公开(公告)号：US20230397376A1

公开(公告)日：2023-12-07

申请号：US17833331

申请日：2022-06-06

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

CPC classification number: H05K7/20772 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/20509

Abstract: Systems and methods for testing in a datacenter are disclosed. In at least one embodiment, an aluminum nitride (Al—N) heat spreader includes, on one side, a patterned heat trace having a first concentration pattern that is dense relative to a second concentration pattern of a patterned heat trace, which all form part of a thermal test vehicle (TTV) to replicate heat generation by a computing device in a test of a datacenter cooling system.

公开(公告)号：US20230380116A1

公开(公告)日：2023-11-23

申请号：US18229243

申请日：2023-08-02

Applicant: NVIDIA Corporation

Inventor： Ali Heydari

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H05K7/20736 ,  H05K7/20781 ,  H05K7/20272 ,  H05K7/20263 ,  H05K7/20236 ,  H05K7/20254

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, system includes one or more processors to use one or more neural networks to control a direction of air flow caused by one or more fans to cool a coolant circulating within a liquid-to-air heat exchanger or to cool one or more servers of a rack, based at least in part on sensor data associated with at least one of: the coolant or the rack.

公开(公告)号：US20230284423A1

公开(公告)日：2023-09-07

申请号：US17688290

申请日：2022-03-07

Applicant: Nvidia Corporation

Inventor： Ali Heydari ,  Pardeep Shahi

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H05K7/20781

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a first interfacing flow controller includes a sensor and is associated with a first server tray of a rack, so that a first interfacing flow controller can receive sensor inputs and can communicate with a second interfacing flow controller by a communication line there between, where a second interfacing flow controller can be associated with a coolant distribution unit (CDU) to cause a balance of coolant flow to be provided from a CDU to one or more second server trays based in part on a change in a coolant flow to a first server tray as indicated by such sensor inputs.

公开(公告)号：US20230284422A1

公开(公告)日：2023-09-07

申请号：US18133655

申请日：2023-04-12

Applicant: NVIDIA Corporation

Inventor： Ali Heydari

IPC: H05K7/20

CPC classification number: H05K7/20772 ,  H05K7/20272 ,  H05K7/20836

Abstract: A datacenter liquid cooling system is disclosed. A processor detects whether one or more liquid distribution units (LDUs) of the datacenter cooling system can be deactivated based on one or more workloads of one or more servers cooled by the datacenter cooling system.

公开(公告)号：US11751359B2

公开(公告)日：2023-09-05

申请号：US17142690

申请日：2021-01-06

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  H05K7/14 ,  G06N3/02

CPC classification number: H05K7/20781 ,  H05K7/1489 ,  H05K7/20272 ,  H05K7/20281 ,  H05K7/20836 ,  G06N3/02

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a first flow controller within a cooling manifold is associated with a second flow controller and with a tube there between; and the first flow controller is movable in at least one direction relative to dimensions of the cooling manifold so that it can be positioned for mating with a server tray or box and so that the second flow controller can be mated with a rack manifold.

公开(公告)号：US20230273658A1

公开(公告)日：2023-08-31

申请号：US18143514

申请日：2023-05-04

Applicant: NVIDIA Corporation

Inventor： Ali Heydari

IPC: G06F1/20 ,  G05B15/02

CPC classification number: G06F1/206 ,  G05B15/02 ,  H05K7/20836

Abstract: Systems and methods for operating a datacenter are disclosed. In at least one embodiment, an apparatus comprises a controller to control a proportion of coolant provided by an air cooling unit and a liquid cooling unit based, at least in part, on temperature of one or more electronic components.

公开(公告)号：US11681341B2

公开(公告)日：2023-06-20

申请号：US17857868

申请日：2022-07-05

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: G06F1/20 ,  G05B19/042 ,  F24F3/00 ,  G06N20/00

CPC classification number: G06F1/20 ,  G05B19/042 ,  G06N20/00 ,  G05B2219/2614 ,  G06F2200/201

Abstract: A cooling system for a datacenter is disclosed. An evaporative cooling subsystem provides blown air for cooling the datacenter and a repurposable refrigerant cooling subsystem controls moisture of the blown air in a first configuration and independently cools the datacenter in a second configuration.

公开(公告)号：US20230180444A1

公开(公告)日：2023-06-08

申请号：US17542736

申请日：2021-12-06

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  G05B13/02

CPC classification number: H05K7/20836 ,  H05K7/20763 ,  H05K7/20754 ,  G05B13/027

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a flow controller adapter of a cooling manifold is to interchangeably receive a flow controller of a plurality of flow controllers, wherein a flow controller adapter is associated with a rack-side flow controller and with a tube there between and is configured to be movable within cooling manifold to allow different positions for mating a flow controller with a server-side flow controller of server tray or box.

公开(公告)号：US20230018746A1

公开(公告)日：2023-01-19

申请号：US17368174

申请日：2021-07-06

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  H05K7/14 ,  G06F1/20 ,  G06N3/08

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, one or more blanks may be associated with a motorized subsystem and can be used with one or more server openings on a rack, so that the motorized subsystem can cause the one or more blanks to close or open an individual server opening based in part on a change within the individual server opening.

公开(公告)号：US20220413572A1

公开(公告)日：2022-12-29

申请号：US17357589

申请日：2021-06-24

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: G06F1/20 ,  G05B15/02

Abstract: Systems and methods for operating a datacenter are disclosed. In at least one embodiment, hybrid cooling unit is disclosed wherein an evaporative cooler is to provide a source of cooled air and a liquid heat exchanger is to provide a source of cooled liquid for cooling one or more electronic components, the hybrid cooling unit further including an air inlet to direct a flow of external air to remove heat from the evaporative cooler and the liquid heat exchanger.