公开(公告)号：US20110176310A1

公开(公告)日：2011-07-21

申请号：US12778143

申请日：2010-05-12

申请人： Ming Feng Lin ,  Wei Wang ,  Ping Lin Zhao ,  Song Lei

发明人： Ming Feng Lin ,  Wei Wang ,  Ping Lin Zhao ,  Song Lei

IPC分类号： F21S4/00

CPC分类号： G09F9/33 ,  F21S4/28 ,  F21V19/0055 ,  F21Y2115/10

摘要： An LED lamp includes a housing comprising a receptacle, first and second bossed holes in the receptacle, each bossed hole having internal threads, and a cover plate including parallel ribs projecting outward, and holes, the cover plate being secured to the receptacle by driving threaded fasteners therethrough into the second bossed holes; two opposite shoulders each formed lengthwise along a central line of an inner surface of either side of the receptacle; a PCB supported by the shoulder and the first bossed holes, the PCB being fastened in the receptacle by driving threaded fasteners therethrough into the first bossed holes; rows of units of LEDs electrically connected to the PCB wherein each row of units of LEDs is parallel to and adjacent the rib; and a waterproofing member in the housing for protecting the PCB. The LED lamp is shallow.

摘要翻译： LED灯包括壳体，其包括容器，插座中的第一和第二凸起孔，每个凸起的孔具有内螺纹，以及盖板，包括向外突出的平行肋，以及孔，盖板通过驱动螺纹固定到容器 穿过其中的紧固件进入第二凸起孔; 两个相对的肩部各自沿着容器的任一侧的内表面的中心线纵向地形成; 由肩部支撑的PCB和第一凸起的孔，PCB通过将螺纹紧固件穿过其中而被紧固在插座中的第一凸起孔中; LED的单元阵列电连接到PCB，其中每排LED单元平行于并邻近肋; 以及在壳体中用于保护PCB的防水构件。 LED灯浅。

公开(公告)号：US20110118996A1

公开(公告)日：2011-05-19

申请号：US12775950

申请日：2010-05-07

申请人： Gregory B. McKenna ,  Stephen J. Usala ,  Mark W. Vaughn ,  Jian Wang ,  Wei Wang

发明人： Gregory B. McKenna ,  Stephen J. Usala ,  Mark W. Vaughn ,  Jian Wang ,  Wei Wang

IPC分类号： G01N11/06 ,  G06F19/00

CPC分类号： A61B10/0012 ,  A61B2010/0022

摘要： A method and apparatus for assessing fertility in mammalian females comprising sampling cervical-vaginal fluid, measuring one or more of the sample's viscoelastic properties, and evaluating the measurement to determine fertility. Preferable embodiments of the current invention may utilize measurement of the viscoelastic property of die swell ratio, or other viscoelastic properties of cervical-vaginal fluid.

摘要翻译： 一种用于评估哺乳动物雌性生殖力的方法和装置，包括取样子宫颈阴道液，测量样品的一个或多个粘弹特性，并评估测量以确定生殖力。 本发明的优选实施方案可以利用模头溶胀比的粘弹性或宫颈阴道液的其它粘弹性的测量。

公开(公告)号：US20110085715A1

公开(公告)日：2011-04-14

申请号：US12578826

申请日：2009-10-14

申请人： Jiayong Yan ,  Wei Wang ,  Liangliang Pan ,  Victor C. Wong

发明人： Jiayong Yan ,  Wei Wang ,  Liangliang Pan ,  Victor C. Wong

IPC分类号： G06K9/00

CPC分类号： G06T7/0081 ,  G06T7/11 ,  G06T7/155 ,  G06T2207/10064 ,  G06T2207/20152 ,  G06T2207/30036

摘要： A method for locating one or more interproximal tooth regions in a digital tooth image. The method can be executed at least in part on data processing hardware. The method includes generating the digital tooth image from a fluorescence image of one or more teeth and a reflectance image of the one or more teeth, so as to combine image data from the fluorescence and reflectance images. The digital tooth image has intensity values for pixels corresponding to the one or more teeth and background. The method identifies one or more tooth regions by processing the digital tooth image and locates the one or more interproximal tooth regions according to the one or more identified tooth regions.

