HIGH QUALITY FACTOR INTERCONNECT FOR RF CIRCUITS
    103.
    发明申请
    HIGH QUALITY FACTOR INTERCONNECT FOR RF CIRCUITS 有权
    射频电路的高质量因数互连

    公开(公告)号:US20140361856A1

    公开(公告)日:2014-12-11

    申请号:US14298834

    申请日:2014-06-06

    Abstract: Embodiments of radio frequency (RF) devices are disclosed having interconnection paths with capacitive structures having improved quality (Q) factors. In one embodiment, an RF device includes an inductor having an inductor terminal and a semiconductor die. The semiconductor die includes one or more active semiconductor devices that include a device contact. The device contact provided by the one or more active semiconductor devices is positioned so as to be vertically aligned directly below the inductor terminal. The inductor terminal and the device contact are electrically connected with an interconnection path that includes a capacitive structure. To prevent or reduce current crowding, the interconnection path is vertically aligned so as to extend directly between the inductor terminal and the device contact. In this manner, the interconnection path electrically connects the inductor terminal and the device contact without degrading the Q factor of the RF device.

    Abstract translation: 公开了射频(RF)装置的实施例,其具有具有改进的质量(Q)因素的电容结构的互连路径。 在一个实施例中,RF器件包括具有电感器端子和半导体管芯的电感器。 半导体管芯包括一个或多个包括器件接触的有源半导体器件。 由一个或多个有源半导体器件提供的器件触点被定位成在电感器端子的正下方垂直对齐。 电感器端子和器件触点与包括电容结构的互连路径电连接。 为了防止或减少电流拥挤,互连线路垂直对准,以便直接在电感器端子和器件触点之间延伸。 以这种方式,互连路径将电感器端子和器件接触电连接,而不降低RF器件的Q因子。

    HIGH Q FACTOR INDUCTOR STRUCTURE
    104.
    发明申请
    HIGH Q FACTOR INDUCTOR STRUCTURE 有权
    高Q因子电感结构

    公开(公告)号:US20140266544A1

    公开(公告)日:2014-09-18

    申请号:US14099007

    申请日:2013-12-06

    CPC classification number: H01F5/003 H01F17/0013 H01F2017/002 H01F2017/0073

    Abstract: The present disclosure provides a vertical inductor structure in which the magnetic field is closed such that the magnetic field of the vertical inductor structure is cancelled in the design direction outside the vertical inductor structure, yielding a small, or substantially zero, coupling factor of the vertical inductor structure. In one embodiment, several vertical inductor structures of the present disclosure can be placed in close proximity to create small resonant circuits and filter chains.

    Abstract translation: 本公开提供了垂直电感器结构,其中磁场被闭合,使得垂直电感器结构的磁场在垂直电感器结构外部的设计方向上消除,产生垂直的垂直电感器结构的小的或基本为零的耦合因子 电感结构。 在一个实施例中,本公开的几个垂直电感器结构可以紧邻地设置,以产生小的谐振电路和滤波器链。

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