Cooling device boiling and condensing refrigerant
    121.
    发明授权
    Cooling device boiling and condensing refrigerant 有权
    冷却装置沸腾冷凝制冷剂

    公开(公告)号:US06341646B1

    公开(公告)日:2002-01-29

    申请号:US09443738

    申请日:1999-11-19

    IPC分类号: F28D1500

    摘要: A cooling device boiling and condensing refrigerant includes a refrigerant tank having a boiling space in which a part of liquid refrigerant is boiled and vaporized to gas refrigerant by absorbing heat from a heat-generating member, first and second radiators disposed at upper and lower parts of the refrigerant tank, defined by a liquid refrigerant surface within the refrigerant tank, and a connection pipe connecting the first and second radiators. The first and second radiators have the same shape, and are disposed to cool and condense gas refrigerant from the boiling space. In the cooling device, even when the cooling device is used in a normal state or a vertically reversed state, sufficient radiating performance of the first and second radiators can be obtained.

    摘要翻译: 沸腾冷凝制冷剂的冷却装置包括具有沸腾空间的制冷剂罐,其中一部分液体制冷剂通过从发热元件吸收热而沸腾并汽化成气体制冷剂,第一和第二散热器设置在上部和下部 由制冷剂罐内的液体制冷剂表面限定的制冷剂罐和连接第一和第二散热器的连接管。 第一和第二散热器具有相同的形状,并设置成从沸腾空间冷却和冷凝气态制冷剂。 在冷却装置中,即使在正常状态或垂直反转状态下使用冷却装置的情况下,也能够获得第一和第二散热器的充分的散热性能。

    Cooling device boiling and condensing refrigerant
    122.
    发明授权
    Cooling device boiling and condensing refrigerant 有权
    冷却装置沸腾冷凝制冷剂

    公开(公告)号:US06341645B1

    公开(公告)日:2002-01-29

    申请号:US09439954

    申请日:1999-11-12

    IPC分类号: F28D1500

    摘要: A cooling device boiling and condensing refrigerant includes a refrigerant tank having a boiling space in which a part of liquid refrigerant is boiled and vaporized to gas refrigerant by absorbing heat from a heat-generating member, and a radiator having a header through which gas refrigerant from the boiling space flows into plural tubes connected to the header. One end of the header is inserted into the refrigerant tank, and the inserted end portion of the header has a communication port communicating with the boiling space through a gas refrigerant outlet. The communication port has a lower end at the same position as a lower end of the gas refrigerant outlet. Further, the tubes are inserted into the header to have opened ends within the header, and each lower end of the opened ends of the tubes is set at a position higher than the lower end of the communication port and the lower end of the gas refrigerant outlet. Thus, the cooling device prevents liquid refrigerant from flowing into the tubes from the opened ends in the header.

    摘要翻译: 沸腾冷凝制冷剂的冷却装置包括具有沸腾空间的制冷剂罐,其中一部分液体制冷剂通过从发热元件吸收热量而沸腾并蒸发到气体制冷剂,以及具有集管的散热器, 沸腾空间流入连接到头部的多个管。 集管的一端插入制冷剂罐中,插头的插入端部具有通过气体制冷剂出口与沸腾空间连通的连通口。 连通口具有与气体制冷剂出口的下端相同位置的下端。 此外,管插入集管中以在集管内具有开口端,并且管的开口端的每个下端设置在高于连通口的下端和气体制冷剂的下端的位置 出口。 因此,冷却装置防止液体制冷剂从集管中的开口端流入管中。

    Cooling apparatus using boiling and condensing refrigerant
    123.
    发明授权
    Cooling apparatus using boiling and condensing refrigerant 有权
    使用沸腾和冷凝制冷剂的冷却装置

    公开(公告)号:US06321831B1

    公开(公告)日:2001-11-27

    申请号:US09456655

    申请日:1999-12-08

    IPC分类号: F28D1500

    摘要: A cooling apparatus includes a refrigerant tank containing boiling and condensing refrigerant and a radiator for cooling the refrigerant. The radiator is connected to the refrigerant tank on a front surface thereof, and hot objects to be cooled are attached to a heat-receiving surface formed on a rear surface of the refrigerant tank. The refrigerant is circulated in the apparatus so that the refrigerant is vaporized in the refrigerant tank and condensed in the radiator. The radiator is connected to the refrigerant tank by inserting a pair of header tanks thereof into the refrigerant tank. The insertion length is controlled to obtain good heat conductivity between the radiator and the refrigerant tank and to avoid deformation of a radiator fin contacting the refrigerant tank. Holes for mounting a substrate carrying the hot objects may be made on enlarged portions of a cover plate closing the refrigerant tank. The heat-receiving surface may be elevated from the rear surface of the refrigerant tank to avoid interference between other components mounted on the substrate and the rear surface of the refrigerant tank.