摘要翻译： 一种用于定位数字牙齿图像中的一个或多个邻间牙齿区域的方法。 该方法至少部分地可以在数据处理硬件上执行。 该方法包括从一个或多个齿的荧光图像和一个或多个齿的反射图像生成数字牙齿图像，以便组合来自荧光和反射图像的图像数据。 数字牙齿图像具有对应于一个或多个牙齿和背景的像素的强度值。 该方法通过处理数字牙齿图像来识别一个或多个牙齿区域，并且根据一个或多个识别的牙齿区域定位一个或多个邻间牙齿区域。

公开(公告)号：US07882039B2

公开(公告)日：2011-02-01

申请号：US11191389

申请日：2005-07-28

申请人： Aaron Frederick Weiss ,  Wei Wang ,  Egon Smola

发明人： Aaron Frederick Weiss ,  Wei Wang ,  Egon Smola

IPC分类号： G06Q10/00 ,  G06Q99/00 ,  G06F7/00 ,  G06F17/30

CPC分类号： G06Q50/10 ,  G06F17/30867 ,  G06Q30/02 ,  G06Q50/01

摘要： A system and method are directed towards automatically modifying an online dating service's search results based on adaptive personalizations from a user's activities. A user provides input to questions that seek information regarding the user. The invention employs the input to identify a list of candidates for a potential long-term social relationship with the user. The invention may then develop a unified search score for each candidate that represents a weighted sum of normalized search subscores. The subscores represent various user activities, affinities with a candidate, frequencies of viewing a candidate profile, and feedback about a candidate from the user. The unified search score for each candidate is then used to rank order the results presented to the user.

摘要翻译： 系统和方法旨在基于来自用户活动的适应性个性化来自动修改在线约会服务的搜索结果。 用户向寻求与用户有关的信息的问题提供输入。 本发明使用输入来识别与用户潜在的长期社会关系的候选者列表。 然后，本发明可以为表示归一化搜索子集的加权和的每个候选者开发统一的搜索分数。 分数表示各种用户活动，与候选者的亲和力，观看候选简档的频率以及关于来自用户的候选者的反馈。 然后使用每个候选人的统一搜索分数对呈现给用户的结果进行排序。

公开(公告)号：US07850426B2

公开(公告)日：2010-12-14

申请号：US11728067

申请日：2007-03-23

申请人： Wei Wang ,  Nigel Gurney ,  Michael Van Sickle ,  David Avins ,  Michael Buck ,  Christopher Hensel ,  Aaron J. Schley

发明人： Wei Wang ,  Nigel Gurney ,  Michael Van Sickle ,  David Avins ,  Michael Buck ,  Christopher Hensel ,  Aaron J. Schley

IPC分类号： F01D25/28

CPC分类号： F16H41/24 ,  F16H41/28 ,  F16H2041/243

摘要： The present invention broadly comprises a torque converter including a cover arranged to accept torque from a drive unit and an impeller. The cover and the impeller are joined by a crimped connection. In some aspects, the converter includes a sealing element disposed between the cover and the impeller and the sealing element is selected from the group consisting of an o-ring and a gasket. In some aspects, the cover is a cast piece. In some aspects, the cover is formed by a process selected from the group consisting of: molding, compression molding, and pressed metal forming. In some aspects, the cover is a stamped metal piece. The present invention also broadly comprises a torque converter including a cover, an impeller, and an induction brazed connection joining the cover and impeller. In some aspects, the cover further comprises axially disposed fingers engaged with the impeller.

摘要翻译： 本发明广泛地包括一个液力变矩器，其包括布置成接受来自驱动单元和叶轮的转矩的盖。 盖和叶轮通过压接连接连接。 在一些方面，转换器包括设置在盖和叶轮之间的密封元件，并且密封元件选自O型圈和垫圈。 在某些方面，盖子是铸件。 在一些方面，所述盖通过选自以下的方法形成：成型，压塑和压制金属成型。 在一些方面，盖是冲压的金属件。 本发明还广泛地包括一个包括盖子，叶轮和连接盖子和叶轮的感应钎焊接头的变矩器。 在一些方面，盖子还包括与叶轮接合的轴向设置的指状物。

