Abstract:
A circuit can provide an approximately constant resistance value that is virtually independent of process and temperature variations. A current control circuit may use a device that tracks the changes in a corresponding device over process and temperature variations. As a result, the behavior of device may be used to help determine the control information provided to device in order to maintain an approximately constant resistance Rm over process and temperature variations. The approximately constant resistance Rm may be used to provide an approximately constant current ILED. A wide variety of applications, not just LED drivers, may benefit from the use of an approximately constant resistance and/or current.
Abstract:
A voltage source provides an output voltage to drive a plurality of light emitting diode (LED) strings. A LED driver adjusts the level of the output voltage so as to maintain the lowest tail voltage of the LED strings at or near a predetermined threshold voltage so as provide sufficient headroom voltages for current regulators for the LED strings. The LED driver operates in an operational mode and a calibration mode, which can be implemented in parallel with, or part of, the operational mode. During the calibration mode, the LED driver determines, for each LED string, a code value representative of the level of the output voltage necessary to maintain the tail voltage of the corresponding LED string at or near the predetermined threshold voltage. In the operational mode, the code values from the calibration mode are used to control the voltage source to provide an appropriate level for the output voltage.
Abstract:
In one embodiment, a distributed environment for supporting on-line collaborative meetings among a plurality of users includes a plurality of applications executing on different client machines. A sequence of messages is transmitted from a first application of the distributed environment to a second application of the distributed environment, using a multicast form of delivery. A request for re-transmission is received from the second application specifying at least one message of the sequence that was not received by the second application. In response to the request, the specified at least one message of the sequence is retransmitted from the first application to the second application using a reliable unicast form of delivery.
Abstract:
According to one exemplary embodiment, a voltage up-conversion circuit includes a modulated voltage generator circuit, where the modulated voltage generator circuit is configured to receive an input voltage and generate a modulated voltage, and where the modulated voltage generator circuit includes at least one transistor. The voltage up-conversion circuit further includes a switching circuit coupled to the modulated voltage generator circuit, where the switching circuit is configured to couple the modulated voltage to a load capacitor when the modulated voltage is at a high level and decouple the modulated voltage to the load capacitor when the modulated voltage is at a low level. In the voltage up-conversion circuit, the load capacitor reaches a voltage greater a breakdown voltage of the at least one transistor in the modulated voltage generator circuit. The breakdown voltage can be a reliability breakdown voltage.
Abstract:
According to one exemplary embodiment, a voltage up-conversion circuit includes a modulated voltage generator circuit, where the modulated voltage generator circuit is configured to receive an input voltage and generate a modulated voltage, and where the modulated voltage generator circuit includes at least one transistor. The voltage up-conversion circuit further includes a switching circuit coupled to the modulated voltage generator circuit, where the switching circuit is configured to couple the modulated voltage to a load capacitor when the modulated voltage is at a high level and decouple the modulated voltage to the load capacitor when the modulated voltage is at a low level. In the voltage up-conversion circuit, the load capacitor reaches a voltage greater a breakdown voltage of the at least one transistor in the modulated voltage generator circuit. The breakdown voltage can be a reliability breakdown voltage.
Abstract:
A graphical user interface for editing a video story includes a storyboard pane, a timeline pane, and a layer pane. The storyboard pane displays video clips of the video story and their transitions. The timeline pane displays tracks including a video track, a video overlay track, a text track, an effect track, and at least one audio track. The layer pane displays layers of a selected video clip from the video track. Each layer displays one layer clip. The layer clip can be a video layer clip, a text layer clip, or an audio layer clip. The layers in the layer pane show how the layer clips overlay each other (or not) in time to compose the selected video clip. A user uses the storyboard pane and the timeline pane to layout the video story, and the layer pane to layout the video clips in the video story.
Abstract:
Method for selective fabrication of high capacitance density areas in a low dielectric constant material and related structure are disclosed. In one embodiment, a first area of a dielectric layer is covered while a second area of the dielectric layer is exposed to a dielectric conversion source. The exposure causes the dielectric constant of the dielectric layer in the second area to increase. A number of interconnect trenches are etched in the first area of the dielectric and a number of capacitor trenches are etched in the second area of the dielectric. The interconnect trenches and the capacitor trenches are then filled with an appropriate metal, such as copper, and a chemical mechanical polish is performed. The second area in which the capacitor trenches have been etched and filled has a higher capacitance density relative to the first area.
Abstract:
A method for fabricating a capacitor on a semiconductor substrate is disclosed. The method may include simultaneously forming at least one via and at least one upper capacitor plate opening in a first dielectric layer having an underlying cap dielectric layer deposited over a first material region having a first conductive material within a conductive region and forming a trench above the via. The method may also include filling the via, trench, and upper capacitor plate opening with a second conductive material resulting in an integrated circuit structure and employing CMP to remove any excess second conductive material from the integrated circuit structure.
Abstract:
A low dispersion comb filter or interleaver assembly has a first interleaver element and a second interleaver element. The first interleaver element is configured so as to provide a dispersion vs. wavelength curve wherein each dispersion value thereof is approximately opposite in value to a dispersion value at the same wavelength for the second interleaver element, so as to mitigate net or total dispersion in the interleaver assembly.
Abstract:
A method is provided for forming an improved interconnect structure on a semiconductor body. A first metal layer is deposited on the semiconductor body. A sacrificial layer having a height is deposited on the first metal layer. The sacrificial layer and the metal layer are patterned to form separate metal lines with the sacrificial layer remaining on said metal lines. A look material is then deposited to fill the gaps bet n metal lines and to cover the sacrificial layer. The low-k material is then removed to a level within the height of the sacrificial layer. The sacrificial layer is then removed. A prove layer is deposited on top of the metal lines and the look material. A dielectric layer is deposited over the protective layer. The protective layer protects the low-k material from attack by chemicals utilized by subsequent process steps to etch vias in the dielectric layer, to strip photoresist, and to clean the vias. The protective layer is then selectively etched away to make contact between a via plug and the metal lines.