公开(公告)号：US20220369006A1

公开(公告)日：2022-11-17

申请号：US17735968

申请日：2022-05-03

Applicant: STMICROELECTRONICS LTD ,  STMICROELECTRONICS (ROUSSET) SAS ,  STMicroelectronics Razvoj Polprevodnikov D.O.O.

Inventor： Nicolas CORDIER ,  Chia Hao CHEN ,  Karel BLAHA

IPC: H04Q9/06

Abstract: Provided is a device comprising a frequency demodulator and an amplitude demodulator. The device is configured to use, in a first mode, both the frequency demodulator and the amplitude demodulator in parallel and to activate a radio frequency identification (RFID) card mode or a Qi charger mode based on results provided by said demodulators.

公开(公告)号：US20220080979A1

公开(公告)日：2022-03-17

申请号：US17470962

申请日：2021-09-09

Applicant: STMICROELECTRONICS S.r.l. ,  STMICROELECTRONICS, INC. ,  STMicroelectronics (Grand Ouest) SAS

Inventor： Nicola Matteo PALELLA ,  Leonardo COLOMBO ,  Andrea DONADEL ,  Roberto MURA ,  Mahaveer JAIN ,  Joëlle PHILIPPE

IPC: B60W40/101 ,  B60W40/11 ,  B60W40/112 ,  B60W40/114 ,  G01S19/47

Abstract: A system includes inertial sensors and a GPS. The system generates a first estimated vehicle velocity based on motion data and positioning data, generates a second estimated vehicle velocity based on the processed motion data and the first estimated vehicle velocity, and generates fused datasets indicative of position, velocity and attitude of a vehicle based on the processed motion data, the positioning data and the second estimated vehicle velocity. The generating the second estimated vehicle velocity includes: filtering the motion data, transforming the filtered motion data in a frequency domain based on the first estimated vehicle velocity, generating spectral power density signals, generating an estimated wheel angular frequency and an estimated wheel size based on the spectral power density signals, and generating the second estimated vehicle velocity as a function of the estimated wheel angular frequency and the estimated wheel size.

公开(公告)号：US20210247212A1

公开(公告)日：2021-08-12

申请号：US17171726

申请日：2021-02-09

Applicant: STMicroelectronics SA ,  STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Rousset) SAS

Inventor： Laurent Beyly ,  Olivier Richard ,  Kenichi Oku

IPC: G01D5/24 ,  H03K17/96

Abstract: An embodiment of the present disclosure relates to a method of detection of a touch contact by a sensor including a first step of comparison of a voltage with a first voltage threshold; and a second step of comparison of the voltage with a second voltage threshold, the second step being implemented if the first voltage threshold has been reached within a duration shorter than a first duration threshold, the second voltage threshold being higher than the first voltage threshold.

公开(公告)号：US10419432B2

公开(公告)日：2019-09-17

申请号：US15026588

申请日：2014-10-17

Applicant: STMICROELECTRONICS SA ,  STMICROELECTRONICS (GRENOBLE 2) SAS ,  STMICROELECTRONICS S.R.L.

Inventor： Michael Soulie ,  Riccardo Locatelli ,  Valerio Catalano ,  Hajer Ferjani ,  Giuseppe Maruccia ,  Raffaele Guarrasi ,  Giuseppe Guarnaccia

IPC: H04L29/06 ,  G06F12/08 ,  G06F12/06

Abstract: An apparatus has a data store configured to store access activity information. The access activity information indicates which one or more of a plurality of different access parameter sets is active. The data store is also configured to store access defining information, which defines, at least for each active access parameter set, a number of channels, location information of said channels, and interleaving information associated with said channels.

公开(公告)号：US20190140176A1

公开(公告)日：2019-05-09

申请号：US16184246

申请日：2018-11-08

Applicant: STMicroelectronics (Crolles 2) SAS ,  STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Rousset) SAS

Inventor： Franck ARNAUD ,  David GALPIN ,  Stephane ZOLL ,  Olivier HINSINGER ,  Laurent FAVENNEC ,  Jean-Pierre ODDOU ,  Lucile BROUSSOUS ,  Philippe BOIVIN ,  Olivier WEBER ,  Philippe BRUN ,  Pierre MORIN

IPC: H01L45/00 ,  H01L27/24

Abstract: An electronic chip includes memory cells made of a phase-change material and a transistor. First and second vias extend from the transistor through an intermediate insulating layer to a same height. A first metal level including a first interconnection track in contact with the first via is located over the intermediate insulating layer. A heating element for heating the phase-change material is located on the second via, and the phase-change material is located on the heating element. A second metal level including a second interconnection track is located above the phase-change material. A third via extends from the phase-change material to the second interconnection track.

