-
121.发明授权Method and apparatus for monitoring cross-sectional shape of a pattern formed on a semiconductor device 有权用于监测形成在半导体器件上的图案的横截面形状的方法和装置公开(公告)号：US08881067B2
公开(公告)日：2014-11-04
申请号：US13738795
申请日：2013-01-10
CPC分类号： G03F7/70625 , G06K9/00798 , G06K9/48 , G06T7/001 , G06T7/62 , G06T2207/10061 , G06T2207/30148 , H01J37/222 , H01J37/28 , H01J2237/24592 , H01J2237/2804 , H01J2237/2817
摘要： To enable SEM-based management of a cross-sectional shape or manufacturing process parameters of a semiconductor device pattern to be measured, the association between the shape or parameters and SEM image characteristic quantities effective for estimating the shape or parameters is saved as learning data. The image characteristic quantities are collated with learning data to estimate the shape or to monitor the process parameters. Accuracy and reliability is achievable by calculating three kinds of reliability (reliability of the image characteristic quantities, reliability of estimation engines, and reliability of estimating results) based on the distribution of the image characteristic quantities and then judging whether additional learning is necessary, or selecting and adjusting image characteristic quantities and estimation engine based on the reliability.
摘要翻译： 为了能够对待测量的半导体器件图案的横截面形状或制造工艺参数进行基于SEM的管理，可以将有效估计形状或参数的形状或参数与SEM图像特征量之间的关联保存为学习数据。 图像特征量与学习数据进行比较，以估计形状或监视过程参数。 根据图像特征量的分布，通过计算三种可靠性（图像特征量的可靠性，估计引擎的可靠性和估计结果的可靠性），然后判断是否需要额外的学习，或者选择 并根据可靠性调整图像特征量和估计引擎。
-
公开(公告)号：USRE45224E1
公开(公告)日：2014-10-28
申请号：US12621307
申请日：2009-11-18
CPC分类号： G03F7/70625
摘要： In an imaging recipe creating apparatus that uses a scanning electron microscope to create an imaging recipe for SEM observation of a semiconductor pattern, in order that the imaging recipe for measuring the wiring width and other various dimension values of the pattern from an observation image and thus evaluating the shape of the pattern is automatically generated within a minimum time by the analysis using the CAD image obtained by conversion from CAD data, an CAD image creation unit that creates the CAD image by converting the CAD data into an image format includes an image-quantizing width determining section, a brightness information providing section, and a pattern shape deformation processing section; the imaging recipe being created using the CAD image created by the CAD image creation unit.
-
公开(公告)号：USRE45204E1
公开(公告)日：2014-10-21
申请号：US12614358
申请日：2009-11-06
IPC分类号： G06F17/50
CPC分类号： G03F7/70625
摘要： In an imaging recipe creating apparatus that uses a scanning electron microscope to create an imaging recipe for SEM observation of a semiconductor pattern, in order that the imaging recipe for measuring the wiring width and other various dimension values of the pattern from an observation image and thus evaluating the shape of the pattern is automatically generated within a minimum time by the analysis using the CAD image obtained by conversion from CAD data, an CAD image creation unit that creates the CAD image by converting the CAD data into an image format includes an image-quantizing width determining section, a brightness information providing section, and a pattern shape deformation processing section; the imaging recipe being created using the CAD image created by the CAD image creation unit.
