摘要:
A method and a device for measuring the dimensions of a constant velocity joint. In the method, for example, the cylindrical part of an outer member with a specified offset value is supported on the support part of a dimension measuring device for the outer member. On the other hand, a holding bar is inserted into a recessed part formed in the shaft part of the outer member. In this case, balls installed at the tip of the support part are inserted into the ball grooves of the cylindrical part. In this state, a rotating member is rotated to bring a probe into contact with the inside wall of the cylindrical part. The measurement core of a micro gauge is displaced according to the displacement of the probe, and the amount of the displacement thereof is displayed as the amount of the variation of the needle of the micro gauge.
摘要:
A HDTMOS includes a Si substrate, a buried oxide film and a semiconductor layer. The semiconductor layer includes an upper Si film, an epitaxially grown Si buffer layer, an epitaxially grown SiGe film, and an epitaxially grown Si film. Furthermore, the HDTMOS includes an n-type high concentration Si body region, an n− Si region, a SiGe channel region containing n-type low concentration impurities, an n-type low concentration Si cap layer, and a contact which is a conductor member for electrically connecting the gate electrode and the Si body region. The present invention extends the operation range while keeping the threshold voltage small by using, for the channel layer, a material having a smaller potential at the band edge where carriers travel than that of a material constituting the body region.
摘要:
The bipolar transistor of the present invention includes a Si collector buried layer, a first base region made of a SiGeC layer having a high C content, a second base region made of a SiGeC layer having a low C content or a SiGe layer, and a Si cap layer 14 including an emitter region. The C content is less than 0.8% in at least the emitter-side boundary portion of the second base region. This suppresses formation of recombination centers due to a high C content in a depletion layer at the emitter-base junction, and improves electric characteristics such as the gain thanks to reduction in recombination current, while low-voltage driving is maintained.
摘要:
A field effect transistor comprises: a semiconductor substrate; a semiconductor layer provided on the semiconductor substrate, the semiconductor layer including a body region which contains an impurity of a first conductivity type; a gate dielectric film provided on the semiconductor layer; a gate electrode provided on the gate dielectric film; and a source region and a drain region provided in the semiconductor layer at positions below the sides of the gate electrode, the source region and the drain region containing an impurity of a second conductivity type. The gate electrode and the body region are electrically short-circuited. In the semiconductor layer except for the source region and the drain region, at least part of a junction portion bordering on the source region or the drain region contains the impurity of the first conductivity type with a higher concentration than in the body region except for junction portions bordering on the source region and the drain region.
摘要:
A vertical field effect transistor includes: an active region with a bundle of linear structures functioning as a channel region where electric carriers are transported; a lower electrode, connected to the bottom of the active region and functioning as one of source and drain regions; an upper electrode, connected to the top of the active region and functioning as the other of the source and drain regions; a gate electrode for controlling the electric conductivity of at least a portion of the bundle of linear structures included in the active region; and a gate insulating film arranged between the active region and the gate electrode to electrically isolate the gate electrode from the bundle of linear structures. The transistor further includes a dielectric portion between the upper and lower electrodes. The upper electrode is located over the lower electrode with the dielectric portion interposed and includes an overhanging portion that sticks out laterally from over the dielectric portion. The active region is located right under the overhanging portion of the upper electrode.
摘要:
A semiconductor device according to the invention includes: a semiconductor layer (10–15); a gate insulator (16) provided on the semiconductor layer; a gate electrode (17) provided on the gate insulator; a source region (20a) and a drain region (20b), which are of a first conductivity type and are provided in the semiconductor layer on both sides of the gate electrode in plan view; a cap layer (25), a channel region (24), and an under-channel region (23,22), which are of a second conductivity type and are provided in the semiconductor layer between the source region and the drain region in a descending order from an interface with the gate insulator; and a bias electrode member (Vbs) for applying a voltage to the under-channel region, wherein the channel region is formed of a first semiconductor, the cap layer and the under-channel region are formed of a second semiconductor and a third semiconductor, respectively, each of which has a larger band gap than the first semiconductor, the bias electrode member is capable of applying the voltage independently of the gate electrode.
摘要:
An object is to accurately measure the Stokes parameters, without the occurrence of polarization fluctuations or PDL during the splitting of the incident light. When the incident light is made incident on a first-stage prism, the light is split into two first splitting light rays. Next, the first split light rays are respectively incident on a pair of prisms of a second stage. Each of the pair of first split light rays is split into two rays by a second-stage prism, to obtain four second split light rays.
摘要:
A region of an Si layer (15) located between source and drain regions (19 and 20) is an Si body region (21) which contains an n-type impurity of high concentration. An Si layer (16) and an SiGe layer (17) are, in an as grown state, undoped layers into which no n-type impurity is doped. Regions of the Si layer 16 and the SiGe layer (17) located between the source and drain regions (19 and 20) are an Si buffer region (22) and an SiGe channel region (23), respectively, which contain the n-type impurity of low concentration. A region of an Si film (18) located directly under a gate insulating film (12) is an Si cap region (24) into which a p-type impurity (5×1017 atoms·cm−3) is doped. Accordingly, a semiconductor device in which an increase in threshold voltage is suppressed can be achieved.
摘要:
There is provided a MQB layer as a multi-quantum barrier portion composed of well layers and barrier layers that are formed of extremely thin films having different compositions and alternately stacked. This enhances an effective barrier height by using the phenomenon that holes likely to flow from a SiGe base layer to a Si emitter layer are reflected by the MQB layer and thereby suppresses the reverse injection of the holes from the SiGe base layer into the Si emitter layer. As a result, the reverse injection of carriers is suppressed by the MQB layer even when the base doping concentration is increased, which provides a satisfactory current amplification factor and increases a maximum oscillation frequency. What results is a bipolar transistor having excellent RF characteristics such as current amplification factor, current gain cutoff frequency, and maximum oscillation frequency in a microwave band or the like.
摘要:
A rectifying plate (53) is inserted between gas outlets of a first inflator (51a) and/or a second inflator (51b) and a diffuser (55), and is formed with a plurality of openings which have different areas and uniform gas flows released from the gas outlets, and the opening area corresponding to the inactive second inflator (51b) of the first and second inflators (51a, 51b) is larger than the opening area corresponding to the active first inflator (51a).