公开(公告)号：US10257917B2

公开(公告)日：2019-04-09

申请号：US15957578

申请日：2018-04-19

Applicant: STMicroelectronics (Alps) SAS ,  STMicroelectronics S.r.l. ,  STMicroelectronics Application GmbH

Inventor： Philippe Sirito-Olivier ,  Giovanni Luca Torrisi ,  Manuel Gaertner ,  Fritz Burkhardt

IPC: B60Q3/80 ,  H05B39/02 ,  H05B33/08 ,  B60Q1/00 ,  H05B39/04

Abstract: The power supply device comprises a supply transistor commanded by a command signal and providing electric power to a lighting module, and a driving means configured to selectively generate, depending on an instruction signal representative of the structure of said at least one lighting module, a first command signal able to command the supply transistor into an ohmic regime, a second command signal able to command the supply transistor into a pulse width modulation regime involving an alternation of ohmic regimes and blocked regimes, and a third command signal able to command the supply transistor into a saturated regime.

公开(公告)号：US10180324B2

公开(公告)日：2019-01-15

申请号：US15197414

申请日：2016-06-29

Applicant: STMICROELECTRONICS S.R.L. ,  STMICROELECTRONICS, INC. ,  STMICROELECTRONICS INTERNATIONAL N.V.

Inventor： Carlo Valzasina ,  Huantong Zhang ,  Matteo Fabio Brunetto ,  Gert Ingvar Andersson ,  Erik Daniel Svensson ,  Nils Einar Hedenstierna

IPC: G01C19/56 ,  G01P9/04 ,  G01C19/574 ,  G01C19/5719 ,  G01C19/5776

Abstract: A gyroscope includes a substrate, a first structure, a second structure and a third structure elastically coupled to the substrate and movable along a first axis. The first and second structure are arranged at opposite sides of the third structure with respect to the first axis A driving system is configured to oscillate the first and second structure along the first axis in phase with one another and in phase opposition with the third structure. The first, second and third structure are provided with respective sets of sensing electrodes, configured to be displaced along a second axis perpendicular to the first axis in response to rotations of the substrate about a third axis perpendicular to the first axis and to the second axis.

公开(公告)号：US09998689B2

公开(公告)日：2018-06-12

申请号：US14557158

申请日：2014-12-01

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Rousset) SAS ,  STMicroelectronics SA

Inventor： David Coulon ,  Benoit Deschamps ,  Frederic Barbier

IPC: H01L21/00 ,  H04N5/345 ,  H01L27/146 ,  H04N5/378

CPC classification number: H04N5/345 ,  H01L27/14605 ,  H01L27/14647 ,  H01L27/14689 ,  H04N5/378

Abstract: An imaging device includes at least one photosite formed in a semiconducting substrate and fitted with a filtering device for filtering at least one undesired radiation. The filtering device is buried in the semiconducting substrate at a depth depending on the wavelength of the undesired radiation.

公开(公告)号：US09938136B2

公开(公告)日：2018-04-10

申请号：US15240709

申请日：2016-08-18

Applicant: STMicroelectronics Asia Pacific Pte Ltd ,  STMicroelectronics S.r.l. ,  STMicroelectronics, Inc.

Inventor： Teck Khim Neo ,  Mauro Pasetti ,  Franco Consiglieri ,  Luca Molinari ,  Andrea Nicola Colecchia ,  Simon Dodd

IPC: B81B7/00 ,  B05B1/24

CPC classification number: B81B7/008 ,  B05B1/24 ,  B05B17/06 ,  B41J2/04501 ,  B41J2/04541 ,  B41J2/04543 ,  B41J2/14016 ,  B41J2/14072 ,  B81B2201/05 ,  B81B2207/012 ,  B81B2207/091

Abstract: The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.

公开(公告)号：US20180039320A1

公开(公告)日：2018-02-08

申请号：US15467614

申请日：2017-03-23

Applicant: STMicroelectronics (Crolles 2) SAS ,  STMicroelectronics (Alps) SAS ,  STMicroelectronics SA

Inventor： Vincent Huard ,  Silvia Brini ,  Chittoor Parthasarathy

IPC: G06F1/32 ,  G06F11/32 ,  G06F15/78 ,  G06F11/30

CPC classification number: G06F1/3262 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3296 ,  G06F11/3024 ,  G06F11/3048 ,  G06F11/3051 ,  G06F11/327 ,  G06F15/7814 ,  Y02D10/126 ,  Y02D10/172

Abstract: A system on a chip includes at least one integrated circuit that is configured to operate at least at one operating point. A monitoring circuit acquires at least the cumulative duration of activity of the at least one integrated circuit. An evaluation circuit establish at least one instantaneous state of aging of the at least one integrated circuit based on the at least one cumulative duration of activity. An adjustment circuit operates to change the at least one operating point on the basis of the at least one state of aging of the at least one integrated circuit.