摘要翻译： 在使用扫描电子显微镜创建半导体图案的SEM观察的成像配方的成像配方制作装置中，为了从观察图像测量布线宽度和图案的其他各种尺寸值的成像配方，从而 通过使用通过从CAD数据转换获得的CAD图像的分析，在最小时间内自动生成图案的形状，通过将CAD数据转换为图像格式来创建CAD图像的CAD图像创建单元， 量化宽度确定部分，亮度信息提供部分和图案形状变形处理部分; 使用由CAD图像创建单元创建的CAD图像来创建成像配方。
-
124.发明授权Method and device for synthesizing panorama image using scanning charged-particle microscope 有权使用扫描带电粒子显微镜合成全景图像的方法和装置公开(公告)号：US08767038B2
公开(公告)日：2014-07-01
申请号：US13058226
申请日：2009-09-02
申请人： Atsushi Miyamoto , Go Kotaki , Ryoichi Matsuoka
发明人： Atsushi Miyamoto , Go Kotaki , Ryoichi Matsuoka
CPC分类号： G01B15/04 , H01J37/21 , H01J37/222 , H01J37/28 , H01J2237/21 , H01J2237/221 , H01J2237/24578 , H01J2237/24592 , H01J2237/2811 , H01J2237/2817
摘要： Provided is a panorama image synthesis technique using a scanning charged-particle microscope and capable of obtaining a panorama image synthesis that is robust against contamination and the imaging shift and distortion of an image in a wide-field imaging region (EP) for semiconductor fine patterns. The panorama image synthesis technique in the wide-field imaging region (EP) using the scanning charged-particle microscope is characterized in that the layout of each adjustment point, each local imaging region, and an imaging sequence comprising the imaging order of the each adjustment point are optimized and created as an imaging recipe.
摘要翻译： 提供了一种使用扫描带电粒子显微镜的全景图像合成技术，其能够获得对于半导体精细图案的宽场成像区域（EP）中的污染和图像的成像偏移和变形的鲁棒性的全景图像合成 。 使用扫描带电粒子显微镜的宽场成像区域（EP）中的全景图像合成技术的特征在于，每个调整点，每个局部成像区域以及包括每个调整的成像顺序的成像序列的布局 点被优化并创建为成像配方。
-
公开(公告)号：US20140169657A1
公开(公告)日：2014-06-19
申请号：US14238105
申请日：2012-07-06
IPC分类号： G06T7/00
CPC分类号： G06T7/001 , G01N21/9501 , G01N21/956 , G01N2021/8861 , G01N2021/8867 , H01L22/12 , H01L22/20
摘要： A defect inspection method for inspecting a defect on a semiconductor wafer, using plural inspection methods includes: merging hot-spot coordinates as coordinates on the semiconductor wafer, designated by a user, or coordinates where a systematic defect can occur, with detected defect coordinates on the semiconductor wafer, acquired from inspection information, after information indicating the type of coordinates are added thereto; deciding an inspection sequence of the coordinates merged with each other; and defect inspection for executing selection using the information indicating the respective types of the coordinates merged with each other, and executing an inspection by selecting an inspection method for every coordinates to be inspected.
摘要翻译： 使用多种检查方法检查半导体晶片上的缺陷的缺陷检查方法包括：将由用户指定的半导体晶片上的坐标作为坐标或者发生系统缺陷的坐标合并到检测到的缺陷坐标上 从检查信息获取的半导体晶片在附加了表示坐标类型的信息之后; 决定彼此合并的坐标的检查顺序; 以及使用表示彼此合并的坐标的各种类型的信息来执行选择的缺陷检查，并且通过为每个被检查坐标选择检查方法来执行检查。
-
公开(公告)号：US08508620B2
公开(公告)日：2013-08-13
申请号：US12528398
申请日：2008-01-30
申请人： Atsushi Miyamoto
发明人： Atsushi Miyamoto
摘要： A controller of a cellular phone acquires data of a date and a time when an object is captured from a clock part, in addition to image data of the object captured in an image capture mode by a camera part, and stores those data as image capture date data and image capture time data in a storage part in association with the image data in addition to the image data. Furthermore, when image capture date data of the image data stored in the storage part match date data outputted from the clock part in a standby mode, then the controller reads the image data and the image capture date and the image capture time corresponding to the image data from the storage part and controls a display part to display the image data with superimposing the image capture date and the image capture time thereon. The image data is displayed on the display part while the image capture date and the image capture time corresponding to the image data are superimposed on the image data.
