Photoresist Defect Reduction System and Method
    151.
    发明申请
    Photoresist Defect Reduction System and Method 审中-公开
    光刻胶缺陷减少系统和方法

    公开(公告)号:US20150227051A1

    公开(公告)日:2015-08-13

    申请号:US14697252

    申请日:2015-04-27

    CPC classification number: G03F7/425 G03F7/40 G03F7/405

    Abstract: A system and method for reducing defects in photoresist processing is provided. An embodiment comprises cleaning the photoresist after development using an alkaline environment. The alkaline environment may comprise a neutral solvent and an alkaline developer. The alkaline environment will modify the attraction between residue leftover from development and a surface of the photoresist such that the surfaces repel each other, making the removal of the residue easier. By removing more residue, there will be fewer defects in the photolithographic process.

    Abstract translation: 提供了减少光致抗蚀剂加工缺陷的系统和方法。 一个实施例包括使用碱性环境清洗显影后的光致抗蚀剂。 碱性环境可以包含中性溶剂和碱性显影剂。 碱性环境将改变从显影产生的残留物与光致抗蚀剂的表面之间的吸引力,使得表面彼此排斥,使残留物更容易除去。 通过去除更多的残留物,光刻工艺中的缺陷将会更少。

    Photoresist defect reduction system and method
    152.
    发明授权
    Photoresist defect reduction system and method 有权
    光刻胶缺陷减少系统及方法

    公开(公告)号:US09017934B2

    公开(公告)日:2015-04-28

    申请号:US13790057

    申请日:2013-03-08

    CPC classification number: G03F7/425 G03F7/40 G03F7/405

    Abstract: A system and method for reducing defects in photoresist processing is provided. An embodiment comprises cleaning the photoresist after development using an alkaline environment. The alkaline environment may comprise a neutral solvent and an alkaline developer. The alkaline environment will modify the attraction between residue leftover from development and a surface of the photoresist such that the surfaces repel each other, making the removal of the residue easier. By removing more residue, there will be fewer defects in the photolithographic process.

    Abstract translation: 提供了减少光致抗蚀剂加工缺陷的系统和方法。 一个实施例包括使用碱性环境清洗显影后的光致抗蚀剂。 碱性环境可以包含中性溶剂和碱性显影剂。 碱性环境将改变从显影产生的残留物与光致抗蚀剂的表面之间的吸引力,使得表面彼此排斥,使残留物更容易除去。 通过去除更多的残留物,光刻工艺中的缺陷将会更少。

    Method of lithography
    153.
    发明授权
    Method of lithography 有权
    光刻方法

    公开(公告)号:US09005881B2

    公开(公告)日:2015-04-14

    申请号:US14087125

    申请日:2013-11-22

    CPC classification number: G03F7/2002 G03F7/11 G03F7/16 G03F7/167 G03F7/20

    Abstract: A lithography method of manufacturing integrated circuits is disclosed. A combination photoalignment-photoresist layer is formed on a substrate. A treatment is performed on the combination photoalignment-photoresist layer. The combination photoalignment-photoresist layer is exposed to a predetermined pattern. The combination photoalignment-photoresist layer is developed to form a pattern and expose a portion of the substrate.

    Abstract translation: 公开了一种制造集成电路的光刻方法。 在基板上形成组合的光定位 - 光致抗蚀剂层。 对组合光电子位置 - 光致抗蚀剂层进行处理。 组合光电子位置 - 光致抗蚀剂层暴露于预定图案。 显影组合的光定位 - 光致抗蚀剂层以形成图案并暴露基底的一部分。

    Immersion lithography watermark reduction
    155.
    发明授权
    Immersion lithography watermark reduction 有权
    浸没光刻水印缩减

    公开(公告)号:US08895234B2

    公开(公告)日:2014-11-25

    申请号:US13760306

    申请日:2013-02-06

    CPC classification number: G03F7/2041 G03F7/70341

    Abstract: Provided is a method of performing a lithography process. The method includes: exposing, through an immersion lithography process, a photo-sensitive material on a substrate, the immersion lithography process using a fluid for the exposing; thereafter treating the photo-sensitive material with a solution to neutralize quenchers that have diffused into the photo-sensitive material through the liquid, wherein the solution contains a substance that diffuses into the photo-sensitive material at a first rate that is dependent on a second at which the quenchers diffuse into the photo-sensitive material; thereafter removing a portion of the photo-sensitive material; thereafter performing a post-exposure bake to the photo-sensitive material; and developing the photo-sensitive material.

