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    Hermetic packaging of a micro-battery device
    121.
    发明授权
    Hermetic packaging of a micro-battery device 有权

    公开(公告)号：US11522243B2

    公开(公告)日：2022-12-06

    申请号：US17128371

    申请日：2020-12-21

    Applicant: International Business Machines Corporation

    Inventor： Qianwen Chen ,  Jae-Woong Nah ,  Bing Dang ,  Leanna Pancoast ,  John Knickerbocker

    IPC: H01M50/171 ,  H01M10/0585 ,  H01M50/191 ,  H01M50/197 ,  H01M50/186

    Abstract: A method of manufacturing a micro-battery is provided. The method includes forming a micro-battery device by forming a first metal anode via and a first metal cathode via in a first substrate, forming a first metal layer on a bottom side of the first substrate, forming a first battery element on a top side of the substrate, forming an encapsulation layer around the first battery element, forming trenches through the encapsulation layer and the first substrate on different sides of the first battery element, and forming a metal sealing layer in the trenches to cover at least a plurality of sidewall surfaces of the first battery element. The metal sealing layer is electrically connected to the battery element through the first metal layer and the first metal cathode via.

    Stackable near-field communications antennas
    122.
    发明授权
    Stackable near-field communications antennas 有权

    公开(公告)号：US11342108B2

    公开(公告)日：2022-05-24

    申请号：US15977178

    申请日：2018-05-11

    Applicant: International Business Machines Corporation

    Inventor： Bo Wen ,  Bing Dang ,  Rajeev Narayanan

    IPC: H01F27/28 ,  H02J7/02 ,  H02J50/10 ,  H02J50/20 ,  H01Q7/00 ,  H01F41/04 ,  H01F41/12 ,  H04B5/00 ,  H01F27/32

    Abstract: Techniques regarding one or more NFC antennas that can comprise vertically stacked coils of electrically conductive material are provided. For example, one or more embodiments described herein can comprise an apparatus, which can comprise can a first substrate layer that can comprise a first coil of electrically conductive material that can be wound in a first direction. The apparatus can also comprise a second substrate layer that can comprise a second coil of electrically conductive material that can be wound in a second direction opposite the first direction. The first substrate layer can be stacked onto the second substrate layer. Also, the first coil of electrically conductive material can be operably coupled to the second coil of electrically conductive material through an interconnection via to form an NFC antenna.

    Medication Counterfeit Detection
    126.
    发明申请
    Medication Counterfeit Detection 有权

    公开(公告)号：US20210039851A1

    公开(公告)日：2021-02-11

    申请号：US16535038

    申请日：2019-08-07

    Applicant: International Business Machines Corporation

    Inventor： Rajeev Narayanan ,  Bing Dang

    IPC: B65D55/02 ,  A61J1/03

    Abstract: A device for detecting a tampering of a product in a product packaging material. The device comprises a network of sensors integrated into the product packaging material; a microcontroller, the microcontroller configured to detect, by accessing the sensors of the sensor network, the tampering of the product packaging material; and a communication device for relaying information regarding a status of the product packaging material.

    High Speed Handling of Ultra-Small Chips by Selective Laser Bonding and Debonding
    129.
    发明申请
    High Speed Handling of Ultra-Small Chips by Selective Laser Bonding and Debonding 审中-公开

    公开(公告)号：US20200051948A1

    公开(公告)日：2020-02-13

    申请号：US16658675

    申请日：2019-10-21

    Applicant: International Business Machines Corporation

    Inventor： Qianwen Chen ,  Bing Dang ,  Russell Budd ,  Bo Wen ,  Li-Wen Hung ,  Jae-Woong Nah ,  John Knickerbocker

    IPC: H01L23/00 ,  H01L25/00 ,  H01L21/683

    Abstract: Techniques for high speed handling of ultra-small chips (e.g., micro-chips) by selective laser bonding and/or debonding are provided. In one aspect, a method includes: providing a first wafer including chips bonded to a surface thereof; contacting the first wafer with a second wafer, the second wafer including a substrate bonded to a surface thereof, wherein the contacting aligns individual chips with bonding sites on the substrate; and debonding the individual chips from the first wafer using a debonding laser having a small spot size of about 0.5 μm to about 100 μm, and ranges therebetween. A system is also provided that has digital cameras, a motorized XYZ-axis stage, and a computer control system configured to i) control a spot size of the at least one laser source and ii) adjust a positioning of the sample to align individual chips with a target area of the laser.

    Wafer stacking for integrated circuit manufacturing
    130.
    发明授权
    Wafer stacking for integrated circuit manufacturing 有权

    公开(公告)号：US10361140B2

    公开(公告)日：2019-07-23

    申请号：US15178709

    申请日：2016-06-10

    Applicant: International Business Machines Corporation

    Inventor： Qianwen Chen ,  Bing Dang ,  John Knickerbocker ,  Joana Sofia Branquinho Teresa Maria

    IPC: H01L23/31 ,  H01L25/00 ,  H01L21/56 ,  H01L23/00 ,  H01L21/683 ,  H01L25/065

    Abstract: A method of manufacturing integrated devices, and a stacked integrated device are disclosed. In an embodiment, the method comprises providing a substrate; mounting at least a first electronic component on the substrate; positioning a handle wafer above the first electronic component; attaching the first electronic component to the substrate via electrical connectors between the first electronic component and the substrate; and while attaching the first electronic component to the substrate, using the handle wafer to apply pressure, toward the substrate, to the first electronic component, to manage planarity of the first electronic component during the attaching. In an embodiment, a joining process is used to attach the first electronic component to the substrate via the electrical connectors. For example, thermal compression bonding may be used to attach the first electronic component to the substrate via the electrical connectors.

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