    摘要翻译: 一种冷却装置,包括含有沸腾冷凝制冷剂的制冷剂罐和用于冷却制冷剂的散热器。 散热器在前表面连接到制冷剂罐,并且待冷却的热物体附接到形成在制冷剂罐的后表面上的受热表面。 制冷剂在设备中循环使得制冷剂在制冷剂罐中蒸发并在散热器中冷凝。 散热器通过将一对集水箱插入制冷剂罐而连接到制冷剂罐。 控制插入长度以在散热器和制冷剂罐之间获得良好的导热性,并且避免与制冷剂罐接触的散热片的变形。 用于安装携带热物体的基板的孔可以在关闭制冷剂罐的盖板的扩大部分上制成。 受热面可以从制冷剂罐的后表面升高,以避免安装在基板上的其它部件与制冷剂罐的后表面之间的干涉。

    Plate type heat pipe and cooling structure using it
    124.
    发明授权
    Plate type heat pipe and cooling structure using it 有权
    板式热管及冷却结构采用

    公开(公告)号:US06263959B1

    公开(公告)日:2001-07-24

    申请号:US09445738

    申请日:1999-12-10

    IPC分类号: F28D1500

    摘要: A plate type heat pipe comprises two plate members facing each other to form a hermetically sealed container, on either one of which plate members at least one heat generating parts are mounted, at least one heat transfer block having a cross sectional area equal to or larger than a cross sectional area of the heat generating part, the heat transfer block being disposed at a prescribed position within the hollow portion corresponding to a position of the plate member to which the heat generating part is thermally connected, and a working fluid enclosed in the container.

    摘要翻译: 板式热管包括彼此面对的两个板构件,以形成密封容器,其中任一个板构件安装有至少一个发热部件,至少一个横截面积等于或大于其的热传递块 比发热部分的横截面积,传热块设置在与发热部件热连接的板部件的位置对应的中空部分内的规定位置,以及封闭在发热部件中的工作流体 容器。

    Information processing apparatus and its heat spreading method
    125.
    发明授权
    Information processing apparatus and its heat spreading method 失效
    信息处理装置及其散热方法

    公开(公告)号:US06250378B1

    公开(公告)日:2001-06-26

    申请号:US09522012

    申请日:2000-03-09

    申请人: Takashi Kobayashi

    发明人: Takashi Kobayashi

    IPC分类号: F28D1500

    摘要: The conventional mobile information processing apparatus has a difficulty in conducting heat, which is sent from a heat pipe, throughout a plane of a heat spreading board, due to an inadequate heat conduction to a direction of the plane of the heat spreading board. The present invention implements a heat spreading configuration used in an information processing apparatus having a liquid crystal display panel by effectively using a whole area of the heat spreading board by assembling a thermo-siphon to the heat spreading board and then conducting the heat from CPU, which is a heat generation unit, from the heat pipe to the thermo-siphon.

    摘要翻译: 传统的移动信息处理装置由于对散热板的平面方向的热传导不充分,难以在散热板的整个平面上从热管发送热量。 本发明通过将热虹吸管组装到散热板上,然后从CPU传导热量,实现了在具有液晶显示面板的信息处理设备中有效地使用散热板的整个面积的热扩散配置, 其是从热管到热虹吸管的发热单元。

    Vibration induced atomizers
    126.
    发明授权
    Vibration induced atomizers 失效
    振动引发雾化器

    公开(公告)号:US06247525B1

    公开(公告)日:2001-06-19

    申请号:US09576729

    申请日:2000-05-23

    IPC分类号: F28D1500

    摘要: A preferred embodiment of an atomizing apparatus incorporates a source of heat transfer fluid and an atomizing surface adapted to receive a droplet of the heat transfer fluid thereon. A driver also is provided which is configured to control a vibration of the atomizing surface at a frequency less than ultrasonic so that the atomizing surface forms a spray of atomized droplets from the droplet of the heat transfer fluid. Preferably, the vibration is configured to form, on the droplet, surface waves having a smaller wavelength than a diameter of the droplet, thereby ejecting and propelling the atomized droplets from the droplet. Methods also are provided.

