公开(公告)号：US20140144169A1
公开(公告)日：2014-05-29
申请号：US14131230
申请日：2012-07-05
IPC分类号： H05K7/20
CPC分类号： H05K7/20309 , F28D15/0266 , G06F1/20 , G06F2200/201 , H05K7/20318 , H05K7/20727 , H05K7/20818
摘要： A cooling system comprising: an evaporator for evaporating a refrigerant by performing heat exchange with outside air; a condenser for condensing a gas refrigerant into a liquid refrigerant by making a refrigerant and a cooling medium perform heat exchange with each other; a gas refrigerant pipe and a liquid refrigerant pipe connecting the evaporator and the condenser; and the evaporator including: an upper part header provided in a highest position of the evaporator, and connected with the condenser by the gas refrigerant pipe, through the gas refrigerant pipe a gas refrigerant flowing; a lower part header provided in a lowest position of the evaporator, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe a liquid refrigerant flowing; a middle header provided in an intermediate position between the upper part header and the lower part header, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe the liquid refrigerant flowing; an upper part evaporator, arranged between the upper part header and the middle header, including an upper part steam generating tube having a first flow path for leading a refrigerant of the middle header to the upper part header while making the refrigerant of the middle header perform heat exchange with outside air and having a second flow path for leading a refrigerant of the lower part header to the upper part header while making the refrigerant of the lower part header perform heat exchange with outside air; and a lower part evaporator, arranged between the lower part header and the middle header, including a lower part steam generating tube having a third flow path inserted into the middle header while making a refrigerant of the lower part header perform heat exchange with outside air, the lower part steam generating tube communicated with the second flow path of the upper part steam generating tube.
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公开(公告)号：US09288931B2
公开(公告)日：2016-03-15
申请号：US14131230
申请日：2012-07-05
CPC分类号： H05K7/20309 , F28D15/0266 , G06F1/20 , G06F2200/201 , H05K7/20318 , H05K7/20727 , H05K7/20818
摘要： A cooling system comprising: an evaporator for evaporating a refrigerant by performing heat exchange with outside air; a condenser for condensing a gas refrigerant into a liquid refrigerant by making a refrigerant and a cooling medium perform heat exchange with each other; a gas refrigerant pipe and a liquid refrigerant pipe connecting the evaporator and the condenser; and the evaporator including: an upper part header provided in a highest position of the evaporator, and connected with the condenser by the gas refrigerant pipe, through the gas refrigerant pipe a gas refrigerant flowing; a lower part header provided in a lowest position of the evaporator, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe a liquid refrigerant flowing; a middle header provided in an intermediate position between the upper part header and the lower part header, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe the liquid refrigerant flowing; an upper part evaporator, arranged between the upper part header and the middle header, including an upper part steam generating tube having a first flow path for leading a refrigerant of the middle header to the upper part header while making the refrigerant of the middle header perform heat exchange with outside air and having a second flow path for leading a refrigerant of the lower part header to the upper part header while making the refrigerant of the lower part header perform heat exchange with outside air; and a lower part evaporator, arranged between the lower part header and the middle header, including a lower part steam generating tube having a third flow path inserted into the middle header while making a refrigerant of the lower part header perform heat exchange with outside air, the lower part steam generating tube communicated with the second flow path of the upper part steam generating tube.
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