公开(公告)号：US20190240985A1

公开(公告)日：2019-08-08

申请号：US16317362

申请日：2016-10-07

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Ning Ge ,  Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/175 ,  B41J2/195 ,  G01F23/24

CPC classification number: B41J2/17566 ,  B41J2/195 ,  B41J2002/17579 ,  G01F23/0061 ,  G01F23/242 ,  G01F23/243

Abstract: A fluid reservoir (101) includes a number of electrode pairs disposed within the fluid reservoir. Each of the electrode pairs includes a number of sensing electrodes (103), and a number of electrical traces (105) wherein the sensing electrodes are coupled to a respective one of the electrical traces. The fluid reservoir also includes a common electrode (104) electrically coupled to a voltage source (106). A number of properties of a fluid (110) within the fluid reservoir are detected by applying a voltage between the sensing electrodes in an electrode pair, and a level of the fluid within the fluid reservoir is detected by applying a voltage between the electrodes and the common electrode. A multiplexer (102) may be used to selectively couple the sensing electrodes (103) to a processing device (108). The fluid reservoir may be a printing fluid container.

公开(公告)号：US10300691B2

公开(公告)日：2019-05-28

申请号：US16024302

申请日：2018-06-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Peter James Fricke ,  Michael W. Cumbie ,  Scott A. Linn

IPC: B41J2/045

Abstract: A wide array printhead module includes a plurality of printhead die, each of the printhead die includes a number of nozzles. The nozzles form a number of primitives. A nozzle firing heater is coupled to each of the nozzles. An application specific integrated circuit (ASIC) controls a number of activation pluses that activate the nozzle firing heaters for each of the nozzles associated with the primitives. The activation pulses are delayed between each of the primitives via internal delays and external delays to reduce peak power demands of the printhead die. The ASIC determines the internal delays within each printhead die.

公开(公告)号：US20190145898A1

公开(公告)日：2019-05-16

申请号：US16098096

申请日：2016-07-22

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Devin A. Mourey

IPC: G01N21/65 ,  G01J3/44

Abstract: A housing may include sidewalls and a base extending between and supported by the sidewalls. The base and the sidewalls form a cavity. The housing support they substrate. The substrate supports a surface enhanced luminescence stage between the substrate and the base.

公开(公告)号：US20190144268A1

公开(公告)日：2019-05-16

申请号：US16098991

申请日：2016-07-26

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Devin Alexander Mourey ,  Michael W. Cumbie ,  Si-lam Choy

IPC: B81B7/00 ,  B01L3/00

Abstract: A device includes: a die including a microfluidic device; a polymer substrate formed around the die; and a separate fluid manifold attached to the polymer substrate over the die and on a same side of the substrate as the die, the manifold to deliver fluid to the die.

公开(公告)号：US20190143688A1

公开(公告)日：2019-05-16

申请号：US16244663

申请日：2019-01-10

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Michael W. Cumbie ,  Devin Alexander Mourey ,  Chien-Hua Chen

IPC: B41J2/14 ,  B41J2/175 ,  B41J2/315 ,  B41J2/16 ,  B41J2/135

Abstract: In example implementations, an apparatus with an interposer is provided. The apparatus may include an epoxy molded compound (EMC). A print head die and a drive integrated circuit (IC) may be embedded in the EMC. An interposer may also be embedded in the EMC. The print head die, the drive IC and the interposer may be wire bonded within the EMC.

公开(公告)号：US20190118527A1

公开(公告)日：2019-04-25

申请号：US16094448

申请日：2016-07-11

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Daryl E. Anderson ,  James Michael Gardner ,  Michael W. Cumbie ,  Scott A. Linn ,  Berkeley Fisher

IPC: B41F31/02 ,  B41L27/04 ,  B41L39/02 ,  G01F23/24 ,  G01F23/26

Abstract: A method of detecting a level of printable fluid in a container includes, with at least one sensing location on a die in thermal contact with the printable fluid in the container, sensing a voltage of a capacitor over time as current from the capacitor leaks through a field effect transistor (FET). The FET and capacitor are associated with the sensing location. The method may further include, based on the voltage of the capacitor over time and a threshold voltage, determining whether the printable fluid is present at the at least one sensing location.

公开(公告)号：US10232620B2

公开(公告)日：2019-03-19

申请号：US15747639

申请日：2015-10-13

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Michael W. Cumbie ,  Silam J. Choy ,  Chien-Hua Chen ,  Devin Alexander Mourey

IPC: B41J2/145 ,  B41J2/155 ,  B41J2/14 ,  B41J2/16 ,  B41J2/21

Abstract: A printhead may include a number of s-shaped dies embedded in a moldable substrate. An medium-wide array may include a number of printheads with each printhead including a number of s-shaped dies and an ejection fluid feed slot to provide a single type of ejection fluid to the s-shaped dies. An s-shaped die of a printhead may include a number of columns of nozzles and an electrical interconnect coupled to a number of firing chambers associated with each of the nozzles, the electrical interconnect positioned adjacent to the number of columns.

公开(公告)号：US10232618B2

公开(公告)日：2019-03-19

申请号：US15865864

申请日：2018-01-09

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Diane R. Hammerstad

IPC: B41J2/14

Abstract: In one example, a fluid flow structure includes a fluid dispensing micro device embedded in a molding having a channel therein through which fluid may flow directly to the device. The device contains multiple fluid ejectors and multiple fluid chambers each near an ejector. Each chamber has an inlet through which fluid from the channel may enter the chamber and an outlet through which fluid may be ejected from the chamber. A perimeter of the channel surrounds the inlets but is otherwise unconstrained in size by the size of the device.

公开(公告)号：US10189265B2

公开(公告)日：2019-01-29

申请号：US15670528

申请日：2017-08-07

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/14 ,  B41J2/175 ,  B41J2/16 ,  B41J2/155

Abstract: In some examples, printing fluid cartridge comprises a housing and an assembly supported by the housing. The assembly comprises a molding and a non-fluid dispensing die electronic device embedded in the molding.

公开(公告)号：US20180354268A1

公开(公告)日：2018-12-13

申请号：US15761602

申请日：2015-11-02

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Devin A. Mourey

IPC: B41J2/16 ,  B41J2/155

CPC classification number: B41J2/1637 ,  B41J2/155 ,  B41J2/16 ,  B41J2/1623 ,  B41J2/1632 ,  B41J2/1635 ,  B41J2002/14491 ,  B41J2202/20

Abstract: Examples include a plastic-based support substrate and at least one fluid ejection die coupled thereto. The at least one fluid ejection die comprises a nozzles for dispensing printing material. The plastic-based support substrate has a fluid communication channel formed therethrough, where the fluid communication channel is in fluid communication with the nozzles of the at least one fluid ejection die.