    摘要翻译: 雾化装置的优选实施例包括传热流体源和适于在其上接收传热流体液滴的雾化表面。 还提供了一种驱动器,其配置成以小于超声波的频率控制雾化表面的振动,使得雾化表面从传热流体的液滴形成喷雾的雾化液滴。 优选地,振动被配置为在液滴上形成具有比液滴的直径更小的波长的表面波,从而从雾滴喷射和推动雾化的液滴。 还提供了方法。

    Cooling apparatus by boiling and cooling refrigerant
    127.
    发明授权
    Cooling apparatus by boiling and cooling refrigerant 有权
    通过冷却制冷剂冷却冷却装置

    公开(公告)号:US06227287B1

    公开(公告)日:2001-05-08

    申请号:US09317382

    申请日:1999-05-24

    IPC分类号: F28D1500

    摘要: A cooling apparatus for cooling a heating body such as a CPU by boiling and condensing refrigerant has a tank having a heating body mounting portion on which the CPU is mounted; a porous metallic sintered body arranged in the tank; and refrigerant contained in the tank. The tank has a pair of faced walls including a heat-receiving wall and a radiation wall. The porous metallic sintered body is arranged along the heat-receiving wall, and transports the refrigerant collected at the bottom of the tank to an adjacent portion of the heating body mounting portion by using a capillary action. Since the refrigerant is boiled at such a wide adjacent portion, a superheat degree of the heating body mounting portion can decrease. Furthermore, since the refrigerant collected at the bottom of the tank is transported to the adjacent portion by the capillary action, an area of the radiation wall soaked in the refrigerant becomes small. As a result, a condensation area for condensing the vapor refrigerant becomes large, and then the supercool degree of the radiation wall can decrease. In this way, a cooling capacity of the cooling apparatus can increase.

    摘要翻译: 通过沸腾冷凝制冷剂来冷却诸如CPU的加热体的冷却装置具有:罐,其具有安装有CPU的加热体安装部; 布置在罐中的多孔金属烧结体; 以及储存在容器内的制冷剂。 储罐有一对面墙,包括一个受热壁和一个辐射墙。 多孔金属烧结体沿着受热壁配置,通过毛细管作用将收集在罐底部的制冷剂输送到加热体安装部的相邻部分。 由于制冷剂在这样宽的相邻部分被煮沸,所以加热体安装部分的过热度可能降低。 此外,由于通过毛细作用将收集在罐底部的制冷剂输送到相邻部分,所以在制冷剂中浸泡的辐射壁的面积变小。 结果,用于冷凝蒸汽制冷剂的冷凝区域变大,然后辐射壁的过冷度降低。 以这种方式,冷却装置的冷却能力可以增加。

    Low EMI emissions heat sink device
    129.
    发明授权
    Low EMI emissions heat sink device 有权
    低EMI散热装置

    公开(公告)号:US06167949A

    公开(公告)日:2001-01-02

    申请号:US09497555

    申请日:2000-02-03

    IPC分类号: F28D1500

    摘要: A low electro-magnetic radiation emissions heat sink that dissipates heat away from an integrated circuit package by means of conduction to the electronic chassis. The heat sink may also include a ferrite ring for reducing electro-magnetic radiation emissions from the integrated circuit package by increasing the electrical impedance of the EMI transmission path between the integrated circuit package and the electronic chassis, thus reducing the capacitive coupling and RFI concerns of conductive heat dissipation. The heat sink of the present invention may also include fins that are external to the electronic chassis for greater heat dissipation by means of external air convection.

    摘要翻译: 低电磁辐射辐射散热器,通过传导到电子底盘将热量从集成电路封装散开。 散热器还可以包括铁氧体环,用于通过增加集成电路封装和电子底座之间的EMI传输路径的电阻抗来减小来自集成电路封装的电磁辐射,从而减小电容耦合和RFI的关注 导电散热。 本发明的散热器还可以包括在电子底盘的外部的散热片,用于通过外部空气对流来实现更大的散热。

    Thin, planar heat spreader
    130.
    发明授权
    Thin, planar heat spreader 失效
    薄型平面散热器

    公开(公告)号:US06167948A

    公开(公告)日:2001-01-02

    申请号:US08751585

    申请日:1996-11-18

    申请人: Daniel Lee Thomas

    发明人: Daniel Lee Thomas

    IPC分类号: F28D1500

    摘要: A heat spreading apparatus includes a first planar body for attachment to a heat generating surface which results in a hot region and a cool region on the first planar body. A second planar body connected to the first planar body is used to define a void between the first planar body and the second planar body. The void includes a planar capillary path and a non-capillary region. A fluid positioned within the void distributes heat by vaporizing the fluid from the planar capillary path in the hot region, condensing the fluid in the non-capillary region in the cool region, and moving from the non-capillary region to the planar capillary path in the hot region through capillarity.

    摘要翻译: 散热装置包括用于附接到发热表面的第一平面体,其在第一平面体上产生热区域和冷区域。 连接到第一平面体的第二平面体用于限定第一平面体和第二平面体之间的空隙。 空隙包括平面毛细管路径和非毛细管区域。 定位在空隙内的流体通过在热区域中从平面毛细管路径中蒸发流体来分布热量,将冷却区域中的非毛细管区域中的流体冷凝,并且从非毛细管区域移动到平面毛细管路径 热区通过毛细作用。