    Abstract translation: 提供了进行光刻工艺的方法。 该方法包括:通过浸没式光刻工艺将基材上的感光材料曝光,使用用于曝光的流体的浸没式光刻工艺; 然后用溶液处理感光材料以中和通过液体扩散到光敏材料中的猝灭剂,其中溶液含有以依赖于第二种的第一速率扩散到光敏材料中的物质 猝灭剂扩散到光敏材料中; 之后除去一部分感光材料; 然后对感光材料进行曝光后烘烤; 并开发感光材料。

    Surface switchable photoresist
    156.
    发明授权
    Surface switchable photoresist 有权
    表面可切割光致抗蚀剂

    公开(公告)号:US08715919B2

    公开(公告)日:2014-05-06

    申请号:US13971650

    申请日:2013-08-20

    CPC classification number: G03F7/2041 G03F7/0382 G03F7/0392 G03F7/168

    Abstract: Lithography methods on a semiconductor substrate are described. The methods include coating a resist layer on the substrate, wherein the resist layer comprises a resist polymer configured to turn soluble to a base solution in response to reaction with an acid, and a switchable polymer that includes a base soluble polymer having a carboxylic acid, hydroxyl, lactone, or anhydride functional group, performing a pre-exposure bake on the resist layer, exposing the resist-coated substrate, and developing the exposed substrate with a developing solution.

    Abstract translation: 描述半导体衬底上的平版印刷方法。 所述方法包括在基底上涂覆抗蚀剂层,其中抗蚀剂层包含抗反应聚合物,其被配置为响应于与酸的反应而转化为碱溶液,并且可切换聚合物包括具有羧酸的碱溶性聚合物, 羟基,内酯或酸酐官能团,在抗蚀剂层上进行预曝光烘烤,曝光抗蚀剂涂布的基底,并用显影液显影曝光的基底。

    Immersion Lithography Watermark Reduction
    157.
    发明申请
    Immersion Lithography Watermark Reduction 有权
    浸没平版印刷水印减少

    公开(公告)号:US20130309611A1

    公开(公告)日:2013-11-21

    申请号:US13760306

    申请日:2013-02-06

    CPC classification number: G03F7/2041 G03F7/70341

    Abstract: Provided is a method of performing a lithography process. The method includes: exposing, through an immersion lithography process, a photo-sensitive material on a substrate, the immersion lithography process using a fluid for the exposing; thereafter treating the photo-sensitive material with a solution to neutralize quenchers that have diffused into the photo-sensitive material through the liquid, wherein the solution contains a substance that diffuses into the photo-sensitive material at a first rate that is dependent on a second at which the quenchers diffuse into the photo-sensitive material; thereafter removing a portion of the photo-sensitive material; thereafter performing a post-exposure bake to the photo-sensitive material; and developing the photo-sensitive material.

    Abstract translation: 提供了进行光刻工艺的方法。 该方法包括:通过浸没式光刻工艺将基材上的感光材料曝光,使用用于曝光的流体的浸没式光刻工艺; 然后用溶液处理感光材料以中和通过液体扩散到光敏材料中的猝灭剂,其中溶液含有以依赖于第二种的第一速率扩散到光敏材料中的物质 猝灭剂扩散到光敏材料中; 之后除去一部分感光材料; 然后对感光材料进行曝光后烘烤; 并开发感光材料。

    PHOTORESIST MATERIAL AND METHOD FOR LITHOGRAPHY

    公开(公告)号:US20250155809A1

    公开(公告)日:2025-05-15

    申请号:US18389267

    申请日:2023-11-14

    Abstract: A photoresist composition comprises an acid-cleavable copolymer formed from oligomers in a backbone or an arm of the copolymer. Each oligomer comprises an acid-labile group; a first comonomer having an acidic leaving substituent; and at least one of a second comonomer having a proton donating substituent or a third comonomer having a polar substituent. The copolymer may also include a RAFT (Reversible Addition Fragmentation chain Transfer) chain transfer agent. Upon exposure to radiation, acid is generated that cleaves the copolymer. This improves the line edge roughness (LER) of the photoresist layer while maintaining good coating properties.

    ADDITIVES FOR METALLIC PHOTORESIST
    159.
    发明申请

    公开(公告)号:US20250138417A1

    公开(公告)日:2025-05-01

    申请号:US18385563

    申请日:2023-10-31

    Abstract: Methods and materials for improving the hardness of a metallic photoresist used in EUV photolithography are disclosed. Multiple different additive types are described for use with the metallic photoresist. The additives can be applied to the photoresist as part of existing solutions, or applied as an ingredient in a treatment solution during various steps for applying, patterning, and developing the metallic photoresist. The resulting photoresist layer has increased hardness and higher EUV light sensitivity, which permits a reduced radiation dosage.

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