公开(公告)号：US20210251077A1

公开(公告)日：2021-08-12

申请号：US17166768

申请日：2021-02-03

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Sung Hyun BYUN ,  Tae Hwan SONG

IPC: H05K1/11 ,  G01R1/073

Abstract: Proposed is an anodic oxide film structure that includes an anodic oxide film sheet and has high strength, chemical resistance and corrosion resistance.

公开(公告)号：US20210048053A1

公开(公告)日：2021-02-18

申请号：US16987248

申请日：2020-08-06

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN

IPC: F16B5/08 ,  B23K20/12

Abstract: A joined component formed by friction stir welding is proposed. More particularly, a joined component formed in a structure in which flow paths formed therein are isolated from each other without interfering with each other is proposed.

公开(公告)号：US20200251284A1

公开(公告)日：2020-08-06

申请号：US16776134

申请日：2020-01-29

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01G4/40 ,  H01G4/12

Abstract: A multilayer ceramic substrate according to the present invention includes a first insulating portion including a body of a ceramic material, a first via conductor penetrating through the body, and a first internal wiring layer and a first connection pad connected to the first via conductor; and a second insulating portion including a body of an anodized oxide material, a second via conductor penetrating through the body, and a second internal wiring layer and a second connection pad connected to the second via conductor.

公开(公告)号：US20200185570A1

公开(公告)日：2020-06-11

申请号：US16791846

申请日：2020-02-14

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: H01L33/48 ,  H01L33/62 ,  H01L23/00 ,  H01L21/48

Abstract: A method for manufacturing a chip-mounting substrate includes a pre-coating step of forming a precoat on a substrate including a plurality of conductive portions and an insulating portion interposed between the conductive portions, an etching step of etching at least a portion of the precoat through a laser to form a pattern, and a step of forming a metal layer on the substrate. The pattern is disposed on at least one of the conductive portions, and the metal layer is formed in the pattern.

公开(公告)号：US20190319178A1

公开(公告)日：2019-10-17

申请号：US16383462

申请日：2019-04-12

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Moon Hyun KIM

IPC: H01L33/62 ,  H01L25/13

Abstract: The present invention relates generally to an optical device package on which an optical device is mounted and, more particularly, to an optical device package that is configured such that a unit substrate of the optical device package comes into surface contact with a curved surface of a light transmission member.

公开(公告)号：US20190305036A1

公开(公告)日：2019-10-03

申请号：US16370749

申请日：2019-03-29

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK

IPC: H01L27/15 ,  H01L33/62

Abstract: The present invention relates to a micro LED semi-finished product module and, more specifically, to a micro LED semi-finished product module being manufactured to be individually bonded to a second substrate and being modularized by mounting multiple micro LEDs on a first substrate. Accordingly, it possible to manufacture a large display using micro LEDs and it is easy to manage a defect rate.

公开(公告)号：US20190304817A1

公开(公告)日：2019-10-03

申请号：US16366914

申请日：2019-03-27

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK

IPC: H01L21/67 ,  B65G47/91 ,  B25J15/06

Abstract: The present invention relates to a transfer head for a micro LED, the transfer head gripping a micro LED and transferring the micro LED to a display substrate. In particular, the present invention relates to a transfer head for a micro LED, the transfer head gripping a micro LED in a state where a grip surface of the transfer head and an upper surface of the micro LED are not in contact with each other when transferring the micro LED. Accordingly, it is possible to prevent positional error which may occur when transferring the micro LED and prevent damage of the micro LED.

公开(公告)号：US20190296195A1

公开(公告)日：2019-09-26

申请号：US16357204

申请日：2019-03-18

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/60

Abstract: The present invention relates generally to a substrate for an optical device, an optical device package, a manufacturing method of the substrate for the optical device, and a manufacturing method of the optical device package. More particularly, the present invention relates to a substrate for an optical device, an optical device package, a manufacturing method of the substrate for the optical device, and a manufacturing method of the optical device package, in which the optical device to be mounted self-aligns, thus improving mounting precision of the optical device, and also reflection efficiency is prevented from being reduced.

公开(公告)号：US20190234921A1

公开(公告)日：2019-08-01

申请号：US16258453

申请日：2019-01-25

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: G01N33/00

CPC classification number: G01N33/0016 ,  G01N21/88 ,  G01N33/0031

Abstract: The present invention relates to an air quality measuring apparatus, which has a structure for minimizing interference between a particulate matter sensor, a gas sensor, and a humidity sensor and measures air quality by generating air flow therein by using a pumping part capable of pumping restoration.

公开(公告)号：US20190214537A1

公开(公告)日：2019-07-11

申请号：US16235706

申请日：2018-12-28

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: H01L33/62 ,  H01L25/075 ,  H01L27/12 ,  H01L23/00

Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same. More particularly, the present invention relates to a micro LED structure and a method of manufacturing the same, the micro LED structure including: a micro LED; a circuit board driving the micro LED; and an anisotropic conductive anodic oxide film provided between the micro LED and the circuit board to electrically connect the circuit board and the micro LED. According to the present invention, without applying an external force (thermocompression bonding) to the anisotropic conductive anodic oxide film, it is possible to electrically connect the circuit board and the micro LED. In addition, it is possible to obtain characteristics such as uniform conductivity in a vertical direction and heat dissipation.