摘要翻译： 手机的控制器除了通过照相机部分以图像拍摄模式拍摄的对象的图像数据之外，还从时钟部分获取拍摄对象的日期和时间的数据，并将这些数据存储为图像捕获 日期数据和与图像数据相关联的存储部分中的图像捕获时间数据。 此外，当存储在存储部分中的图像数据的图像捕获日期数据与在待机模式下从时钟部分输出的日期数据相匹配时，控制器读取与图像相对应的图像数据和图像捕获日期和图像捕获时间 来自存储部分的数据并且控制显示部分以通过在其上叠加图像捕获日期和图像捕获时间来显示图像数据。 图像数据被显示在显示部分上，同时将与图像数据相对应的图像拍摄日期和图像拍摄时间叠加在图像数据上。
-
127.发明申请METHOD AND APPARATUS FOR MONITORING CROSS-SECTIONAL SHAPE OF A PATTERN FORMED ON A SEMICONDUCTOR DEVICE 有权用于监测形成在半导体器件上的图案的交叉形状的方法和装置公开(公告)号：US20130195346A1
公开(公告)日：2013-08-01
申请号：US13738795
申请日：2013-01-10
IPC分类号： G06T7/00
CPC分类号： G03F7/70625 , G06K9/00798 , G06K9/48 , G06T7/001 , G06T7/62 , G06T2207/10061 , G06T2207/30148 , H01J37/222 , H01J37/28 , H01J2237/24592 , H01J2237/2804 , H01J2237/2817
摘要： To enable SEM-based management of a cross-sectional shape or manufacturing process parameters of a semiconductor device pattern to be measured, the association between the shape or parameters and SEM image characteristic quantities effective for estimating the shape or parameters is saved as learning data. The image characteristic quantities are collated with learning data to estimate the shape or to monitor the process parameters. Accuracy and reliability is achievable by calculating three kinds of reliability (reliability of the image characteristic quantities, reliability of estimation engines, and reliability of estimating results) based on the distribution of the image characteristic quantities and then judging whether additional learning is necessary, or selecting and adjusting image characteristic quantities and estimation engine based on the reliability.
摘要翻译： 为了能够对待测量的半导体器件图案的横截面形状或制造工艺参数进行基于SEM的管理，可以将有效估计形状或参数的形状或参数与SEM图像特征量之间的关联保存为学习数据。 图像特征量与学习数据进行比较，以估计形状或监视过程参数。 根据图像特征量的分布，通过计算三种可靠性（图像特征量的可靠性，估计引擎的可靠性和估计结果的可靠性），然后判断是否需要额外的学习，或者选择 并根据可靠性调整图像特征量和估计引擎。
-
128.发明授权Method and apparatus for monitoring cross-sectional shape of a pattern formed on a semiconductor device 有权用于监测形成在半导体器件上的图案的横截面形状的方法和装置公开(公告)号：US08356260B2
公开(公告)日：2013-01-15
申请号：US11673065
申请日：2007-02-09
IPC分类号： G06F17/50
CPC分类号： G03F7/70625 , G06K9/00798 , G06K9/48 , G06T7/001 , G06T7/62 , G06T2207/10061 , G06T2207/30148 , H01J37/222 , H01J37/28 , H01J2237/24592 , H01J2237/2804 , H01J2237/2817
摘要： A method is provided for estimating a cross-sectional shape or for monitoring manufacturing process parameters of a semiconductor device pattern to be measured. In this method, in order to enable SEM-based management of the cross-sectional shape or manufacturing process parameters of the pattern to be measured, the association between the cross-sectional shape or process parameters of the pattern and SEM image characteristic quantities effective for estimating the cross-sectional shape or process parameters of the pattern, is saved as learning data, and then the image characteristic quantities that have been calculated from a SEM image of the pattern are collated with the learning data to estimate the cross-sectional shape or to monitor process parameters of the pattern. Estimation with high accuracy and reliability is achievable by calculating all or part of three kinds of reliability (reliability of the image characteristic quantities, reliability of estimation engines, and reliability of estimating results) based on the distribution of the image characteristic quantities and judging from the calculated reliability whether additional learning of the learning data is necessary, or selecting and adjusting image characteristic quantities and estimation engine based on the reliability.
