公开(公告)号：US20220312553A1

公开(公告)日：2022-09-29

申请号：US17214340

申请日：2021-03-26

Applicant: Applied Materials, Inc.

Inventor： Dhritiman Subha Kashyap ,  Amit Rajendra Sherekar ,  Kartik Shah ,  Ashutosh Agarwal ,  Eric J. Hoffmann ,  Sanjeev Baluja ,  Vijay D. Parkhe

IPC: H05B1/02

Abstract: A heater assembly having a backside purge gap formed between a top plate and a heater of the heater assembly, the top plate having a top plate wall. The top plate wall having an upper portion, a middle portion and a lower portion, the middle portion forming an incline relative to the top portion.

公开(公告)号：US11434569B2

公开(公告)日：2022-09-06

申请号：US16400054

申请日：2019-05-01

Applicant: Applied Materials, Inc.

Inventor： Tuan Anh Nguyen ,  Jason M. Schaller ,  Edward P. Hammond, IV ,  David Blahnik ,  Tejas Ulavi ,  Amit Kumar Bansal ,  Sanjeev Baluja ,  Jun Ma ,  Juan Carlos Rocha

IPC: C23C16/505 ,  C23C16/44 ,  C23C16/458

Abstract: Embodiments described herein relate to ground path systems providing a shorter and symmetrical path for radio frequency (RF) energy to propagate to a ground to reduce generation of the parasitic plasma. The ground path system bifurcates the processing volume of the chamber to form an inner volume that isolates an outer volume of the processing volume.

公开(公告)号：US20220106683A1

公开(公告)日：2022-04-07

申请号：US17061015

申请日：2020-10-01

Applicant: Applied Materials, Inc.

Inventor： Sanjeev Baluja ,  Tejas Ulavi ,  Eric J. Hoffmann ,  Ashutosh Agarwal

IPC: C23C16/458 ,  C23C16/455

Abstract: Apparatus and methods for loading and unloading substrates from a spatial processing chamber are described. A support assembly has a rotatable center base and support arms extending therefrom. A support shaft is at the outer end of the support arms and a substrate support is on the support shaft. Primary lift pins are positioned within openings in the substrate support. Secondary lift pins are positioned within openings in the support arms and are aligned with the primary lift pins. An actuation plate within the processing volume causes, upon movement of the support assembly, the primary lift pins to elevate through contact with the secondary lift pins.

公开(公告)号：US11282676B2

公开(公告)日：2022-03-22

申请号：US16444549

申请日：2019-06-18

Applicant: Applied Materials, Inc.

Inventor： Hari Ponnekanti ,  Tsutomu Tanaka ,  Mandyam Sriram ,  Dmitry A. Dzilno ,  Sanjeev Baluja ,  Mario D. Silvetti

IPC: H01J37/32 ,  H01L21/02 ,  C23C16/455 ,  C23C16/46

Abstract: Processing chambers with a plurality of processing stations and individual wafer support surfaces are described. The processing stations and wafer support surfaces are arranged so that there is an equal number of processing stations and heaters. An RF generator is connected to a first electrode in a first station and a second electrode in a second station. A bottom RF path is formed by a connection between the a first support surface and a second support surface.

公开(公告)号：US20220068608A1

公开(公告)日：2022-03-03

申请号：US17011977

申请日：2020-09-03

Applicant: Applied Materials, Inc.

Inventor： Gopu Krishna ,  Alexander S. Polyak ,  Sanjeev Baluja

IPC: H01J37/32

Abstract: Process chambers and methods for calibrating components of a processing chamber while the chamber volume is under vacuum are described. The process chamber includes a motor shaft connected to the process chamber with a plurality of motor bolts. A support plate is positioned under the chamber floor to accommodate for deflection of the chamber floor due to vacuum conditions within the chamber volume. A bellows assembly extending from the chamber floor to the support plate maintains vacuum conditions within the chamber.

公开(公告)号：US11260432B2

公开(公告)日：2022-03-01

申请号：US17024955

申请日：2020-09-18

Applicant: Applied Materials, Inc.

Inventor： Tejas Ulavi ,  Arkaprava Dan ,  Sanjeev Baluja ,  Wei V. Tang

IPC: B08B7/00

Abstract: Substrate supports, substrate support assemblies and methods of using an arc generated between a first electrode and a second electrode to clean a support surface. The first electrode comprises a plurality of first branches which are interdigitated with a plurality of branches of the second electrode in a finger-joint like pattern creating a gap between the first electrode and the second electrode.

公开(公告)号：US11098404B2

公开(公告)日：2021-08-24

申请号：US16585463

申请日：2019-09-27

Applicant: Applied Materials, Inc.

Inventor： Dhritiman Subha Kashyap ,  Gopu Krishna ,  Sanjeev Baluja ,  Michael Rice

IPC: C23C16/455 ,  H01L21/67

Abstract: Multi-station process chamber lids comprising a plurality of station openings are described. A station separation purge channel is around the station openings. A plurality of angular purge channels separate station openings from adjacent station openings. A lid support beam can compensate for deflection of the chamber lid body.

公开(公告)号：US20210111059A1

公开(公告)日：2021-04-15

申请号：US17066974

申请日：2020-10-09

Applicant: Applied Materials, Inc.

Inventor： Tejas Ulavi ,  Vijay D. Parkhe ,  Naveen Kumar Nagaraja ,  Sanjeev Baluja ,  Surajit Kumar ,  Dhritiman Subha Kashyap ,  Ashutosh Agarwal

IPC: H01L21/683 ,  C23C16/458 ,  H01L21/67 ,  C23C16/455

Abstract: Substrate supports comprising a plurality of bonded plates forming a single component support body and methods of forming the substrate supports are described. The single component support body has an outer peripheral edge, a top surface and a bottom surface. A pocket is formed in the top surface and has a bottom surface, a depth and an outer peripheral edge. A purge ring is spaced a distance from the outer peripheral edge and comprises at least one opening in the top surface in fluid communication with a purge gas line within the body thickness.

公开(公告)号：US20210111058A1

公开(公告)日：2021-04-15

申请号：US17066971

申请日：2020-10-09

Applicant: Applied Materials, Inc.

Inventor： Tejas Ulavi ,  Sanjeev Baluja ,  Dhritiman Subha Kashyap

IPC: H01L21/683 ,  H01L21/67

Abstract: Substrate supports comprising a top plate positioned on a shaft are described. The top plate including a primary heating element a first depth from the surface of the top plate, a inner zone heating element a second depth from the surface of the top plate and an outer zone heating element a third depth from the surface of the top plate. Substrate support assemblies comprising a plurality of substrate supports and methods of processing a substrate are also disclosed.

公开(公告)号：US20210087685A1

公开(公告)日：2021-03-25

申请号：US17025294

申请日：2020-09-18

Applicant: Applied Materials, Inc.

Inventor： Ashutosh Agarwal ,  Sanjeev Baluja

IPC: C23C16/455 ,  H01J37/32

Abstract: Gas distribution apparatus, processing chambers and methods using a dead volume-free valve are described. The valve has a first inlet line with upstream and downstream ends and a second inlet line with a downstream end that connects to the first inlet line. A sealing surface at the downstream end of the second inlet line separates the first inlet line from the second inlet line preventing fluid communication between the first inlet line and the second inlet line.