公开(公告)号：US20200271128A1

公开(公告)日：2020-08-27

申请号：US16405490

申请日：2019-05-07

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Hou-Hsien CHANG

IPC: F04D29/56 ,  G06F1/20 ,  H05K7/20

Abstract: The present disclosure provides an apparatus for a cooling fan in a computer system. The apparatus comprises a plurality of bars, a plurality of slats, a knob, and at least one pin. Each slat of the plurality of slats pivotably couples to at least one bar in the plurality of bars. The knob is located at an option on each of bar of a plurality of bars. Rotating movements of the knob adjust the apparatus between a plurality of positions. The at least one pin can be received at an opening in the cooling fan.

公开(公告)号：US20200077543A1

公开(公告)日：2020-03-05

申请号：US16246050

申请日：2019-01-11

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Ching-Yu CHEN ,  Kuo-Wei LEE

IPC: H05K7/20 ,  H05K5/02 ,  F28F3/02 ,  H05K5/06

Abstract: A server includes an inner housing disposed within an outer housing such that a channel is defined between them. The inner housing includes a low-power electronic component and a high-power electronic component, and is sealed to protect the components. A first heat sink extends through the inner housing. Heat generated by the low-power electronic component is transferred through an inner portion of the first heat sink to an outer portion of the first heat sink. A second heat sink disposed in the channel is coupled to the high-power electronic component via heat pipes that extend through the inner housing. Heat generated by the high-power electronic component is transferred through the heat pipes to the second heat sink. A fan positioned in the channel causes air to enter the channel through a first vent, flow through the channel, and exit the channel via a second vent to remove the generated heat.

公开(公告)号：US20200037457A1

公开(公告)日：2020-01-30

申请号：US16285989

申请日：2019-02-26

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Hou-Hsien CHANG

IPC: H05K5/02

Abstract: The present disclosure provides a latching apparatus with a first component and a second component. The first component is made of a first material and includes a distal end, a proximal end, and an indention between the distal end the proximal end. The distal end includes a mating tab, whereas the proximal end includes a flange member for fixing the first component to a lid of a housing. The second component is made of a second material and is coupled to the mating tab. The second component includes a receiving element for engaging with a securing element of the housing. The latching element includes a pressing region formed in one of the first component and the second component between the indention and the receiving element. The first material has a higher flexibility that the second material.

公开(公告)号：US20190364697A1

公开(公告)日：2019-11-28

申请号：US16114962

申请日：2018-08-28

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yi-Nien HUANG ,  Ching-Yu CHEN ,  Erh-Kai FANG

IPC: H05K7/20

Abstract: An apparatus for cooling an electronic component is provided. The apparatus includes a heat-absorbing base configured to contact the electronic component within a server device and a heat-dissipating body connected to the heat-absorbing base. The heat-dissipating body includes a heat-dissipating static feature and at least one heat-dissipating dynamic feature. The at least one heat-dissipating dynamic feature is configured to be repositioned about the heat-dissipating static feature to increase a surface area of the heat-dissipating body. Using hinge device and flexible metal conduit connect and transfer heat to them (dynamic and static feature). This apparatus will follow currently assembly process and also not impact the other device assembly method. The more space we have inside the product the more heat we can solve.

公开(公告)号：US20190297748A1

公开(公告)日：2019-09-26

申请号：US15926068

申请日：2018-03-20

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yi-Chieh CHEN ,  Yueh-Chang WU ,  Yi-Ta HSU

IPC: H05K7/20

Abstract: A method and structure for improving efficiency of cooling and temperature uniformity among a plurality of heat generating electronic devices arranged in rows within a housing, such as a GPU server, utilizing a single source of cooling air. The electronic devices are arranged in a plurality of rows, but the heat sinks for the last row are elevated above the heat sinks of the first row so as to occupy different positions within the cooling air stream. In some embodiments the heat sinks of the electronic devices are extended forward so as to reside near the heat sinks of the electronic devices in the first row, but in a different flow path of cooling air. In other embodiments, a thermo siphon refrigeration system is provided for the electronic devices in the last row, and may be provided for the electronic devices in the first row as well.

公开(公告)号：US20190296486A1

公开(公告)日：2019-09-26

申请号：US16058408

申请日：2018-08-08

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Kuen-Hsien WU ,  Kuo-Wei LEE

IPC: H01R13/631 ,  H05K7/20 ,  H01R13/502

Abstract: A heat transfer system between a heat source and a heat sink, wherein the heat transfer contact surfaces comprise a metal which forms numerous voids when placed adjacent one another. A thermal pad comprising a polymer filled with ceramic particles is placed between these heat transfer surfaces to intimately contact each of the metal surfaces without void formation, thereby increasing thermal conductivity. The heat source and heat sink are joined by relative sliding motion. This sliding motion might damage the thermal pad. Thus, a hot swap structure is provided for controlling the movement of the thermal pad into contact with the heat source as the sliding motion is completed.

公开(公告)号：US20190239385A1

公开(公告)日：2019-08-01

申请号：US16039808

申请日：2018-07-19

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yi-Chieh CHEN ,  Yueh-Chang WU ,  Ming-Chin HUANG

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/32

CPC classification number: H05K7/20209 ,  G06F1/206 ,  G06F1/3221 ,  G06F1/325 ,  G06F1/3287 ,  H05K7/20136 ,  H05K7/20727 ,  H05K7/20836

Abstract: A system and method to control fan power for an electronic device based on cooling requirements is disclosed. The electronic device includes a power supply unit and a fan coupled to the power supply unit. A controller is coupled to the fan. The device includes at least one electronic component cooled by the fan. The controller is operable to classify the at least one electronic component, and regulate the power supplied to the fan based on the classification of the at least one electronic component.

公开(公告)号：US20190234647A1

公开(公告)日：2019-08-01

申请号：US15972795

申请日：2018-05-07

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Kuen-Hsien WU

IPC: F24F13/14

CPC classification number: F24F13/1426 ,  F04D19/007 ,  F04D25/08 ,  F04D25/14 ,  F04D25/166 ,  F04D29/601

Abstract: A fan assembly is disclosed to prevent reverse air flow when the fan stops working. The assembly has a fan module including an intake end, a motor casing and a motor propelling a fan. A louver module has a plurality of slats having an open position to allow air flow and a closed position to block air flow. The louver module is coupled to the motor casing to provide a seal between the louver module and the motor casing.

公开(公告)号：US20190223317A1

公开(公告)日：2019-07-18

申请号：US15939690

申请日：2018-03-29

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Herman TAN ,  Yung-Hsiang LU

IPC: H05K7/20 ,  H05F1/00

CPC classification number: H05K7/20009 ,  H05F1/00 ,  H05K7/20145 ,  H05K7/20709

Abstract: An air duct that can be attached to existing grille of an electronic device to improve airflow and reduce overall system impedance/pressure drop without increasing the power to an air mover. The air duct has a wall configuration to smooth-out airflow while simultaneously delivering more airflow to selected portions of the interior of an electronic device, such as a server.

公开(公告)号：US20190219135A1

公开(公告)日：2019-07-18

申请号：US15960943

申请日：2018-04-24

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Hung-Yen KE

IPC: F16G13/16 ,  H02G3/04

Abstract: A protective device for a cable in the form of a plurality of interconnected links forming a chain. At least one of the links comprises a retaining element, which may be a C-shaped or an L-shaped element which completes the formation of an enclosed void into which a cable can be inserted for protection. Each link preferably includes two opposed sidewalls connected by a bottom wall and the C-shaped or L-shaped element. When the retaining member is the L-shaped element, the L-shaped element is hingedly connected to one of the opposed sidewalls.