Abstract:
In a method of manufacturing a backlight assembly, a light reflective and heat-radiating sheet including a light reflective sheet layer to reflect light and a heat-radiating sheet layer are prepared. The heat-radiating sheet layer includes a coupling layer integrally formed with a surface of the light reflective sheet layer and heat-diffusing particles are dispersed in the coupling layer to diffuse heat provided from the exterior. The light reflective and heat-radiating sheet is disposed so that the coupling layer is adhered to a bottom plate of a receiving container. Thus, impurities may be prevented and/or reduced, and assembling efficiency may be improved.
Abstract:
A method of manufacturing a semiconductor device may involve providing a first insulation pattern on a substrate including first and second regions. The first insulation pattern may include a first contact hole for exposing the first region. A spacer may be provided on a sidewall of the first insulation pattern. A conductive pattern may be provided in the first contact hole such that a top surface of the conductive pattern is lower than a top surface of the first insulation pattern. A second insulation pattern may be provided on the conductive pattern. The first insulation pattern may be etched using the second insulation pattern and the spacer as a self-aligning mask to form a second contact hole for exposing the second region. A wiring may be provided in the second contact hole.
Abstract:
Disclosed is a gun type continuous clip ejecting apparatus. The gun type continuous clip ejecting apparatus includes a body including bodies symmetrically combined by each other with a curved shape and a clip guide groove therein; a cover inserted into the upper front end of the body; a slider installed slidably along a guide groove formed within the body; a clip loading push rod in which protrusions are formed at an end thereof and hooked to the hook of the slider, a hook is protruded upwardly at the other end thereof and protrusions are protruded at sides thereof; a tension spring in which an end thereof is hooked the hook of the clip loading push rod and the other end thereof is pulled upwardly and fixed to the upper inside surface of the slider; a discharge push rod; a tension spring; and a trigger rotatably fixed to a bottom side of the body by a hinge shaft and including upper hooking protrusions contacted with a bottom end between both sides of the discharge push rod.
Abstract:
One embodiment generally described herein can be characterized as a semiconductor device. The semiconductor device can include a first transistor on a semiconductor substrate. A first interlayer insulating layer may be disposed over the first transistor and includes a first recess region. A single-crystalline semiconductor pattern may be disposed in the first recess region. A single-crystalline semiconductor plug may connect the semiconductor substrate to the single-crystalline semiconductor pattern. A second transistor may be disposed on the single-crystalline semiconductor pattern.
Abstract:
Example embodiments of the present invention relate to a method of forming a metal wiring in a semiconductor device. Other example embodiments of the present invention relate to a method of forming a metal wiring in a semiconductor device without a generation of a bridge between adjacent metal wirings. In a method of forming a metal wiring in a semiconductor device, at least one metal layer and at least one barrier layer may be sequentially formed on a substrate. A metal blocking layer may be formed on the at least one barrier metal layer. A hard mask layer may be formed on the metal blocking layer. A hard mask pattern may be formed on the metal blocking layer by etching the hard mask layer without an exposure of the at least one barrier metal layer. A metal blocking layer pattern may be formed on the at least one barrier metal layer by etching the metal blocking layer using the hard mask pattern as an etching mask. The metal wiring having at least one metal layer pattern and at least one barrier metal layer pattern may be formed on the substrate by etching the at least one barrier metal layer and the at least one metal layer using the hard mask pattern as an etching mask. The metal wiring having a reduced width may be obtained without a failure (e.g., a bridge).
Abstract:
The present invention relates to a lamp supporter having a shock absorbing structure capable of attenuating a shock transferred to a lamp and a liquid crystal display having the same. The lamp supporter includes a base plate having a concavo-convex portion formed in at least a partial region of the base plate, a lamp fixing unit formed on a surface of the base plate and fixing a lamp and an optical member supporting unit formed on the surface of the base plate to support an optical member. The concavo-convex portion includes a predetermined form.
Abstract:
Disclosed is a liquid crystal display device including a first substrate, a second substrate, and a liquid crystal layer interposed there between. The first substrate is provided with gate lines and data lines thereon. The gate lines and data lines cross with each other and are insulated from each other. Pixel electrodes are stacked on the gate lines and data lines. Each pixel electrode includes first and second sub-pixel electrodes spaced apart from each other and a connection electrode, which connects the first sub-pixel electrode to the second sub-pixel electrode. The second substrate is provided with a common electrode thereon. The common electrode includes a first domain divider formed on the center of the first sub-pixel electrode and a second domain divider formed on the center of the second sub-pixel electrode.
Abstract:
An organic light-emitting diode (OLED) display device includes a display panel having an OLED element, a receiving container to receive the display panel, a driving circuit part that is disposed under the receiving container and drives the display panel, and a heat insulating member that is disposed between the display panel and the receiving container, and comprises a porous polymer. Deterioration of the light-emitting layer may be prevented and/or reduced to increase durability of the OLED display device.
Abstract:
The structure of the present invention comprises a semiconductor substrate and a trench region formed on the semiconductor substrate. The trench region includes an extended funnel portion in the vicinity of the semiconductor substrate surface. A device isolation layer is formed at the trench region. The device isolation layer includes a void formed at a lower level than the funnel portion. The sidewalls of the hard mask pattern and the internal walls of the trench region are etched to form a funnel portion with an extended trench region at the vicinity of the semiconductor substrate surface. Accordingly, the void in the trench region does not extend above a surface of the semiconductor substrate.
Abstract:
An electric oven is provided. The electric oven includes a chamber, a heater that heats air in the chamber and a flow guide defining a cooking space for food therein. The flow guide uniformly transfers heated air in the chamber to the food in the cooking space. The flow guide includes a body for covering the food and an exhaust for exhausting air that flows into the body.