摘要翻译： 提供了一种用于估计横截面形状或用于监测待测量的半导体器件图案的制造工艺参数的方法。 在该方法中，为了能够对待测图案的截面形状或制造工艺参数进行基于SEM的管理，图案的截面形状或工艺参数与SEM图像特征量之间的关联对于 估计图案的截面形状或工艺参数被保存为学习数据，然后将从图案的SEM图像计算出的图像特征量与学习数据进行对照以估计横截面形状或 监视模式的进程参数。 基于图像特征量的分布，通过计算三种可靠性（图像特征量的可靠性，估计引擎的可靠性，估计引擎的可靠性和估计结果的可靠性），可以实现高精度和可靠性的估计。 计算的可靠性是否需要学习数据的附加学习，或者基于可靠性来选择和调整图像特征量和估计引擎。
-
公开(公告)号：US08355559B2
公开(公告)日：2013-01-15
申请号：US12428557
申请日：2009-04-23
申请人： Minoru Harada , Ryo Nakagaki , Kenji Obara , Atsushi Miyamoto
发明人： Minoru Harada , Ryo Nakagaki , Kenji Obara , Atsushi Miyamoto
IPC分类号： G06K9/00
CPC分类号： G06T7/004 , G01N21/9501 , G06T7/0004 , G06T7/001 , G06T7/70 , G06T2207/10061 , G06T2207/30148
摘要： Disclosed is a method for reviewing defects in a large number of samples within a short period of time through the use of a defect review apparatus. To collect defect images steadily and at high throughput, a defect detection method is selected before imaging and set up for each of review target defects in the samples in accordance with the external characteristics of the samples that are calculated from the design information about the samples. The defect images are collected after an imaging sequence is set up for the defect images and reference images in such a manner as to reduce the time required for stage movement in accordance with the defect coordinates of the samples and the selected defect detection method.
摘要翻译： 公开了一种通过使用缺陷检查装置在短时间内检查大量样品中的缺陷的方法。 为了稳定和高吞吐量收集缺陷图像，在成像之前选择缺陷检测方法，并根据从样本的设计信息计算出的样本的外部特征，为样本中的每个评估目标缺陷设置缺陷检测方法。 在针对缺陷图像和参考图像设置成像序列之后收集缺陷图像，以便根据样本的缺陷坐标和所选择的缺陷检测方法来减少阶段移动所需的时间。
-
130.发明申请SCANNING ELECTRON MICROSCOPE DEVICE AND PATTERN DIMENSION MEASURING METHOD USING SAME 有权扫描电子显微镜装置和图案尺寸测量方法公开(公告)号：US20120098953A1
公开(公告)日：2012-04-26
申请号：US13379042
申请日：2010-07-01
申请人： Go Kotaki , Atsushi Miyamoto , Ryoichi Matsuoka
发明人： Go Kotaki , Atsushi Miyamoto , Ryoichi Matsuoka
IPC分类号： H04N7/18
CPC分类号： H01J37/28 , H01J37/222 , H01J2237/2817 , H01L22/12 , H01L2924/0002 , H04N5/23238 , H01L2924/00
摘要： In a panoramic image construction technology of dividing a wide-range imaging area (EP) of semiconductor patterns into a plurality of imaging areas (SEP), and joining a group of images, which are obtained by imaging the SEPs using an SEM, through image processing, a fact that although a pattern serving as a key to joining is not contained in an overlap area between some of the SEPs, all the images can be joined in some cases is noted so that: although the number of patterns serving as keys to joining is small, SEPs whose images are all joined can be determined; or even if such SEPs cannot be determined, SEPs satisfying user's request items as many as possible can be determined. The cases are extracted by optimizing an SEP arrangement, whereby the number of cases in which SEPs whose images are all joined can be determined is increased.
摘要翻译： 在将半导体图案的宽范围成像区域（EP）分割为多个成像区域（SEP）的全景图像构造技术中，并且通过图像通过图像将通过使用SEM对SEP进行成像而获得的一组图像进行接合 处理，虽然作为加入关键码的图案不包含在一些SEP之间的重叠区域中，但是在某些情况下可以连接所有图像，使得：尽管用作键的图案的数量 连接小，可以确定其图像全部连接的SEP; 或者即使不能确定这样的SEP，也可以确定尽可能多地满足用户请求项目的SEP。 通过优化SEP布置来提取情况，从而可以确定其中图像全部被连接的SEP的情况的数量。
-
-
-
-
-
-
-
-
-
搜索结果
150 条记录 (耗时 0.036 秒)
