摘要:
Device integrity authentication is performed by receiving, at a second device, data from a first device. A determination is made at the second device as to whether at least a portion of the data is associated with a protected datatype. A measured integrity value of the first device is determined in response to the portion of the data being associated with the protected datatype. The measured integrity value of the first device is compared to an embedded integrity value associated with the second device. Application of at least one of a plurality of policies associated with processing the data is facilitated at the second device based on the comparison and the protected datatype.
摘要:
The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a package electrode pattern formed in their order on the lower metal layer. The LED package also includes a spacer having a cavity, formed on the electrode pattern. The LED package further includes an LED mounted in the cavity by flip-chip bonding to the electrode patterns, and an optical element attached to the upper surface of the spacer.
摘要:
Disclosed herein is a composition for removing an immersion lithography solution. The composition includes an organic solvent and an acid compound. Also disclosed is a method for manufacturing a semiconductor device including an immersion lithography process. When a photoresist pattern is formed by the immersion lithography process, an exposure process is performed on a photoresist film formed over an underlying layer with an immersion lithography exposer. Then, the composition is dripped over the wafer to remove residual immersion lithography solution on the photoresist film, thereby improving a water mark defect phenomenon.
摘要:
A plasma display apparatus is provided. The waveform of a set up signal applied in a reset period rises in at least two steps and first and second switches provided for applying the set up signal are simultaneously turned on. Therefore, it is possible to prevent strong discharge from being generated in the reset period and to thus improve picture quality
摘要:
A container has an inner vessel for containing liquid such as milk, water, juice or the like. An outer vessel creates a larger volume than the volume of the inner vessel, so that the inner vessel can fit inside the outer vessel. A top cap secures the inner and outer vessels in spaced relation to each other. The top cap can have an integral nipple in fluid communication with the inside of the inner vessel. In another embodiment, a vent in a top cap permits air to enter a liquid holding vessel as the liquid is removed. A filter in the vent allows the air to pass, but not the liquid, so the liquid does not spill when the container is tipped.
摘要:
Conformationally constrained compounds that mimic the secondary structure of reverse-turn regions of biologically active peptides and proteins are disclosed. Such reverse-turn mimetic structures have utility over a wide range of fields, including use as diagnostic and therapeutic agents. Libraries containing the reverse-turn mimetic structures of this invention are also disclosed as well as methods for screening the same to identify biologically active members. The invention also relates to the use of such compounds for inhibiting or treating disorders modulated by Wnt-signaling pathway, such as cancer, especially colorectal cancer, restenosis associated with angioplasty, polycystic kidney disease, aberrant angiogenesis disease, rheumatoid arthritis disease, tuberous sclerosis complex, Alzheimer's disease, excess hair growth or loss, or ulcerative colitis.
摘要:
A reformer is disclosed for supplying a reformed gas containing hydrogen to a fuel cell. The reformer comprises a heat source; a preheating portion preheated by heat from the heat source; a pipe shaped reforming reaction unit; a carbon monoxide processing unit extending from the reforming reaction unit; and a rugged portion installed on an internal surface of the pipe shaped reforming reaction unit which is heated by the heat source. By using the rugged portion and the extended pipe design, the area heated by the heat source is increased and more heat is recovered, thereby improving thermal efficiency.
摘要:
A plasma display apparatus is disclosed to prevent an erroneous discharge when a plasma display panel is driven and drive the plasma display panel at a high speed. The plasma display apparatus comprises a plasma display panel (PDP) comprising a scan electrode, a sustain electrode and an address electrode, a scan driver for applying a set-up waveform which rises up to a first voltage at a first slope and then rises up to a second voltage at a second slope to the scan electrode during a reset period, and an address driver for applying a first positive polarity pulse to the address electrode while the set-up waveform is being applied to the scan electrode.
摘要:
A container has an inner vessel for containing liquid such as milk, water, juice or the like. An outer vessel creates a larger volume than the volume of the inner vessel, so that the inner vessel can fit inside the outer vessel. A top cap secures the inner and outer vessels in spaced relation to each other. The top cap can have an integral nipple in fluid communication with the inside of the inner vessel. In another embodiment, a vent in a top cap permits air to enter a liquid holding vessel as the liquid is removed. A filter in the vent allows the air to pass, but not the liquid, so the liquid does not spill when the container is tipped.
摘要:
The present invention relates to an LED package including photo diode. The LED package includes a silicon substrate, and a photo diode is formed in an upper part thereof. Also, an insulation layer is formed on the silicon substrate excluding at least a light-receiving area of the photodiode. In the LED package, an LED terminal is formed on the insulation layer to be connected to the photo diode. First and second LED connecting pads are formed on the insulation layer, and arranged on both sides of the photo diode. In addition, an LED chip is mounted on the silicon substrate, and connected to the first and second LED connecting pads.