公开(公告)号：US20210041182A1

公开(公告)日：2021-02-11

申请号：US16533235

申请日：2019-08-06

Applicant: Intel Corporation

Inventor： Feras Eid ,  Telesphor Kamgaing ,  Georgios Dogiamis ,  Aleksandar Aleksov ,  Johanna M. Swan

IPC: F28D15/04 ,  H01L23/367 ,  H01L23/38 ,  H01L23/427

Abstract: Disclosed herein are structures and assemblies that may be used for thermal management in integrated circuit (IC) packages.

公开(公告)号：US20200304215A1

公开(公告)日：2020-09-24

申请号：US16893660

申请日：2020-06-05

Applicant: Intel Corporation

Inventor： Diego Correas-Serrano ,  Georgios Dogiamis ,  Henning Braunisch ,  Neelam Prabhu-Gaunkar ,  Telesphor Kamgaing ,  Thomas W. Brown ,  Stefano Pellerano

IPC: H04B15/00 ,  H04L25/03

Abstract: Embodiments may relate to a communications module comprising with a dispersion compensation module communicatively coupled between a baseband module and a radio frequency (RF) module. The dispersion compensation module may be configured to process a data signal at an intermediate frequency that is between a baseband frequency and a RF frequency. Other embodiments may be described or claimed.

公开(公告)号：US20200303329A1

公开(公告)日：2020-09-24

申请号：US16397718

申请日：2019-04-29

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Georgios Dogiamis ,  Telesphor Kamgaing ,  Henning Braunisch ,  Johanna M. Swan ,  Shawna M. Liff ,  Aleksandar Aleksov

IPC: H01L23/66 ,  H01L23/00

Abstract: Embodiments may relate to a microelectronic package that includes a radio frequency (RF) chip coupled with a die by interconnects with a first pitch. The RF chip may further be coupled with a waveguide of a package substrate by interconnects with a second pitch that is different than the first pitch. The RF chip may facilitate conveyance of data to the waveguide as an electromagnetic signal with a frequency greater than approximately 20 gigahertz (GHz). Other embodiments may be described or claimed.

公开(公告)号：US20200236205A1

公开(公告)日：2020-07-23

申请号：US16843791

申请日：2020-04-08

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios Dogiamis ,  Vijay K. Nair

IPC: H04M1/02 ,  H01Q1/38 ,  G06F1/16 ,  H01Q9/04 ,  H01Q21/00 ,  H01Q23/00 ,  H01Q25/00 ,  H01Q1/40 ,  H01Q21/28 ,  H01Q1/24 ,  H01Q21/22

Abstract: Embodiments of the invention include a microelectronic device that includes a die having at least one transceiver unit, a redistribution package coupled to the die, and a substrate coupled to the redistribution package. The substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20190305396A1

公开(公告)日：2019-10-03

申请号：US15972441

申请日：2018-05-07

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Adel A. Elsherbini

IPC: H01P1/208 ,  H01P3/12 ,  H01P5/10 ,  H01P11/00

Abstract: Microelectronic assemblies that include a lithographically-defined substrate integrated waveguide (SIW) component, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate portion having a first face and an opposing second face; and an SIW component that may include a first conductive layer on the first face of the package substrate portion, a dielectric layer on the first conductive layer, a second conductive layer on the dielectric layer, and a first conductive sidewall and an opposing second conductive sidewall in the dielectric layer, wherein the first and second conductive sidewalls are continuous structures.