公开(公告)号：USD628313S1

公开(公告)日：2010-11-30

申请号：US29361212

申请日：2010-05-07

申请人： Wei Wang ,  Wen-Hsiang Lu ,  Chiang-Kuo Tang

设计人： Wei Wang ,  Wen-Hsiang Lu ,  Chiang-Kuo Tang

公开(公告)号：US07821229B2

公开(公告)日：2010-10-26

申请号：US12335325

申请日：2008-12-15

申请人： Wei Wang ,  Guoxing Li ,  Sean Xiao

发明人： Wei Wang ,  Guoxing Li ,  Sean Xiao

IPC分类号： H01M10/44 ,  H01M10/46

CPC分类号： H02J7/0016

摘要： A system and method for cell balancing with smart low-voltage control circuit. The cell balancing system comprises a plurality of battery cells, an external bypass path for each cell, an internal bypass path for each cell, an input terminal receiving an enable signal for each cell, an input terminal receiving a selection signal, and a cell balancing unit for generating a configuration signal to conduct the external bypass path or internal bypass path. The enable signal is configured to enable a bypass current of each cell, and the selection signal is configured to select the external bypass path or internal bypass path. The cell balancing unit is employed to receive signals from input terminals, and generate a configuration signal to control the conductance of external bypass paths or internal bypass paths.

摘要翻译： 一种智能低压控制电路电池平衡的系统和方法。 电池平衡系统包括多个电池单元，每个单元的外部旁路路径，每个单元的内部旁路路径，每个单元接收使能信号的输入端子，接收选择信号的输入端子和单元平衡 用于产生配置信号以传导外部旁路路径或内部旁路路径的单元。 使能信号被配置为启用每个单元的旁路电流，并且选择信号被配置为选择外部旁路路径或内部旁路路径。 采用电池平衡单元从输入端子接收信号，并产生配置信号以控制外部旁路路径或内部旁路路径的电导。

公开(公告)号：US20100268109A1

公开(公告)日：2010-10-21

申请号：US12451944

申请日：2008-06-06

申请人： Wei Wang

发明人： Wei Wang

IPC分类号： A61B5/053

CPC分类号： A61B5/0536

摘要： A method for analyzing the structure of an electrically conductive object, the method comprising the steps of: (i) obtaining electrical impedance data for the object over a range of frequencies; (ii) analyzing the obtained electrical impedance data using a transfer function of an assumed electrical model to determine a plurality of electrical impedance properties for the object; (iii) constructively combining selected ones of the determined plurality of electrical impedance properties to provide at least one parametric impedance value for the object; and (iii) imaging one or more of the determined parametric impedance values.

摘要翻译： 一种用于分析导电物体的结构的方法，所述方法包括以下步骤：（i）在频率范围内获得所述物体的电阻抗数据; （ii）使用假定的电气模型的传递函数分析所获得的电阻抗数据，以确定所述物体的多个电阻抗特性; （iii）构建性地组合所确定的多个电阻抗特性中的所选择的一个以为所述物体提供至少一个参数阻抗值; 以及（iii）对确定的参数阻抗值中的一个或多个进行成像。

公开(公告)号：USD623642S1

公开(公告)日：2010-09-14

申请号：US29356972

申请日：2010-03-04

申请人： Wei Wang

设计人： Wei Wang

公开(公告)号：US20100133640A1

公开(公告)日：2010-06-03

申请号：US12434199

申请日：2009-05-01

申请人： Zhiqi Wang ,  Guoqing Yu ,  Qiuhong Zou ,  Youjun Wang ,  Wei Wang

发明人： Zhiqi Wang ,  Guoqing Yu ,  Qiuhong Zou ,  Youjun Wang ,  Wei Wang

IPC分类号： H01L31/0224 ,  H01L21/768

CPC分类号： H01L27/14687 ,  H01L24/13 ,  H01L27/14618 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/0554 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The invention discloses a packaging structure and packaging method. The packaging structure includes a solder bump, a pad located on a front side of a chip, and an intermediate metal layer which connects the solder bump and the pad, wherein a through hole passing from a back side of the chip to the pad is provided on the chip, and the intermediate metal layer is connected to the pad within the through hole. In the packaging structure, a through hole is formed on the back side of the chip to expose the pad on the front side of the chip and the intermediate metal layer is connected to the pad within the through hole. This provides a relatively large contacting area therebetween. The connection thus formed is more reliable and stable, compared with the prior art structure.

摘要翻译： 本发明公开了一种包装结构和包装方法。 封装结构包括焊料凸块，位于芯片前侧的焊盘和连接焊料凸块和焊盘的中间金属层，其中提供从芯片的背面通过焊盘的通孔 并且中间金属层在通孔内连接到焊盘。 在封装结构中，在芯片的背面形成通孔，露出芯片正面的焊盘，中间金属层与通孔内的焊盘连接。 这提供了它们之间相对较大的接触面积。 与现有技术的结构相比，这样形成的连接更可靠和稳定。