Abstract:
The invention is directed to a memory cell on a substrate having a plurality of shallow trench isolations form therein, wherein top surfaces of the shallow trench isolations are lower than a top surface of the substrate and the shallow trench isolations together define a vertical fin structure of the substrate. The memory cell comprises a straddle gate, a carrier trapping structure and at least two source/drain regions. The straddle gate is located on the substrate and straddles over the vertical fin structure. The carrier trapping structure is located between the straddle gate and the substrate, wherein the carrier trapping structure comprises a trapping layer directly in contact with the straddle gate and a tunnel layer located between the trapping layer and the substrate. The source/drain regions are located in a portion of the vertical fin structure of the substrate exposed by the straddle gate.
Abstract:
An asymmetrically doped memory cell has first and second N+ doped junctions on a P substrate. A composite charge trapping layer is disposed over the P substrate and between the first and the second N+ doped junctions. A N− doped region is positioned adjacent to the first N+ doped junction and under the composite charge trapping layer. A P− doped region is positioned adjacent to the second N+ doped junction and under the composite charge trapping layer. The asymmetrically doped memory cell will store charges at the end of the composite charge trapping layer that is above the P− doped region. The asymmetrically doped memory cell can function as an electrically erasable programmable read only memory cell, and is capable of multiple level cell operations. A method for making an asymmetrically doped memory cell is also described.
Abstract:
A method of determining an optimal reading voltage for reading a two-side non-volatile memory programmed with a threshold voltage Vt is described. A first side of a memory cell is programmed to Vt, and then an I1-Vg curve of the first side and an I2-Vg curve of the second side are measured, wherein Vg is the gate voltage. A Gm1-Vg curve and a Gm2-Vg curve are plotted, wherein Gm1=dI1/dVg and Gm2=dI2/dVg. The optimal reading voltage VgO is determined as the gate voltage at the intersection of Gm1 and Gm2, corresponding to a maximal total current window Wm (=I2(VgO)−I1(VgO)).
Abstract translation:描述了一种确定用于读取用阈值电压Vt编程的双侧非易失性存储器的最佳读取电压的方法。 存储器单元的第一侧被编程为Vt,然后第二侧的I 1 -T 1 -V G曲线和第二侧的I 2 -V -V曲线是 测量,其中Vg是栅极电压。 绘制了一个Gm 1-ΔVg曲线和一个Gm 2 -V -G曲线,其中G m 1 = 1/1 / / dVg和Gm2 i> = dI2 / dVg。 确定最佳读取电压V g O O N作为在最大总电流窗口Gm1和Gm2的交点处的栅极电压 Wm(= I 2)(V g O O) - I 1(V g O O))。