摘要:
A cooling device boiling and condensing refrigerant includes a refrigerant tank having a boiling space in which a part of liquid refrigerant is boiled and vaporized to gas refrigerant by absorbing heat from a heat-generating member, first and second radiators disposed at upper and lower parts of the refrigerant tank, defined by a liquid refrigerant surface within the refrigerant tank, and a connection pipe connecting the first and second radiators. The first and second radiators have the same shape, and are disposed to cool and condense gas refrigerant from the boiling space. In the cooling device, even when the cooling device is used in a normal state or a vertically reversed state, sufficient radiating performance of the first and second radiators can be obtained.
摘要:
A cooling device boiling and condensing refrigerant includes a refrigerant tank having a boiling space in which a part of liquid refrigerant is boiled and vaporized to gas refrigerant by absorbing heat from a heat-generating member, and a radiator having a header through which gas refrigerant from the boiling space flows into plural tubes connected to the header. One end of the header is inserted into the refrigerant tank, and the inserted end portion of the header has a communication port communicating with the boiling space through a gas refrigerant outlet. The communication port has a lower end at the same position as a lower end of the gas refrigerant outlet. Further, the tubes are inserted into the header to have opened ends within the header, and each lower end of the opened ends of the tubes is set at a position higher than the lower end of the communication port and the lower end of the gas refrigerant outlet. Thus, the cooling device prevents liquid refrigerant from flowing into the tubes from the opened ends in the header.
摘要:
A cooling apparatus includes a refrigerant tank containing boiling and condensing refrigerant and a radiator for cooling the refrigerant. The radiator is connected to the refrigerant tank on a front surface thereof, and hot objects to be cooled are attached to a heat-receiving surface formed on a rear surface of the refrigerant tank. The refrigerant is circulated in the apparatus so that the refrigerant is vaporized in the refrigerant tank and condensed in the radiator. The radiator is connected to the refrigerant tank by inserting a pair of header tanks thereof into the refrigerant tank. The insertion length is controlled to obtain good heat conductivity between the radiator and the refrigerant tank and to avoid deformation of a radiator fin contacting the refrigerant tank. Holes for mounting a substrate carrying the hot objects may be made on enlarged portions of a cover plate closing the refrigerant tank. The heat-receiving surface may be elevated from the rear surface of the refrigerant tank to avoid interference between other components mounted on the substrate and the rear surface of the refrigerant tank.
摘要:
A plate type heat pipe comprises two plate members facing each other to form a hermetically sealed container, on either one of which plate members at least one heat generating parts are mounted, at least one heat transfer block having a cross sectional area equal to or larger than a cross sectional area of the heat generating part, the heat transfer block being disposed at a prescribed position within the hollow portion corresponding to a position of the plate member to which the heat generating part is thermally connected, and a working fluid enclosed in the container.
摘要:
The conventional mobile information processing apparatus has a difficulty in conducting heat, which is sent from a heat pipe, throughout a plane of a heat spreading board, due to an inadequate heat conduction to a direction of the plane of the heat spreading board. The present invention implements a heat spreading configuration used in an information processing apparatus having a liquid crystal display panel by effectively using a whole area of the heat spreading board by assembling a thermo-siphon to the heat spreading board and then conducting the heat from CPU, which is a heat generation unit, from the heat pipe to the thermo-siphon.
摘要:
A preferred embodiment of an atomizing apparatus incorporates a source of heat transfer fluid and an atomizing surface adapted to receive a droplet of the heat transfer fluid thereon. A driver also is provided which is configured to control a vibration of the atomizing surface at a frequency less than ultrasonic so that the atomizing surface forms a spray of atomized droplets from the droplet of the heat transfer fluid. Preferably, the vibration is configured to form, on the droplet, surface waves having a smaller wavelength than a diameter of the droplet, thereby ejecting and propelling the atomized droplets from the droplet. Methods also are provided.
摘要:
A cooling apparatus for cooling a heating body such as a CPU by boiling and condensing refrigerant has a tank having a heating body mounting portion on which the CPU is mounted; a porous metallic sintered body arranged in the tank; and refrigerant contained in the tank. The tank has a pair of faced walls including a heat-receiving wall and a radiation wall. The porous metallic sintered body is arranged along the heat-receiving wall, and transports the refrigerant collected at the bottom of the tank to an adjacent portion of the heating body mounting portion by using a capillary action. Since the refrigerant is boiled at such a wide adjacent portion, a superheat degree of the heating body mounting portion can decrease. Furthermore, since the refrigerant collected at the bottom of the tank is transported to the adjacent portion by the capillary action, an area of the radiation wall soaked in the refrigerant becomes small. As a result, a condensation area for condensing the vapor refrigerant becomes large, and then the supercool degree of the radiation wall can decrease. In this way, a cooling capacity of the cooling apparatus can increase.
摘要:
A heat pipe with pumping capabilities and use thereof in cooling a device. One embodiment of the heat pipe has an internal pumping mechanism that provides an enhanced capillary flow within a chamber of the heat pipe.
摘要:
A low electro-magnetic radiation emissions heat sink that dissipates heat away from an integrated circuit package by means of conduction to the electronic chassis. The heat sink may also include a ferrite ring for reducing electro-magnetic radiation emissions from the integrated circuit package by increasing the electrical impedance of the EMI transmission path between the integrated circuit package and the electronic chassis, thus reducing the capacitive coupling and RFI concerns of conductive heat dissipation. The heat sink of the present invention may also include fins that are external to the electronic chassis for greater heat dissipation by means of external air convection.
摘要:
A heat spreading apparatus includes a first planar body for attachment to a heat generating surface which results in a hot region and a cool region on the first planar body. A second planar body connected to the first planar body is used to define a void between the first planar body and the second planar body. The void includes a planar capillary path and a non-capillary region. A fluid positioned within the void distributes heat by vaporizing the fluid from the planar capillary path in the hot region, condensing the fluid in the non-capillary region in the cool region, and moving from the non-capillary region to the planar capillary path in the hot region through capillarity.